Research paper
Experimental CharacterizationComputational Kinetic Model| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Surface Roughness Rms | RMS roughness | 0.16nm | — | |||
| Surface Roughness Rms | RMS roughness | 0.37nm | — | |||
| Film Thickness | GaN template thickness | 4um | — | |||
| Film Thickness | GaN buffer layer thickness | 0.1um | — | |||
| Film Thickness | Ti backside coating thickness | 1um | — | |||
| Activation Energy | Ga adlayer desorption activation energy (weighted mean) | 2.87eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (RHEED) | 2.82eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (LR) | 2.87eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (QMS) | 2.91eV | — |
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Surface Roughness Rms | RMS roughness | 0.16nm | — | |||
| Surface Roughness Rms | RMS roughness | 0.37nm | — | |||
| Film Thickness | GaN template thickness | 4um | — | |||
| Film Thickness | GaN buffer layer thickness | 0.1um | — | |||
| Film Thickness | Ti backside coating thickness | 1um | — | |||
| Activation Energy | Ga adlayer desorption activation energy (weighted mean) | 2.87eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (RHEED) | 2.82eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (LR) | 2.87eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (QMS) | 2.91eV | — |
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Surface Roughness Rms | RMS roughness | 0.16nm | — | |||
| Surface Roughness Rms | RMS roughness | 0.37nm | — | |||
| Film Thickness | GaN template thickness | 4um | — | |||
| Film Thickness | GaN buffer layer thickness | 0.1um | — | |||
| Film Thickness | Ti backside coating thickness | 1um | — | |||
| Activation Energy | Ga adlayer desorption activation energy (weighted mean) | 2.87eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (RHEED) | 2.82eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (LR) | 2.87eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (QMS) | 2.91eV | — |
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Surface Roughness Rms | RMS roughness | 0.16nm | — | |||
| Surface Roughness Rms | RMS roughness | 0.37nm | — | |||
| Film Thickness | GaN template thickness | 4um | — | |||
| Film Thickness | GaN buffer layer thickness | 0.1um | — | |||
| Film Thickness | Ti backside coating thickness | 1um | — | |||
| Activation Energy | Ga adlayer desorption activation energy (weighted mean) | 2.87eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (RHEED) | 2.82eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (LR) | 2.87eV | — | |||
| Activation Energy | Ga adlayer desorption activation energy (QMS) | 2.91eV | — |