Patent
US 9,573,814HIGH-THROUGHPUT GRAPHENE PRINTING AND SELECTIVE TRANSFER USING A LOCALIZED LASER HEATING TECHNIQUE
Vikram Patil
US
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US 9,573,814Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic diagram of a system for implementing an exemplary method for printing graphene patterns on substrates using a laser beam as a localized …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Cancel Claim 1. canceled
A method for selective transfer of graphene onto a substrate, comprising the steps of: providing a thermal release tape having graphene adhered thereto; placing a substrate against the graphene such that the graphene is positioned between the thermal release tape and the substrate; pressing the graphene against the substrate; heating a first localized portion of the thermal release tape using a localized heat source, thereby diminishing the adhesive properties of the thermal release tape at the first localized portion such that graphene from the localized portion is transferable to the substrate; and The method of Claim 1, including the further step of moving the localized heat source from one of the localized portions the first localized portion of the thermal release tape to another of the localized portions a second localized portion of the thermal release tape during said heating step, thereby forming a pattern of localized portions.
Cancel Claim 4. NJ 229930448 v1 canceled
Embodiments described in the patent, grouped by the materials and process steps they use.
2 materials2 process steps
Large-area graphene is fabricated on copper foil via CVD. A Cu scroll is placed in a 2-inch diameter quartz tube in a horizontal 3-zone tube furnace and heated to 1000°C under H₂ and Ar flow. Reaction gas mixtures of CH₄ at 50 sccm, H₂ at 15 sccm, and Ar at 1000 sccm are fed through the quartz tube. The Cu scroll is then rapidly cooled to room temperature under H₂ and Ar flow, resulting in large-area graphene layers grown on both sides of the Cu scroll.
Materials described outside the worked examples.
thermal release tape
polyethylene terephthalate (PET) polymer film
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal release tape adhesive loss temperature | 80 °C | thermal release tape |
target localized heating temperature for graphene transfer | 150 °C |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,573,814Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic diagram of a system for implementing an exemplary method for printing graphene patterns on substrates using a laser beam as a localized …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Cancel Claim 1. canceled
A method for selective transfer of graphene onto a substrate, comprising the steps of: providing a thermal release tape having graphene adhered thereto; placing a substrate against the graphene such that the graphene is positioned between the thermal release tape and the substrate; pressing the graphene against the substrate; heating a first localized portion of the thermal release tape using a localized heat source, thereby diminishing the adhesive properties of the thermal release tape at the first localized portion such that graphene from the localized portion is transferable to the substrate; and The method of Claim 1, including the further step of moving the localized heat source from one of the localized portions the first localized portion of the thermal release tape to another of the localized portions a second localized portion of the thermal release tape during said heating step, thereby forming a pattern of localized portions.
Cancel Claim 4. NJ 229930448 v1 canceled
Embodiments described in the patent, grouped by the materials and process steps they use.
2 materials2 process steps
Large-area graphene is fabricated on copper foil via CVD. A Cu scroll is placed in a 2-inch diameter quartz tube in a horizontal 3-zone tube furnace and heated to 1000°C under H₂ and Ar flow. Reaction gas mixtures of CH₄ at 50 sccm, H₂ at 15 sccm, and Ar at 1000 sccm are fed through the quartz tube. The Cu scroll is then rapidly cooled to room temperature under H₂ and Ar flow, resulting in large-area graphene layers grown on both sides of the Cu scroll.
Materials described outside the worked examples.
thermal release tape
polyethylene terephthalate (PET) polymer film
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal release tape adhesive loss temperature | 80 °C | thermal release tape |
target localized heating temperature for graphene transfer | 150 °C |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,573,814Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic diagram of a system for implementing an exemplary method for printing graphene patterns on substrates using a laser beam as a localized …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Cancel Claim 1. canceled
A method for selective transfer of graphene onto a substrate, comprising the steps of: providing a thermal release tape having graphene adhered thereto; placing a substrate against the graphene such that the graphene is positioned between the thermal release tape and the substrate; pressing the graphene against the substrate; heating a first localized portion of the thermal release tape using a localized heat source, thereby diminishing the adhesive properties of the thermal release tape at the first localized portion such that graphene from the localized portion is transferable to the substrate; and The method of Claim 1, including the further step of moving the localized heat source from one of the localized portions the first localized portion of the thermal release tape to another of the localized portions a second localized portion of the thermal release tape during said heating step, thereby forming a pattern of localized portions.
Cancel Claim 4. NJ 229930448 v1 canceled
Embodiments described in the patent, grouped by the materials and process steps they use.
2 materials2 process steps
Large-area graphene is fabricated on copper foil via CVD. A Cu scroll is placed in a 2-inch diameter quartz tube in a horizontal 3-zone tube furnace and heated to 1000°C under H₂ and Ar flow. Reaction gas mixtures of CH₄ at 50 sccm, H₂ at 15 sccm, and Ar at 1000 sccm are fed through the quartz tube. The Cu scroll is then rapidly cooled to room temperature under H₂ and Ar flow, resulting in large-area graphene layers grown on both sides of the Cu scroll.
Materials described outside the worked examples.
thermal release tape
polyethylene terephthalate (PET) polymer film
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal release tape adhesive loss temperature | 80 °C | thermal release tape |
target localized heating temperature for graphene transfer | 150 °C |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,573,814Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic diagram of a system for implementing an exemplary method for printing graphene patterns on substrates using a laser beam as a localized …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Cancel Claim 1. canceled
A method for selective transfer of graphene onto a substrate, comprising the steps of: providing a thermal release tape having graphene adhered thereto; placing a substrate against the graphene such that the graphene is positioned between the thermal release tape and the substrate; pressing the graphene against the substrate; heating a first localized portion of the thermal release tape using a localized heat source, thereby diminishing the adhesive properties of the thermal release tape at the first localized portion such that graphene from the localized portion is transferable to the substrate; and The method of Claim 1, including the further step of moving the localized heat source from one of the localized portions the first localized portion of the thermal release tape to another of the localized portions a second localized portion of the thermal release tape during said heating step, thereby forming a pattern of localized portions.
Cancel Claim 4. NJ 229930448 v1 canceled
Embodiments described in the patent, grouped by the materials and process steps they use.
2 materials2 process steps
Large-area graphene is fabricated on copper foil via CVD. A Cu scroll is placed in a 2-inch diameter quartz tube in a horizontal 3-zone tube furnace and heated to 1000°C under H₂ and Ar flow. Reaction gas mixtures of CH₄ at 50 sccm, H₂ at 15 sccm, and Ar at 1000 sccm are fed through the quartz tube. The Cu scroll is then rapidly cooled to room temperature under H₂ and Ar flow, resulting in large-area graphene layers grown on both sides of the Cu scroll.
Materials described outside the worked examples.
thermal release tape
polyethylene terephthalate (PET) polymer film
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal release tape adhesive loss temperature | 80 °C | thermal release tape |
target localized heating temperature for graphene transfer | 150 °C |
Related documents with shared materials, methods, properties, or citations.
thermal release tape |
tape and substrate advance speed during printing | 150–200 mm/min | Cthermal release tape |
Thickness | 150–200 mm | — |
thermal release tape |
tape and substrate advance speed during printing | 150–200 mm/min | Cthermal release tape |
Thickness | 150–200 mm | — |
thermal release tape |
tape and substrate advance speed during printing | 150–200 mm/min | Cthermal release tape |
Thickness | 150–200 mm | — |
thermal release tape |
tape and substrate advance speed during printing | 150–200 mm/min | Cthermal release tape |
Thickness | 150–200 mm | — |