Patent
US 10,737,476METHODS FOR TRANSFERRING GRAPHENE FILMS AND SUBSTRATES COMPRISING GRAPHENE FILMS
Benedict Yorke JOHNSON, Xinyuan LIU, Prantik MAZUMDER
CORNING INCORPORATED·9 March 2017·US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 10,737,476Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 depicts an exemplary transfer substrate comprising a graphene film; [0016]
FIG. 2C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a method according to …
FIG. 3C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a TRT transfer method; [0022]
FIG. 4C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a PMMA transfer method.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a graphene film onto a substrate, the method comprising: (a) applying a polymer layer to a first surface of a graphene film, wherein a second surface of the graphene film is in contact with a growth substrate; (b) thermally treatin q the polymer la yer: (c) applying a thermal release polymer layer to the thermally treated polymer layer; {c (d) removing the growth substrate to form a transfer substrate comprising an exposed graphene surface; and (e) contacting the exposed graphene surface with a target substrate. Currently amended
The method of claim 1, wherein the growth substrate is a metal substrate. Original
The method of claim 1, further comprising depositing the graphene film on the growth substrate by chemical vapor deposition or plasma-enhanced chemical vapor deposition. Previously presented
The method of claim 1, wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate. Previously presented
The method of claim 1, wherein applying the polymer layer comprises dip coating, spin coating, or spray coating the polymer onto the graphene film. Previously presented
The method of claim 1, wherein thermally treatin q the polymer comprises heating the polymer layer to a temperature ranging from about 80 0 C to about 1 50 0 C for a period of time ranging from about 1 minute to about 60 minutes. Currently amended
The method of claim 1, wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane. Previously presented
The method of claim 1, wherein applying the thermal release polymer layer comprises pressing, roll-to-roll transfer, or lamination. Previously presented
The method of claim 1, wherein removing the growth substrate comprises exposing the growth substrate to an etchant at a temperature ranging from about 25 0 C to about 60 0 C for a time period ranging from about 30 minutes to about 12 hours. Previously presented
The method of claim 1, wherein the target substrate comprises glass. Previously presented
The method of claim 1, further comprising removing the thermal release polymer by heating to a temperature ranging from about 100 o C to about 200 0 C and peeling away the thermal release polymer. Previously presented
. Canceled
. Canceled
A transfer substrate comprising a graphene film, a thermal release polymer layer, and a polymer layer disposed therebetween, wherein the polymer layer has a thickness ran ging from 50 nm to 200 nm. Currently amended
The transfer substrate according to claim 16, wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane. Previously presented
The transfer substrate of claim 16, wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate. Previously presented
The transfer substrate of claim 16, wherein the thermal release polymer has a thickness ranging from about 100 nm to about 1 mm. Currently amended
The transfer substrate of claim 16, wherein the graphene film has a thickness ranging from about 0.3 nm to about 200 nm. Previously presented
The transfer substrate of claim 16, wherein the graphene film is substantially transparent. Previously presented
The transfer substrate of claim 16, wherein the graphene film has a sheet resistance of less than about 3 K Q/sq. Previously presented
. Canceled
. Canceled
Layer stacks claimed or described, ordered top of device to substrate.
transfer substrate
Materials described outside the worked examples.
graphene film
polymer layer
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 2C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a method according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
transmittance in visible light spectrum (400-700 nm) | ≥ 80 % | graphene film |
sheet resistance of graphene film |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,737,476Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 depicts an exemplary transfer substrate comprising a graphene film; [0016]
FIG. 2C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a method according to …
FIG. 3C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a TRT transfer method; [0022]
FIG. 4C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a PMMA transfer method.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a graphene film onto a substrate, the method comprising: (a) applying a polymer layer to a first surface of a graphene film, wherein a second surface of the graphene film is in contact with a growth substrate; (b) thermally treatin q the polymer la yer: (c) applying a thermal release polymer layer to the thermally treated polymer layer; {c (d) removing the growth substrate to form a transfer substrate comprising an exposed graphene surface; and (e) contacting the exposed graphene surface with a target substrate. Currently amended
The method of claim 1, wherein the growth substrate is a metal substrate. Original
The method of claim 1, further comprising depositing the graphene film on the growth substrate by chemical vapor deposition or plasma-enhanced chemical vapor deposition. Previously presented
The method of claim 1, wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate. Previously presented
The method of claim 1, wherein applying the polymer layer comprises dip coating, spin coating, or spray coating the polymer onto the graphene film. Previously presented
The method of claim 1, wherein thermally treatin q the polymer comprises heating the polymer layer to a temperature ranging from about 80 0 C to about 1 50 0 C for a period of time ranging from about 1 minute to about 60 minutes. Currently amended
The method of claim 1, wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane. Previously presented
The method of claim 1, wherein applying the thermal release polymer layer comprises pressing, roll-to-roll transfer, or lamination. Previously presented
The method of claim 1, wherein removing the growth substrate comprises exposing the growth substrate to an etchant at a temperature ranging from about 25 0 C to about 60 0 C for a time period ranging from about 30 minutes to about 12 hours. Previously presented
The method of claim 1, wherein the target substrate comprises glass. Previously presented
The method of claim 1, further comprising removing the thermal release polymer by heating to a temperature ranging from about 100 o C to about 200 0 C and peeling away the thermal release polymer. Previously presented
. Canceled
. Canceled
A transfer substrate comprising a graphene film, a thermal release polymer layer, and a polymer layer disposed therebetween, wherein the polymer layer has a thickness ran ging from 50 nm to 200 nm. Currently amended
The transfer substrate according to claim 16, wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane. Previously presented
The transfer substrate of claim 16, wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate. Previously presented
The transfer substrate of claim 16, wherein the thermal release polymer has a thickness ranging from about 100 nm to about 1 mm. Currently amended
The transfer substrate of claim 16, wherein the graphene film has a thickness ranging from about 0.3 nm to about 200 nm. Previously presented
The transfer substrate of claim 16, wherein the graphene film is substantially transparent. Previously presented
The transfer substrate of claim 16, wherein the graphene film has a sheet resistance of less than about 3 K Q/sq. Previously presented
. Canceled
. Canceled
Layer stacks claimed or described, ordered top of device to substrate.
transfer substrate
Materials described outside the worked examples.
graphene film
polymer layer
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 2C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a method according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
transmittance in visible light spectrum (400-700 nm) | ≥ 80 % | graphene film |
sheet resistance of graphene film |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,737,476Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 depicts an exemplary transfer substrate comprising a graphene film; [0016]
FIG. 2C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a method according to …
FIG. 3C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a TRT transfer method; [0022]
FIG. 4C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a PMMA transfer method.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a graphene film onto a substrate, the method comprising: (a) applying a polymer layer to a first surface of a graphene film, wherein a second surface of the graphene film is in contact with a growth substrate; (b) thermally treatin q the polymer la yer: (c) applying a thermal release polymer layer to the thermally treated polymer layer; {c (d) removing the growth substrate to form a transfer substrate comprising an exposed graphene surface; and (e) contacting the exposed graphene surface with a target substrate. Currently amended
The method of claim 1, wherein the growth substrate is a metal substrate. Original
The method of claim 1, further comprising depositing the graphene film on the growth substrate by chemical vapor deposition or plasma-enhanced chemical vapor deposition. Previously presented
The method of claim 1, wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate. Previously presented
The method of claim 1, wherein applying the polymer layer comprises dip coating, spin coating, or spray coating the polymer onto the graphene film. Previously presented
The method of claim 1, wherein thermally treatin q the polymer comprises heating the polymer layer to a temperature ranging from about 80 0 C to about 1 50 0 C for a period of time ranging from about 1 minute to about 60 minutes. Currently amended
The method of claim 1, wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane. Previously presented
The method of claim 1, wherein applying the thermal release polymer layer comprises pressing, roll-to-roll transfer, or lamination. Previously presented
The method of claim 1, wherein removing the growth substrate comprises exposing the growth substrate to an etchant at a temperature ranging from about 25 0 C to about 60 0 C for a time period ranging from about 30 minutes to about 12 hours. Previously presented
The method of claim 1, wherein the target substrate comprises glass. Previously presented
The method of claim 1, further comprising removing the thermal release polymer by heating to a temperature ranging from about 100 o C to about 200 0 C and peeling away the thermal release polymer. Previously presented
. Canceled
. Canceled
A transfer substrate comprising a graphene film, a thermal release polymer layer, and a polymer layer disposed therebetween, wherein the polymer layer has a thickness ran ging from 50 nm to 200 nm. Currently amended
The transfer substrate according to claim 16, wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane. Previously presented
The transfer substrate of claim 16, wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate. Previously presented
The transfer substrate of claim 16, wherein the thermal release polymer has a thickness ranging from about 100 nm to about 1 mm. Currently amended
The transfer substrate of claim 16, wherein the graphene film has a thickness ranging from about 0.3 nm to about 200 nm. Previously presented
The transfer substrate of claim 16, wherein the graphene film is substantially transparent. Previously presented
The transfer substrate of claim 16, wherein the graphene film has a sheet resistance of less than about 3 K Q/sq. Previously presented
. Canceled
. Canceled
Layer stacks claimed or described, ordered top of device to substrate.
transfer substrate
Materials described outside the worked examples.
graphene film
polymer layer
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 2C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a method according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
transmittance in visible light spectrum (400-700 nm) | ≥ 80 % | graphene film |
sheet resistance of graphene film |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,737,476Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 depicts an exemplary transfer substrate comprising a graphene film; [0016]
FIG. 2C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a method according to …
FIG. 3C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a TRT transfer method; [0022]
FIG. 4C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a PMMA transfer method.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a graphene film onto a substrate, the method comprising: (a) applying a polymer layer to a first surface of a graphene film, wherein a second surface of the graphene film is in contact with a growth substrate; (b) thermally treatin q the polymer la yer: (c) applying a thermal release polymer layer to the thermally treated polymer layer; {c (d) removing the growth substrate to form a transfer substrate comprising an exposed graphene surface; and (e) contacting the exposed graphene surface with a target substrate. Currently amended
The method of claim 1, wherein the growth substrate is a metal substrate. Original
The method of claim 1, further comprising depositing the graphene film on the growth substrate by chemical vapor deposition or plasma-enhanced chemical vapor deposition. Previously presented
The method of claim 1, wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate. Previously presented
The method of claim 1, wherein applying the polymer layer comprises dip coating, spin coating, or spray coating the polymer onto the graphene film. Previously presented
The method of claim 1, wherein thermally treatin q the polymer comprises heating the polymer layer to a temperature ranging from about 80 0 C to about 1 50 0 C for a period of time ranging from about 1 minute to about 60 minutes. Currently amended
The method of claim 1, wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane. Previously presented
The method of claim 1, wherein applying the thermal release polymer layer comprises pressing, roll-to-roll transfer, or lamination. Previously presented
The method of claim 1, wherein removing the growth substrate comprises exposing the growth substrate to an etchant at a temperature ranging from about 25 0 C to about 60 0 C for a time period ranging from about 30 minutes to about 12 hours. Previously presented
The method of claim 1, wherein the target substrate comprises glass. Previously presented
The method of claim 1, further comprising removing the thermal release polymer by heating to a temperature ranging from about 100 o C to about 200 0 C and peeling away the thermal release polymer. Previously presented
. Canceled
. Canceled
A transfer substrate comprising a graphene film, a thermal release polymer layer, and a polymer layer disposed therebetween, wherein the polymer layer has a thickness ran ging from 50 nm to 200 nm. Currently amended
The transfer substrate according to claim 16, wherein the thermal release polymer layer comprises polydimethylsiloxane or polyurethane. Previously presented
The transfer substrate of claim 16, wherein the polymer layer comprises poly(methyl methacrylate), poly(lactic acid), or polycarbonate. Previously presented
The transfer substrate of claim 16, wherein the thermal release polymer has a thickness ranging from about 100 nm to about 1 mm. Currently amended
The transfer substrate of claim 16, wherein the graphene film has a thickness ranging from about 0.3 nm to about 200 nm. Previously presented
The transfer substrate of claim 16, wherein the graphene film is substantially transparent. Previously presented
The transfer substrate of claim 16, wherein the graphene film has a sheet resistance of less than about 3 K Q/sq. Previously presented
. Canceled
. Canceled
Layer stacks claimed or described, ordered top of device to substrate.
transfer substrate
Materials described outside the worked examples.
graphene film
polymer layer
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 2C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a method according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
transmittance in visible light spectrum (400-700 nm) | ≥ 80 % | graphene film |
sheet resistance of graphene film |
Related documents with shared materials, methods, properties, or citations.
thermal release polymer layer
metal substrate
poly(methyl methacrylate)
poly(lactic acid)
polycarbonate
polydimethylsiloxane
polyurethane
glass
FIG. 3C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a TRT transfer method; [0022]
FIG. 4C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a PMMA transfer method.
| ≤ 3000 Ohm/sq |
graphene film |
Temperature | 0.5–1.5 K | — |
Temperature | 1000–3000 °C | — |
Temperature | 1250–2750 °C | — |
Temperature | 1500–2500 °C | — |
Temperature | 1750–2250 °C | — |
Temperature | 500–1400 °C | — |
Temperature | 600–1300 °C | — |
Temperature | 700–1200 °C | — |
Temperature | 800–1100 °C | — |
Temperature | 900–1000 °C | — |
Flow Rate | 1–35 sccm | — |
Flow Rate | 5–30 sccm | — |
Flow Rate | 10–25 sccm | — |
Flow Rate | 15–20 sccm | — |
Flow Rate | 1–20 sccm | — |
Flow Rate | 2–18 sccm | — |
Flow Rate | 3–15 sccm | — |
Flow Rate | 4–12 sccm | — |
Flow Rate | 5–10 sccm | — |
Flow Rate | 6–8 sccm | — |
— | 50–200 W | — |
— | 75–175 W | — |
— | 100–150 W | — |
Duration | 1–30 minutes | — |
Duration | 2–20 minutes | — |
Duration | 3–15 minutes | — |
Duration | 4–12 minutes | — |
Duration | 5–10 minutes | — |
Duration | 6–8 minutes | — |
Thickness | 0.3–10 nm | — |
Thickness | 0.35–9 nm | — |
Thickness | 0.4–8 nm | — |
Thickness | 0.7–7 nm | — |
Thickness | 1–6 nm | — |
Thickness | 2–5 nm | — |
Thickness | 3–4 nm | — |
Thickness | 0.3–200 nm | — |
Thickness | 0.7–175 nm | — |
Thickness | 1–150 nm | — |
Thickness | 2–125 nm | — |
Thickness | 3–100 nm | — |
Thickness | 4–75 nm | — |
Thickness | 5–50 nm | — |
Thickness | 6–25 nm | — |
Thickness | 7–10 nm | — |
Thickness | 8–10 nm | — |
Temperature | 80–150 °C | — |
Temperature | 90–140 °C | — |
Temperature | 100–130 °C | — |
Temperature | 110–120 °C | — |
Duration | 1–60 minutes | — |
Duration | 2–50 minutes | — |
Duration | 3–45 minutes | — |
Duration | 4–30 minutes | — |
Duration | 5–20 minutes | — |
Duration | 10–15 minutes | — |
Temperature | 25–60 °C | — |
Temperature | 30–50 °C | — |
Temperature | 35–40 °C | — |
Duration | 1800–43200 s | — |
Duration | 1–10 hours | — |
Duration | 2–8 hours | — |
Duration | 3–6 hours | — |
Duration | 4–5 hours | — |
Temperature | 100–200 °C | — |
Temperature | 10–180 °C | — |
Temperature | 120–170 °C | — |
Temperature | 130–160 °C | — |
Temperature | 140–150 °C | — |
Duration | 900–3600 s | — |
Duration | 20–45 minutes | — |
Duration | 25–40 minutes | — |
Duration | 30–35 minutes | — |
Duration | 1–6 hours | — |
Duration | 2–5 hours | — |
Duration | 3–4 hours | — |
Temperature | 0–400 °C | — |
Temperature | 50–300 °C | — |
Temperature | 200–250 °C | — |
Duration | 1–10 minutes | — |
Duration | 2–8 minutes | — |
Duration | 3–6 minutes | — |
Duration | 4–5 minutes | — |
Temperature | 25–150 °C | — |
Temperature | 75–95 °C | — |
Thickness | 0.1–2.5 mm | — |
Thickness | 0.3–2 mm | — |
Thickness | 0.7–1.5 mm | — |
Thickness | 1–1.2 mm | — |
Thickness | 100–1000000 nm | — |
Thickness | 200–500 nm | — |
Thickness | 300–400 nm | — |
Thickness | 50–200 nm | — |
Thickness | 100–150 nm | — |
Thickness | 0.7–150 nm | — |
Thickness | 1–100 nm | — |
Thickness | 2–50 nm | — |
Thickness | 3–40 nm | — |
Thickness | 4–30 nm | — |
Thickness | 5–20 nm | — |
Thickness | 10–15 nm | — |
Flow Rate | 0–40 sccm | — |
Thickness | 400–700 nm | — |
Temperature | ≤ 2 K | — |
Temperature | ≤ 1 K | — |
Temperature | ≤ 0.25 K | — |
Temperature | ≤ 0.1 K | — |
Temperature | ≤ 3 K | — |
Duration | 15–60 minutes | — |
Thickness | 100–500 nm | — |
thermal release polymer layer
metal substrate
poly(methyl methacrylate)
poly(lactic acid)
polycarbonate
polydimethylsiloxane
polyurethane
glass
FIG. 3C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a TRT transfer method; [0022]
FIG. 4C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a PMMA transfer method.
| ≤ 3000 Ohm/sq |
graphene film |
Temperature | 0.5–1.5 K | — |
Temperature | 1000–3000 °C | — |
Temperature | 1250–2750 °C | — |
Temperature | 1500–2500 °C | — |
Temperature | 1750–2250 °C | — |
Temperature | 500–1400 °C | — |
Temperature | 600–1300 °C | — |
Temperature | 700–1200 °C | — |
Temperature | 800–1100 °C | — |
Temperature | 900–1000 °C | — |
Flow Rate | 1–35 sccm | — |
Flow Rate | 5–30 sccm | — |
Flow Rate | 10–25 sccm | — |
Flow Rate | 15–20 sccm | — |
Flow Rate | 1–20 sccm | — |
Flow Rate | 2–18 sccm | — |
Flow Rate | 3–15 sccm | — |
Flow Rate | 4–12 sccm | — |
Flow Rate | 5–10 sccm | — |
Flow Rate | 6–8 sccm | — |
— | 50–200 W | — |
— | 75–175 W | — |
— | 100–150 W | — |
Duration | 1–30 minutes | — |
Duration | 2–20 minutes | — |
Duration | 3–15 minutes | — |
Duration | 4–12 minutes | — |
Duration | 5–10 minutes | — |
Duration | 6–8 minutes | — |
Thickness | 0.3–10 nm | — |
Thickness | 0.35–9 nm | — |
Thickness | 0.4–8 nm | — |
Thickness | 0.7–7 nm | — |
Thickness | 1–6 nm | — |
Thickness | 2–5 nm | — |
Thickness | 3–4 nm | — |
Thickness | 0.3–200 nm | — |
Thickness | 0.7–175 nm | — |
Thickness | 1–150 nm | — |
Thickness | 2–125 nm | — |
Thickness | 3–100 nm | — |
Thickness | 4–75 nm | — |
Thickness | 5–50 nm | — |
Thickness | 6–25 nm | — |
Thickness | 7–10 nm | — |
Thickness | 8–10 nm | — |
Temperature | 80–150 °C | — |
Temperature | 90–140 °C | — |
Temperature | 100–130 °C | — |
Temperature | 110–120 °C | — |
Duration | 1–60 minutes | — |
Duration | 2–50 minutes | — |
Duration | 3–45 minutes | — |
Duration | 4–30 minutes | — |
Duration | 5–20 minutes | — |
Duration | 10–15 minutes | — |
Temperature | 25–60 °C | — |
Temperature | 30–50 °C | — |
Temperature | 35–40 °C | — |
Duration | 1800–43200 s | — |
Duration | 1–10 hours | — |
Duration | 2–8 hours | — |
Duration | 3–6 hours | — |
Duration | 4–5 hours | — |
Temperature | 100–200 °C | — |
Temperature | 10–180 °C | — |
Temperature | 120–170 °C | — |
Temperature | 130–160 °C | — |
Temperature | 140–150 °C | — |
Duration | 900–3600 s | — |
Duration | 20–45 minutes | — |
Duration | 25–40 minutes | — |
Duration | 30–35 minutes | — |
Duration | 1–6 hours | — |
Duration | 2–5 hours | — |
Duration | 3–4 hours | — |
Temperature | 0–400 °C | — |
Temperature | 50–300 °C | — |
Temperature | 200–250 °C | — |
Duration | 1–10 minutes | — |
Duration | 2–8 minutes | — |
Duration | 3–6 minutes | — |
Duration | 4–5 minutes | — |
Temperature | 25–150 °C | — |
Temperature | 75–95 °C | — |
Thickness | 0.1–2.5 mm | — |
Thickness | 0.3–2 mm | — |
Thickness | 0.7–1.5 mm | — |
Thickness | 1–1.2 mm | — |
Thickness | 100–1000000 nm | — |
Thickness | 200–500 nm | — |
Thickness | 300–400 nm | — |
Thickness | 50–200 nm | — |
Thickness | 100–150 nm | — |
Thickness | 0.7–150 nm | — |
Thickness | 1–100 nm | — |
Thickness | 2–50 nm | — |
Thickness | 3–40 nm | — |
Thickness | 4–30 nm | — |
Thickness | 5–20 nm | — |
Thickness | 10–15 nm | — |
Flow Rate | 0–40 sccm | — |
Thickness | 400–700 nm | — |
Temperature | ≤ 2 K | — |
Temperature | ≤ 1 K | — |
Temperature | ≤ 0.25 K | — |
Temperature | ≤ 0.1 K | — |
Temperature | ≤ 3 K | — |
Duration | 15–60 minutes | — |
Thickness | 100–500 nm | — |
thermal release polymer layer
metal substrate
poly(methyl methacrylate)
poly(lactic acid)
polycarbonate
polydimethylsiloxane
polyurethane
glass
FIG. 3C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a TRT transfer method; [0022]
FIG. 4C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a PMMA transfer method.
| ≤ 3000 Ohm/sq |
graphene film |
Temperature | 0.5–1.5 K | — |
Temperature | 1000–3000 °C | — |
Temperature | 1250–2750 °C | — |
Temperature | 1500–2500 °C | — |
Temperature | 1750–2250 °C | — |
Temperature | 500–1400 °C | — |
Temperature | 600–1300 °C | — |
Temperature | 700–1200 °C | — |
Temperature | 800–1100 °C | — |
Temperature | 900–1000 °C | — |
Flow Rate | 1–35 sccm | — |
Flow Rate | 5–30 sccm | — |
Flow Rate | 10–25 sccm | — |
Flow Rate | 15–20 sccm | — |
Flow Rate | 1–20 sccm | — |
Flow Rate | 2–18 sccm | — |
Flow Rate | 3–15 sccm | — |
Flow Rate | 4–12 sccm | — |
Flow Rate | 5–10 sccm | — |
Flow Rate | 6–8 sccm | — |
— | 50–200 W | — |
— | 75–175 W | — |
— | 100–150 W | — |
Duration | 1–30 minutes | — |
Duration | 2–20 minutes | — |
Duration | 3–15 minutes | — |
Duration | 4–12 minutes | — |
Duration | 5–10 minutes | — |
Duration | 6–8 minutes | — |
Thickness | 0.3–10 nm | — |
Thickness | 0.35–9 nm | — |
Thickness | 0.4–8 nm | — |
Thickness | 0.7–7 nm | — |
Thickness | 1–6 nm | — |
Thickness | 2–5 nm | — |
Thickness | 3–4 nm | — |
Thickness | 0.3–200 nm | — |
Thickness | 0.7–175 nm | — |
Thickness | 1–150 nm | — |
Thickness | 2–125 nm | — |
Thickness | 3–100 nm | — |
Thickness | 4–75 nm | — |
Thickness | 5–50 nm | — |
Thickness | 6–25 nm | — |
Thickness | 7–10 nm | — |
Thickness | 8–10 nm | — |
Temperature | 80–150 °C | — |
Temperature | 90–140 °C | — |
Temperature | 100–130 °C | — |
Temperature | 110–120 °C | — |
Duration | 1–60 minutes | — |
Duration | 2–50 minutes | — |
Duration | 3–45 minutes | — |
Duration | 4–30 minutes | — |
Duration | 5–20 minutes | — |
Duration | 10–15 minutes | — |
Temperature | 25–60 °C | — |
Temperature | 30–50 °C | — |
Temperature | 35–40 °C | — |
Duration | 1800–43200 s | — |
Duration | 1–10 hours | — |
Duration | 2–8 hours | — |
Duration | 3–6 hours | — |
Duration | 4–5 hours | — |
Temperature | 100–200 °C | — |
Temperature | 10–180 °C | — |
Temperature | 120–170 °C | — |
Temperature | 130–160 °C | — |
Temperature | 140–150 °C | — |
Duration | 900–3600 s | — |
Duration | 20–45 minutes | — |
Duration | 25–40 minutes | — |
Duration | 30–35 minutes | — |
Duration | 1–6 hours | — |
Duration | 2–5 hours | — |
Duration | 3–4 hours | — |
Temperature | 0–400 °C | — |
Temperature | 50–300 °C | — |
Temperature | 200–250 °C | — |
Duration | 1–10 minutes | — |
Duration | 2–8 minutes | — |
Duration | 3–6 minutes | — |
Duration | 4–5 minutes | — |
Temperature | 25–150 °C | — |
Temperature | 75–95 °C | — |
Thickness | 0.1–2.5 mm | — |
Thickness | 0.3–2 mm | — |
Thickness | 0.7–1.5 mm | — |
Thickness | 1–1.2 mm | — |
Thickness | 100–1000000 nm | — |
Thickness | 200–500 nm | — |
Thickness | 300–400 nm | — |
Thickness | 50–200 nm | — |
Thickness | 100–150 nm | — |
Thickness | 0.7–150 nm | — |
Thickness | 1–100 nm | — |
Thickness | 2–50 nm | — |
Thickness | 3–40 nm | — |
Thickness | 4–30 nm | — |
Thickness | 5–20 nm | — |
Thickness | 10–15 nm | — |
Flow Rate | 0–40 sccm | — |
Thickness | 400–700 nm | — |
Temperature | ≤ 2 K | — |
Temperature | ≤ 1 K | — |
Temperature | ≤ 0.25 K | — |
Temperature | ≤ 0.1 K | — |
Temperature | ≤ 3 K | — |
Duration | 15–60 minutes | — |
Thickness | 100–500 nm | — |
thermal release polymer layer
metal substrate
poly(methyl methacrylate)
poly(lactic acid)
polycarbonate
polydimethylsiloxane
polyurethane
glass
FIG. 3C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a TRT transfer method; [0022]
FIG. 4C is an optical transmittance spectrum of a glass substrate without a graphene film and with a graphene film transferred using a PMMA transfer method.
| ≤ 3000 Ohm/sq |
graphene film |
Temperature | 0.5–1.5 K | — |
Temperature | 1000–3000 °C | — |
Temperature | 1250–2750 °C | — |
Temperature | 1500–2500 °C | — |
Temperature | 1750–2250 °C | — |
Temperature | 500–1400 °C | — |
Temperature | 600–1300 °C | — |
Temperature | 700–1200 °C | — |
Temperature | 800–1100 °C | — |
Temperature | 900–1000 °C | — |
Flow Rate | 1–35 sccm | — |
Flow Rate | 5–30 sccm | — |
Flow Rate | 10–25 sccm | — |
Flow Rate | 15–20 sccm | — |
Flow Rate | 1–20 sccm | — |
Flow Rate | 2–18 sccm | — |
Flow Rate | 3–15 sccm | — |
Flow Rate | 4–12 sccm | — |
Flow Rate | 5–10 sccm | — |
Flow Rate | 6–8 sccm | — |
— | 50–200 W | — |
— | 75–175 W | — |
— | 100–150 W | — |
Duration | 1–30 minutes | — |
Duration | 2–20 minutes | — |
Duration | 3–15 minutes | — |
Duration | 4–12 minutes | — |
Duration | 5–10 minutes | — |
Duration | 6–8 minutes | — |
Thickness | 0.3–10 nm | — |
Thickness | 0.35–9 nm | — |
Thickness | 0.4–8 nm | — |
Thickness | 0.7–7 nm | — |
Thickness | 1–6 nm | — |
Thickness | 2–5 nm | — |
Thickness | 3–4 nm | — |
Thickness | 0.3–200 nm | — |
Thickness | 0.7–175 nm | — |
Thickness | 1–150 nm | — |
Thickness | 2–125 nm | — |
Thickness | 3–100 nm | — |
Thickness | 4–75 nm | — |
Thickness | 5–50 nm | — |
Thickness | 6–25 nm | — |
Thickness | 7–10 nm | — |
Thickness | 8–10 nm | — |
Temperature | 80–150 °C | — |
Temperature | 90–140 °C | — |
Temperature | 100–130 °C | — |
Temperature | 110–120 °C | — |
Duration | 1–60 minutes | — |
Duration | 2–50 minutes | — |
Duration | 3–45 minutes | — |
Duration | 4–30 minutes | — |
Duration | 5–20 minutes | — |
Duration | 10–15 minutes | — |
Temperature | 25–60 °C | — |
Temperature | 30–50 °C | — |
Temperature | 35–40 °C | — |
Duration | 1800–43200 s | — |
Duration | 1–10 hours | — |
Duration | 2–8 hours | — |
Duration | 3–6 hours | — |
Duration | 4–5 hours | — |
Temperature | 100–200 °C | — |
Temperature | 10–180 °C | — |
Temperature | 120–170 °C | — |
Temperature | 130–160 °C | — |
Temperature | 140–150 °C | — |
Duration | 900–3600 s | — |
Duration | 20–45 minutes | — |
Duration | 25–40 minutes | — |
Duration | 30–35 minutes | — |
Duration | 1–6 hours | — |
Duration | 2–5 hours | — |
Duration | 3–4 hours | — |
Temperature | 0–400 °C | — |
Temperature | 50–300 °C | — |
Temperature | 200–250 °C | — |
Duration | 1–10 minutes | — |
Duration | 2–8 minutes | — |
Duration | 3–6 minutes | — |
Duration | 4–5 minutes | — |
Temperature | 25–150 °C | — |
Temperature | 75–95 °C | — |
Thickness | 0.1–2.5 mm | — |
Thickness | 0.3–2 mm | — |
Thickness | 0.7–1.5 mm | — |
Thickness | 1–1.2 mm | — |
Thickness | 100–1000000 nm | — |
Thickness | 200–500 nm | — |
Thickness | 300–400 nm | — |
Thickness | 50–200 nm | — |
Thickness | 100–150 nm | — |
Thickness | 0.7–150 nm | — |
Thickness | 1–100 nm | — |
Thickness | 2–50 nm | — |
Thickness | 3–40 nm | — |
Thickness | 4–30 nm | — |
Thickness | 5–20 nm | — |
Thickness | 10–15 nm | — |
Flow Rate | 0–40 sccm | — |
Thickness | 400–700 nm | — |
Temperature | ≤ 2 K | — |
Temperature | ≤ 1 K | — |
Temperature | ≤ 0.25 K | — |
Temperature | ≤ 0.1 K | — |
Temperature | ≤ 3 K | — |
Duration | 15–60 minutes | — |
Thickness | 100–500 nm | — |