Patent
US 8,916,013Method for Transferring Graphene Using a Hot Press
Byung Hee HONG
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 8,916,013Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
App l n. No. 13/945,629 Amendment dated Reply to Office Action dated AMENDMENTS TO THE CLAIMS This listing of Claims will replace all the previously presented claims in the application: Listin gi of Claims 1. A graphene transferring method, comprising: making contact of graphene to which a thermal-releasable sheet is attached with a target substrate; and separating the thermal-releasable sheet from the graphene and transferring the separated graphene onto the target substrate at the same time by pressurizing and heating the graphene to which the thermal-releasable sheet is attached and the target substrate in between a first press and a second press opposite the first press; wherein the target substrate is adhered to the second press during the transferring of the graphene, by a vacuum atmosphere formed by a plurality of vacuum lines in the second press to prevent the target substrate from slipping on the second p ress-pr ess; wherein temperatures of heat g enerated by the first press and the second press are independently controlled, and wherein the thermal-releasable sheet includes viscous resin.
The graphene transferring method of claim 1, wherein the thermal- releasable sheet is released in a range of from about 90 ° C to about 150 °C.
The graphene transferring method of claim 1, wherein the target substrate includes a flexible substrate or a rigid substrate.
The graphene transferring method of claim 1, wherein a temperature of the heating is in a range of from about 80 * C to about 200 °C.
The graphene transferring method of claim 1, wherein during the heating process, a temperature of the first press is equal to or different from a temperature of the second press.
The graphene transferring method of claim 1, wherein during the pressurizing process, a pressure is in a range of from about 300 psi to about 2,000 psi.
The graphene transferring method of claim 1, wherein the graphene is formed by supplying a reaction gas containing a carbon source and heat onto the target substrate and making a reaction therebetween.
The graphene transferring method of claim 1, further including: after the transferring of the separated graphene onto the target substrate, washing the transferred graphene.
The graphene transferring method of claim 1, wherein the graphene to which the thermal-releasable sheet is attached includes one or more layers of graphene.
The graphene transferring method of claim 1, further comprising: forming a vacuum atmosphere between the thermal-releasable sheet and the first press, so that the thermal-releasable sheet is adhered to the first press during the separating of the thermal-releasable sheet from the graphene.
The graphene transferring method of claim 1, wherein the graphene is heated by heat generated by the first press and the second press.
canceled
A graphene transferring apparatus using a hot press that includes a lower press onto which a substrate and graphene to which a thermal-releasable sheet is attached are loaded and an upper press, wherein the upper press and the lower press respectively include vacuum lines and independently control temperatures. withdrawn
The graphene transferring apparatus of claim 14, wherein the graphene transferring apparatus using the hot press further includes water-cooling type heating units configured to uniformly transfer heat within the upper press and the lower press. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
graphene transferring hot press apparatus
Materials described outside the worked examples.
graphene
thermal-releasable sheet
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 0.13–0.17 mm | — |
Pressure | 300–2000 psi |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 8,916,013Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
App l n. No. 13/945,629 Amendment dated Reply to Office Action dated AMENDMENTS TO THE CLAIMS This listing of Claims will replace all the previously presented claims in the application: Listin gi of Claims 1. A graphene transferring method, comprising: making contact of graphene to which a thermal-releasable sheet is attached with a target substrate; and separating the thermal-releasable sheet from the graphene and transferring the separated graphene onto the target substrate at the same time by pressurizing and heating the graphene to which the thermal-releasable sheet is attached and the target substrate in between a first press and a second press opposite the first press; wherein the target substrate is adhered to the second press during the transferring of the graphene, by a vacuum atmosphere formed by a plurality of vacuum lines in the second press to prevent the target substrate from slipping on the second p ress-pr ess; wherein temperatures of heat g enerated by the first press and the second press are independently controlled, and wherein the thermal-releasable sheet includes viscous resin.
The graphene transferring method of claim 1, wherein the thermal- releasable sheet is released in a range of from about 90 ° C to about 150 °C.
The graphene transferring method of claim 1, wherein the target substrate includes a flexible substrate or a rigid substrate.
The graphene transferring method of claim 1, wherein a temperature of the heating is in a range of from about 80 * C to about 200 °C.
The graphene transferring method of claim 1, wherein during the heating process, a temperature of the first press is equal to or different from a temperature of the second press.
The graphene transferring method of claim 1, wherein during the pressurizing process, a pressure is in a range of from about 300 psi to about 2,000 psi.
The graphene transferring method of claim 1, wherein the graphene is formed by supplying a reaction gas containing a carbon source and heat onto the target substrate and making a reaction therebetween.
The graphene transferring method of claim 1, further including: after the transferring of the separated graphene onto the target substrate, washing the transferred graphene.
The graphene transferring method of claim 1, wherein the graphene to which the thermal-releasable sheet is attached includes one or more layers of graphene.
The graphene transferring method of claim 1, further comprising: forming a vacuum atmosphere between the thermal-releasable sheet and the first press, so that the thermal-releasable sheet is adhered to the first press during the separating of the thermal-releasable sheet from the graphene.
The graphene transferring method of claim 1, wherein the graphene is heated by heat generated by the first press and the second press.
canceled
A graphene transferring apparatus using a hot press that includes a lower press onto which a substrate and graphene to which a thermal-releasable sheet is attached are loaded and an upper press, wherein the upper press and the lower press respectively include vacuum lines and independently control temperatures. withdrawn
The graphene transferring apparatus of claim 14, wherein the graphene transferring apparatus using the hot press further includes water-cooling type heating units configured to uniformly transfer heat within the upper press and the lower press. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
graphene transferring hot press apparatus
Materials described outside the worked examples.
graphene
thermal-releasable sheet
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 0.13–0.17 mm | — |
Pressure | 300–2000 psi |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 8,916,013Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
App l n. No. 13/945,629 Amendment dated Reply to Office Action dated AMENDMENTS TO THE CLAIMS This listing of Claims will replace all the previously presented claims in the application: Listin gi of Claims 1. A graphene transferring method, comprising: making contact of graphene to which a thermal-releasable sheet is attached with a target substrate; and separating the thermal-releasable sheet from the graphene and transferring the separated graphene onto the target substrate at the same time by pressurizing and heating the graphene to which the thermal-releasable sheet is attached and the target substrate in between a first press and a second press opposite the first press; wherein the target substrate is adhered to the second press during the transferring of the graphene, by a vacuum atmosphere formed by a plurality of vacuum lines in the second press to prevent the target substrate from slipping on the second p ress-pr ess; wherein temperatures of heat g enerated by the first press and the second press are independently controlled, and wherein the thermal-releasable sheet includes viscous resin.
The graphene transferring method of claim 1, wherein the thermal- releasable sheet is released in a range of from about 90 ° C to about 150 °C.
The graphene transferring method of claim 1, wherein the target substrate includes a flexible substrate or a rigid substrate.
The graphene transferring method of claim 1, wherein a temperature of the heating is in a range of from about 80 * C to about 200 °C.
The graphene transferring method of claim 1, wherein during the heating process, a temperature of the first press is equal to or different from a temperature of the second press.
The graphene transferring method of claim 1, wherein during the pressurizing process, a pressure is in a range of from about 300 psi to about 2,000 psi.
The graphene transferring method of claim 1, wherein the graphene is formed by supplying a reaction gas containing a carbon source and heat onto the target substrate and making a reaction therebetween.
The graphene transferring method of claim 1, further including: after the transferring of the separated graphene onto the target substrate, washing the transferred graphene.
The graphene transferring method of claim 1, wherein the graphene to which the thermal-releasable sheet is attached includes one or more layers of graphene.
The graphene transferring method of claim 1, further comprising: forming a vacuum atmosphere between the thermal-releasable sheet and the first press, so that the thermal-releasable sheet is adhered to the first press during the separating of the thermal-releasable sheet from the graphene.
The graphene transferring method of claim 1, wherein the graphene is heated by heat generated by the first press and the second press.
canceled
A graphene transferring apparatus using a hot press that includes a lower press onto which a substrate and graphene to which a thermal-releasable sheet is attached are loaded and an upper press, wherein the upper press and the lower press respectively include vacuum lines and independently control temperatures. withdrawn
The graphene transferring apparatus of claim 14, wherein the graphene transferring apparatus using the hot press further includes water-cooling type heating units configured to uniformly transfer heat within the upper press and the lower press. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
graphene transferring hot press apparatus
Materials described outside the worked examples.
graphene
thermal-releasable sheet
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 0.13–0.17 mm | — |
Pressure | 300–2000 psi |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 8,916,013Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
App l n. No. 13/945,629 Amendment dated Reply to Office Action dated AMENDMENTS TO THE CLAIMS This listing of Claims will replace all the previously presented claims in the application: Listin gi of Claims 1. A graphene transferring method, comprising: making contact of graphene to which a thermal-releasable sheet is attached with a target substrate; and separating the thermal-releasable sheet from the graphene and transferring the separated graphene onto the target substrate at the same time by pressurizing and heating the graphene to which the thermal-releasable sheet is attached and the target substrate in between a first press and a second press opposite the first press; wherein the target substrate is adhered to the second press during the transferring of the graphene, by a vacuum atmosphere formed by a plurality of vacuum lines in the second press to prevent the target substrate from slipping on the second p ress-pr ess; wherein temperatures of heat g enerated by the first press and the second press are independently controlled, and wherein the thermal-releasable sheet includes viscous resin.
The graphene transferring method of claim 1, wherein the thermal- releasable sheet is released in a range of from about 90 ° C to about 150 °C.
The graphene transferring method of claim 1, wherein the target substrate includes a flexible substrate or a rigid substrate.
The graphene transferring method of claim 1, wherein a temperature of the heating is in a range of from about 80 * C to about 200 °C.
The graphene transferring method of claim 1, wherein during the heating process, a temperature of the first press is equal to or different from a temperature of the second press.
The graphene transferring method of claim 1, wherein during the pressurizing process, a pressure is in a range of from about 300 psi to about 2,000 psi.
The graphene transferring method of claim 1, wherein the graphene is formed by supplying a reaction gas containing a carbon source and heat onto the target substrate and making a reaction therebetween.
The graphene transferring method of claim 1, further including: after the transferring of the separated graphene onto the target substrate, washing the transferred graphene.
The graphene transferring method of claim 1, wherein the graphene to which the thermal-releasable sheet is attached includes one or more layers of graphene.
The graphene transferring method of claim 1, further comprising: forming a vacuum atmosphere between the thermal-releasable sheet and the first press, so that the thermal-releasable sheet is adhered to the first press during the separating of the thermal-releasable sheet from the graphene.
The graphene transferring method of claim 1, wherein the graphene is heated by heat generated by the first press and the second press.
canceled
A graphene transferring apparatus using a hot press that includes a lower press onto which a substrate and graphene to which a thermal-releasable sheet is attached are loaded and an upper press, wherein the upper press and the lower press respectively include vacuum lines and independently control temperatures. withdrawn
The graphene transferring apparatus of claim 14, wherein the graphene transferring apparatus using the hot press further includes water-cooling type heating units configured to uniformly transfer heat within the upper press and the lower press. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
graphene transferring hot press apparatus
Materials described outside the worked examples.
graphene
thermal-releasable sheet
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 0.13–0.17 mm | — |
Pressure | 300–2000 psi |
Related documents with shared materials, methods, properties, or citations.
flexible substrate
rigid substrate
glass substrate
ITO substrate
Si substrate
Si
SiO₂ substrate
SiO₂
metal substrate
polyethylene terephthalate (PET)
polyimide
polyethylene naphthalate (PEN)
polycarbonate (PC)
elastomer polymer
polydimethylsiloxane (PDMS)
poly(methylmethacrylate) (PMMA)
silicone rubber
viscous resin (epoxy resin)
| — |
Pressure | 300–1800 psi | — |
Pressure | 300–1600 psi | — |
Pressure | 300–1400 psi | — |
Pressure | 300–1200 psi | — |
Pressure | 300–1000 psi | — |
Pressure | 300–800 psi | — |
Pressure | 300–600 psi | — |
Pressure | 500–2000 psi | — |
Pressure | 500–1800 psi | — |
Pressure | 500–1600 psi | — |
Pressure | 500–1400 psi | — |
Pressure | 500–1200 psi | — |
Pressure | 500–1000 psi | — |
Pressure | 500–800 psi | — |
Pressure | 500–600 psi | — |
Pressure | 1000–2000 psi | — |
Pressure | 1000–1800 psi | — |
Pressure | 1000–1600 psi | — |
Pressure | 1000–1400 psi | — |
Pressure | 1000–1200 psi | — |
Pressure | 1500–2000 psi | — |
Pressure | 1500–1600 psi | — |
Temperature | 90–150 °C | — |
flexible substrate
rigid substrate
glass substrate
ITO substrate
Si substrate
Si
SiO₂ substrate
SiO₂
metal substrate
polyethylene terephthalate (PET)
polyimide
polyethylene naphthalate (PEN)
polycarbonate (PC)
elastomer polymer
polydimethylsiloxane (PDMS)
poly(methylmethacrylate) (PMMA)
silicone rubber
viscous resin (epoxy resin)
| — |
Pressure | 300–1800 psi | — |
Pressure | 300–1600 psi | — |
Pressure | 300–1400 psi | — |
Pressure | 300–1200 psi | — |
Pressure | 300–1000 psi | — |
Pressure | 300–800 psi | — |
Pressure | 300–600 psi | — |
Pressure | 500–2000 psi | — |
Pressure | 500–1800 psi | — |
Pressure | 500–1600 psi | — |
Pressure | 500–1400 psi | — |
Pressure | 500–1200 psi | — |
Pressure | 500–1000 psi | — |
Pressure | 500–800 psi | — |
Pressure | 500–600 psi | — |
Pressure | 1000–2000 psi | — |
Pressure | 1000–1800 psi | — |
Pressure | 1000–1600 psi | — |
Pressure | 1000–1400 psi | — |
Pressure | 1000–1200 psi | — |
Pressure | 1500–2000 psi | — |
Pressure | 1500–1600 psi | — |
Temperature | 90–150 °C | — |
flexible substrate
rigid substrate
glass substrate
ITO substrate
Si substrate
Si
SiO₂ substrate
SiO₂
metal substrate
polyethylene terephthalate (PET)
polyimide
polyethylene naphthalate (PEN)
polycarbonate (PC)
elastomer polymer
polydimethylsiloxane (PDMS)
poly(methylmethacrylate) (PMMA)
silicone rubber
viscous resin (epoxy resin)
| — |
Pressure | 300–1800 psi | — |
Pressure | 300–1600 psi | — |
Pressure | 300–1400 psi | — |
Pressure | 300–1200 psi | — |
Pressure | 300–1000 psi | — |
Pressure | 300–800 psi | — |
Pressure | 300–600 psi | — |
Pressure | 500–2000 psi | — |
Pressure | 500–1800 psi | — |
Pressure | 500–1600 psi | — |
Pressure | 500–1400 psi | — |
Pressure | 500–1200 psi | — |
Pressure | 500–1000 psi | — |
Pressure | 500–800 psi | — |
Pressure | 500–600 psi | — |
Pressure | 1000–2000 psi | — |
Pressure | 1000–1800 psi | — |
Pressure | 1000–1600 psi | — |
Pressure | 1000–1400 psi | — |
Pressure | 1000–1200 psi | — |
Pressure | 1500–2000 psi | — |
Pressure | 1500–1600 psi | — |
Temperature | 90–150 °C | — |
flexible substrate
rigid substrate
glass substrate
ITO substrate
Si substrate
Si
SiO₂ substrate
SiO₂
metal substrate
polyethylene terephthalate (PET)
polyimide
polyethylene naphthalate (PEN)
polycarbonate (PC)
elastomer polymer
polydimethylsiloxane (PDMS)
poly(methylmethacrylate) (PMMA)
silicone rubber
viscous resin (epoxy resin)
| — |
Pressure | 300–1800 psi | — |
Pressure | 300–1600 psi | — |
Pressure | 300–1400 psi | — |
Pressure | 300–1200 psi | — |
Pressure | 300–1000 psi | — |
Pressure | 300–800 psi | — |
Pressure | 300–600 psi | — |
Pressure | 500–2000 psi | — |
Pressure | 500–1800 psi | — |
Pressure | 500–1600 psi | — |
Pressure | 500–1400 psi | — |
Pressure | 500–1200 psi | — |
Pressure | 500–1000 psi | — |
Pressure | 500–800 psi | — |
Pressure | 500–600 psi | — |
Pressure | 1000–2000 psi | — |
Pressure | 1000–1800 psi | — |
Pressure | 1000–1600 psi | — |
Pressure | 1000–1400 psi | — |
Pressure | 1000–1200 psi | — |
Pressure | 1500–2000 psi | — |
Pressure | 1500–1600 psi | — |
Temperature | 90–150 °C | — |