Patent
US 9,067,795polymer layer
copper
Cu
nickel
Ni
carbon source gas
hydrogen gas
H₂
polystyrene
polyethylene
polycarbonate
polymethyl methacrylate (PMMA)
terephthalate (PET)
benzo cyclo butene (BCB)
polyalkenamer
sacrifice layer
polymethyl methacrylate
ethoxyline resin
unsaturated polyester
silicon ether resin
oxygen
O₂
chlorine gas
Cl₂
methane
CH₄
| <5.57e-4 J/cm2·K |
C |
graphene film thickness range | 0.34–10 nm | C |
electron mobility of graphene at room temperature (background) | 15000 cm2/V·s | C |
thermal conductivity of graphene (background) | 3000 W/m·K | C |
Thickness | 100–100000 nm | — |
Duration | 20–60 minutes | — |
Pressure | 0.1–100 Pa | — |
Duration | 10–60 minutes | — |
Pressure | 2–10 Pa | — |
Duration | 4–15 minutes | — |
Pressure | 0.1 Pa | — |
Pressure | ≥ 1 Pa | — |
Temperature | 800–1500 °C | — |
polymer layer
copper
Cu
nickel
Ni
carbon source gas
hydrogen gas
H₂
polystyrene
polyethylene
polycarbonate
polymethyl methacrylate (PMMA)
terephthalate (PET)
benzo cyclo butene (BCB)
polyalkenamer
sacrifice layer
polymethyl methacrylate
ethoxyline resin
unsaturated polyester
silicon ether resin
oxygen
O₂
chlorine gas
Cl₂
methane
CH₄
| <5.57e-4 J/cm2·K |
C |
graphene film thickness range | 0.34–10 nm | C |
electron mobility of graphene at room temperature (background) | 15000 cm2/V·s | C |
thermal conductivity of graphene (background) | 3000 W/m·K | C |
Thickness | 100–100000 nm | — |
Duration | 20–60 minutes | — |
Pressure | 0.1–100 Pa | — |
Duration | 10–60 minutes | — |
Pressure | 2–10 Pa | — |
Duration | 4–15 minutes | — |
Pressure | 0.1 Pa | — |
Pressure | ≥ 1 Pa | — |
Temperature | 800–1500 °C | — |
polymer layer
copper
Cu
nickel
Ni
carbon source gas
hydrogen gas
H₂
polystyrene
polyethylene
polycarbonate
polymethyl methacrylate (PMMA)
terephthalate (PET)
benzo cyclo butene (BCB)
polyalkenamer
sacrifice layer
polymethyl methacrylate
ethoxyline resin
unsaturated polyester
silicon ether resin
oxygen
O₂
chlorine gas
Cl₂
methane
CH₄
| <5.57e-4 J/cm2·K |
C |
graphene film thickness range | 0.34–10 nm | C |
electron mobility of graphene at room temperature (background) | 15000 cm2/V·s | C |
thermal conductivity of graphene (background) | 3000 W/m·K | C |
Thickness | 100–100000 nm | — |
Duration | 20–60 minutes | — |
Pressure | 0.1–100 Pa | — |
Duration | 10–60 minutes | — |
Pressure | 2–10 Pa | — |
Duration | 4–15 minutes | — |
Pressure | 0.1 Pa | — |
Pressure | ≥ 1 Pa | — |
Temperature | 800–1500 °C | — |
polymer layer
copper
Cu
nickel
Ni
carbon source gas
hydrogen gas
H₂
polystyrene
polyethylene
polycarbonate
polymethyl methacrylate (PMMA)
terephthalate (PET)
benzo cyclo butene (BCB)
polyalkenamer
sacrifice layer
polymethyl methacrylate
ethoxyline resin
unsaturated polyester
silicon ether resin
oxygen
O₂
chlorine gas
Cl₂
methane
CH₄
| <5.57e-4 J/cm2·K |
C |
graphene film thickness range | 0.34–10 nm | C |
electron mobility of graphene at room temperature (background) | 15000 cm2/V·s | C |
thermal conductivity of graphene (background) | 3000 W/m·K | C |
Thickness | 100–100000 nm | — |
Duration | 20–60 minutes | — |
Pressure | 0.1–100 Pa | — |
Duration | 10–60 minutes | — |
Pressure | 2–10 Pa | — |
Duration | 4–15 minutes | — |
Pressure | 0.1 Pa | — |
Pressure | ≥ 1 Pa | — |
Temperature | 800–1500 °C | — |