Patent
US 10,273,574graphene
copper
Cu
carbon source gas
metal foil
metal film
nickel
Ni
ruthenium
Ru
rhodium
Rh
aluminum
Al
Si/SiO₂ second substrate
inert gas atmosphere
metal film thickness | 100–1000 | metal film |
metal film thickness (most preferred) | 300–500 | metal film |
molten metal layer thickness (claimed) | 200–800 | molten metal layer |
top surface heating temperature (claimed) | 1020–1080 | metal substrate |
bottom surface heating temperature upper limit (claimed) | ≤ 1050 | metal substrate |
Thickness | 100–1000 nm | — |
Thickness | 100–800 nm | — |
Thickness | 200–600 nm | — |
Thickness | 300–500 nm | — |
Thickness | 200–800 nm | — |
Thickness | 300–700 nm | — |
Thickness | 450–550 nm | — |
Pressure | 1e-8 atm | — |
Temperature | ≤ 10 °C | — |
Temperature | ≥ 10 °C | — |
Temperature | ≤ 1e+50 °C | — |
graphene
copper
Cu
carbon source gas
metal foil
metal film
nickel
Ni
ruthenium
Ru
rhodium
Rh
aluminum
Al
Si/SiO₂ second substrate
inert gas atmosphere
metal film thickness | 100–1000 | metal film |
metal film thickness (most preferred) | 300–500 | metal film |
molten metal layer thickness (claimed) | 200–800 | molten metal layer |
top surface heating temperature (claimed) | 1020–1080 | metal substrate |
bottom surface heating temperature upper limit (claimed) | ≤ 1050 | metal substrate |
Thickness | 100–1000 nm | — |
Thickness | 100–800 nm | — |
Thickness | 200–600 nm | — |
Thickness | 300–500 nm | — |
Thickness | 200–800 nm | — |
Thickness | 300–700 nm | — |
Thickness | 450–550 nm | — |
Pressure | 1e-8 atm | — |
Temperature | ≤ 10 °C | — |
Temperature | ≥ 10 °C | — |
Temperature | ≤ 1e+50 °C | — |
graphene
copper
Cu
carbon source gas
metal foil
metal film
nickel
Ni
ruthenium
Ru
rhodium
Rh
aluminum
Al
Si/SiO₂ second substrate
inert gas atmosphere
metal film thickness | 100–1000 | metal film |
metal film thickness (most preferred) | 300–500 | metal film |
molten metal layer thickness (claimed) | 200–800 | molten metal layer |
top surface heating temperature (claimed) | 1020–1080 | metal substrate |
bottom surface heating temperature upper limit (claimed) | ≤ 1050 | metal substrate |
Thickness | 100–1000 nm | — |
Thickness | 100–800 nm | — |
Thickness | 200–600 nm | — |
Thickness | 300–500 nm | — |
Thickness | 200–800 nm | — |
Thickness | 300–700 nm | — |
Thickness | 450–550 nm | — |
Pressure | 1e-8 atm | — |
Temperature | ≤ 10 °C | — |
Temperature | ≥ 10 °C | — |
Temperature | ≤ 1e+50 °C | — |
graphene
copper
Cu
carbon source gas
metal foil
metal film
nickel
Ni
ruthenium
Ru
rhodium
Rh
aluminum
Al
Si/SiO₂ second substrate
inert gas atmosphere
metal film thickness | 100–1000 | metal film |
metal film thickness (most preferred) | 300–500 | metal film |
molten metal layer thickness (claimed) | 200–800 | molten metal layer |
top surface heating temperature (claimed) | 1020–1080 | metal substrate |
bottom surface heating temperature upper limit (claimed) | ≤ 1050 | metal substrate |
Thickness | 100–1000 nm | — |
Thickness | 100–800 nm | — |
Thickness | 200–600 nm | — |
Thickness | 300–500 nm | — |
Thickness | 200–800 nm | — |
Thickness | 300–700 nm | — |
Thickness | 450–550 nm | — |
Pressure | 1e-8 atm | — |
Temperature | ≤ 10 °C | — |
Temperature | ≥ 10 °C | — |
Temperature | ≤ 1e+50 °C | — |