A switched-mode neutral forming device, comprising: one or more windings coupled to (i) a plurality of line terminals via a plurality of switches and (ii) a neutral terminal, wherein each switch of the plurality of switches is a native four quadrant bi-directional switch that is a gallium nitride (GaN) high mobility electron transistor (HEMT) comprising two gate-source struc-tures that extend to an aluminum gallium nitride (Al-GaN) layer, one of which used in place of a drain which allows a common drift region to be used for at least one of current flowing in a direction from a first source terminal to a second source terminal, for current flow-ing in a direction from the second source terminal to the first source terminal, or to block either a positive or a negative voltage; an inert passivation layer that contacts and covers a top surface of the aluminum gallium nitride (AlGaN) layer and extends at least partially along a gallium nitride (GaN) layer; and a controller, coupled to the plurality of switches, for driving the switches at a frequency orders or magnitude about 1000 times greater than an AC mains frequency such that a switching frequency of the switched-mode neutral forming device is about 50 KHz to about 60 KHz.
The switched-mode neutral forming device of claim 1, wherein the gallium nitride (GaN) high mobility electron transistor (HEMT) comprises: 60 a base layer; a transition layer disposed atop the base layer; the gallium nitride (GaN) layer is disposed atop the transition layer; and the aluminum gallium nitride (AlGaN) layer is disposed atop the gallium nitride (GaN) layer, wherein the two gate-source structures comprises source terminals that extend to the gallium nitride (GaN) layer and gate terminals that extend to the aluminum gallium nitride (AlGaN) layer.
The switched-mode neutral forming device of claim 1, wherein the source terminals and the gate terminals are at least partially surrounded by the inert passivation layer.
The switched-mode neutral forming device of claim 1, wherein a ratio of gate drive loss to conduction loss ratio for the plurality of switches is based on a die area per switch difference that provides for only one of the gates of two gate-source structures to be switched at any given time during operation.
The switched-mode neutral forming device of claim 1, wherein the inert passivation layer covers the entire top surface of the aluminum gallium nitride (AlGaN) layer.
12
Independent
The switched-mode neutral forming device of claim 10, wherein a second set of three of the nine bi-directional switches are respectively coupled between a second line terminal and a first terminal of the star winding, the second line terminal and a second terminal of the star winding, and the second line terminal and a third terminal of the star winding.
A switched-mode neutral forming device, comprising: one or more windings coupled to (i) a plurality of line terminals via a plurality of switches and (ii) a neutral terminal, wherein each switch of the plurality of switches is a native four quadrant bi-directional switch that is a gallium nitride (GaN) high mobility electron transistor (HEMT) comprising two gate-source struc-tures that extend to an aluminum gallium nitride (Al-GaN) layer, one of which used in place of a drain which allows a common drift region to be used for at least one of current flowing in a direction from a first source terminal to a second source terminal, for current flow-ing in a direction from the second source terminal to the first source terminal, or to block either a positive or a negative voltage, wherein the plurality of switches are operable in one of a split-phase configuration or three-phase configuration; an inert passivation layer that contacts and covers a top surface of the aluminum gallium nitride (AlGaN) layer and extends at least partially along a gallium nitride (GaN) layer; and a controller, coupled to the plurality of switches, for driving the switches at a frequency orders or magnitude about 1000 times greater than an AC mains frequency such that a switching frequency of the switched-mode neutral forming device is about 50 KHz to about 60 KHz.
19
Dependent← claim 18
The switched-mode neutral forming device of claim 18, wherein in the split-phase configuration, the switched-mode neutral forming device comprises two bi-directional switches, an inductor, and two capacitors and in three-phase configuration the switched-mode neutral forming device comprises nine bi-directional switches and a star-delta transformer having a star winding on a load side and a delta winding on a power grid side.
The switched-mode neutral forming device of claim 18, wherein a ratio of gate drive loss to conduction loss ratio for the plurality of switches is based on a die area per switch difference that provides for only one of the gates of two gate-source structures to be switched at any given time during operation. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN HEMT native four-quadrant bi-directional switch
inert passivation layerpassivation layer
AlGaNbarrier layer
GaNchannel layer
transitionlayertransition layer
baselayerbase layer
Materials
Materials described outside the worked examples.
gallium nitride
GaN
Channel Layer In HEMT
aluminum gallium nitride
AlGaN
Barrier Layer In HEMT
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 19
US 4,922,400 A4,922,400 A 5/1990 Cook
US 5,198,971 A5,198,971 A 3/1993 Recker et al.
US 8,169,179 B28,169,179 B2 * 5/2012 Mohan.............. H02M 7/53873examiner
CN 104701364 ACN 104701364 A * 6/2015examiner
CN 110323955 BCN 110323955 B * 12/2020................ H01P 5/12examiner
Why these are connected
Related documents with shared materials, methods, properties, or citations.
A switched-mode neutral forming device, comprising: one or more windings coupled to (i) a plurality of line terminals via a plurality of switches and (ii) a neutral terminal, wherein each switch of the plurality of switches is a native four quadrant bi-directional switch that is a gallium nitride (GaN) high mobility electron transistor (HEMT) comprising two gate-source struc-tures that extend to an aluminum gallium nitride (Al-GaN) layer, one of which used in place of a drain which allows a common drift region to be used for at least one of current flowing in a direction from a first source terminal to a second source terminal, for current flow-ing in a direction from the second source terminal to the first source terminal, or to block either a positive or a negative voltage; an inert passivation layer that contacts and covers a top surface of the aluminum gallium nitride (AlGaN) layer and extends at least partially along a gallium nitride (GaN) layer; and a controller, coupled to the plurality of switches, for driving the switches at a frequency orders or magnitude about 1000 times greater than an AC mains frequency such that a switching frequency of the switched-mode neutral forming device is about 50 KHz to about 60 KHz.
The switched-mode neutral forming device of claim 1, wherein the gallium nitride (GaN) high mobility electron transistor (HEMT) comprises: 60 a base layer; a transition layer disposed atop the base layer; the gallium nitride (GaN) layer is disposed atop the transition layer; and the aluminum gallium nitride (AlGaN) layer is disposed atop the gallium nitride (GaN) layer, wherein the two gate-source structures comprises source terminals that extend to the gallium nitride (GaN) layer and gate terminals that extend to the aluminum gallium nitride (AlGaN) layer.
The switched-mode neutral forming device of claim 1, wherein the source terminals and the gate terminals are at least partially surrounded by the inert passivation layer.
The switched-mode neutral forming device of claim 1, wherein a ratio of gate drive loss to conduction loss ratio for the plurality of switches is based on a die area per switch difference that provides for only one of the gates of two gate-source structures to be switched at any given time during operation.
The switched-mode neutral forming device of claim 1, wherein the inert passivation layer covers the entire top surface of the aluminum gallium nitride (AlGaN) layer.
12
Independent
The switched-mode neutral forming device of claim 10, wherein a second set of three of the nine bi-directional switches are respectively coupled between a second line terminal and a first terminal of the star winding, the second line terminal and a second terminal of the star winding, and the second line terminal and a third terminal of the star winding.
A switched-mode neutral forming device, comprising: one or more windings coupled to (i) a plurality of line terminals via a plurality of switches and (ii) a neutral terminal, wherein each switch of the plurality of switches is a native four quadrant bi-directional switch that is a gallium nitride (GaN) high mobility electron transistor (HEMT) comprising two gate-source struc-tures that extend to an aluminum gallium nitride (Al-GaN) layer, one of which used in place of a drain which allows a common drift region to be used for at least one of current flowing in a direction from a first source terminal to a second source terminal, for current flow-ing in a direction from the second source terminal to the first source terminal, or to block either a positive or a negative voltage, wherein the plurality of switches are operable in one of a split-phase configuration or three-phase configuration; an inert passivation layer that contacts and covers a top surface of the aluminum gallium nitride (AlGaN) layer and extends at least partially along a gallium nitride (GaN) layer; and a controller, coupled to the plurality of switches, for driving the switches at a frequency orders or magnitude about 1000 times greater than an AC mains frequency such that a switching frequency of the switched-mode neutral forming device is about 50 KHz to about 60 KHz.
19
Dependent← claim 18
The switched-mode neutral forming device of claim 18, wherein in the split-phase configuration, the switched-mode neutral forming device comprises two bi-directional switches, an inductor, and two capacitors and in three-phase configuration the switched-mode neutral forming device comprises nine bi-directional switches and a star-delta transformer having a star winding on a load side and a delta winding on a power grid side.
The switched-mode neutral forming device of claim 18, wherein a ratio of gate drive loss to conduction loss ratio for the plurality of switches is based on a die area per switch difference that provides for only one of the gates of two gate-source structures to be switched at any given time during operation. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN HEMT native four-quadrant bi-directional switch
inert passivation layerpassivation layer
AlGaNbarrier layer
GaNchannel layer
transitionlayertransition layer
baselayerbase layer
Materials
Materials described outside the worked examples.
gallium nitride
GaN
Channel Layer In HEMT
aluminum gallium nitride
AlGaN
Barrier Layer In HEMT
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 19
US 4,922,400 A4,922,400 A 5/1990 Cook
US 5,198,971 A5,198,971 A 3/1993 Recker et al.
US 8,169,179 B28,169,179 B2 * 5/2012 Mohan.............. H02M 7/53873examiner
CN 104701364 ACN 104701364 A * 6/2015examiner
CN 110323955 BCN 110323955 B * 12/2020................ H01P 5/12examiner
Why these are connected
Related documents with shared materials, methods, properties, or citations.
A switched-mode neutral forming device, comprising: one or more windings coupled to (i) a plurality of line terminals via a plurality of switches and (ii) a neutral terminal, wherein each switch of the plurality of switches is a native four quadrant bi-directional switch that is a gallium nitride (GaN) high mobility electron transistor (HEMT) comprising two gate-source struc-tures that extend to an aluminum gallium nitride (Al-GaN) layer, one of which used in place of a drain which allows a common drift region to be used for at least one of current flowing in a direction from a first source terminal to a second source terminal, for current flow-ing in a direction from the second source terminal to the first source terminal, or to block either a positive or a negative voltage; an inert passivation layer that contacts and covers a top surface of the aluminum gallium nitride (AlGaN) layer and extends at least partially along a gallium nitride (GaN) layer; and a controller, coupled to the plurality of switches, for driving the switches at a frequency orders or magnitude about 1000 times greater than an AC mains frequency such that a switching frequency of the switched-mode neutral forming device is about 50 KHz to about 60 KHz.
The switched-mode neutral forming device of claim 1, wherein the gallium nitride (GaN) high mobility electron transistor (HEMT) comprises: 60 a base layer; a transition layer disposed atop the base layer; the gallium nitride (GaN) layer is disposed atop the transition layer; and the aluminum gallium nitride (AlGaN) layer is disposed atop the gallium nitride (GaN) layer, wherein the two gate-source structures comprises source terminals that extend to the gallium nitride (GaN) layer and gate terminals that extend to the aluminum gallium nitride (AlGaN) layer.
The switched-mode neutral forming device of claim 1, wherein the source terminals and the gate terminals are at least partially surrounded by the inert passivation layer.
The switched-mode neutral forming device of claim 1, wherein a ratio of gate drive loss to conduction loss ratio for the plurality of switches is based on a die area per switch difference that provides for only one of the gates of two gate-source structures to be switched at any given time during operation.
The switched-mode neutral forming device of claim 1, wherein the inert passivation layer covers the entire top surface of the aluminum gallium nitride (AlGaN) layer.
12
Independent
The switched-mode neutral forming device of claim 10, wherein a second set of three of the nine bi-directional switches are respectively coupled between a second line terminal and a first terminal of the star winding, the second line terminal and a second terminal of the star winding, and the second line terminal and a third terminal of the star winding.
A switched-mode neutral forming device, comprising: one or more windings coupled to (i) a plurality of line terminals via a plurality of switches and (ii) a neutral terminal, wherein each switch of the plurality of switches is a native four quadrant bi-directional switch that is a gallium nitride (GaN) high mobility electron transistor (HEMT) comprising two gate-source struc-tures that extend to an aluminum gallium nitride (Al-GaN) layer, one of which used in place of a drain which allows a common drift region to be used for at least one of current flowing in a direction from a first source terminal to a second source terminal, for current flow-ing in a direction from the second source terminal to the first source terminal, or to block either a positive or a negative voltage, wherein the plurality of switches are operable in one of a split-phase configuration or three-phase configuration; an inert passivation layer that contacts and covers a top surface of the aluminum gallium nitride (AlGaN) layer and extends at least partially along a gallium nitride (GaN) layer; and a controller, coupled to the plurality of switches, for driving the switches at a frequency orders or magnitude about 1000 times greater than an AC mains frequency such that a switching frequency of the switched-mode neutral forming device is about 50 KHz to about 60 KHz.
19
Dependent← claim 18
The switched-mode neutral forming device of claim 18, wherein in the split-phase configuration, the switched-mode neutral forming device comprises two bi-directional switches, an inductor, and two capacitors and in three-phase configuration the switched-mode neutral forming device comprises nine bi-directional switches and a star-delta transformer having a star winding on a load side and a delta winding on a power grid side.
The switched-mode neutral forming device of claim 18, wherein a ratio of gate drive loss to conduction loss ratio for the plurality of switches is based on a die area per switch difference that provides for only one of the gates of two gate-source structures to be switched at any given time during operation. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN HEMT native four-quadrant bi-directional switch
inert passivation layerpassivation layer
AlGaNbarrier layer
GaNchannel layer
transitionlayertransition layer
baselayerbase layer
Materials
Materials described outside the worked examples.
gallium nitride
GaN
Channel Layer In HEMT
aluminum gallium nitride
AlGaN
Barrier Layer In HEMT
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 19
US 4,922,400 A4,922,400 A 5/1990 Cook
US 5,198,971 A5,198,971 A 3/1993 Recker et al.
US 8,169,179 B28,169,179 B2 * 5/2012 Mohan.............. H02M 7/53873examiner
CN 104701364 ACN 104701364 A * 6/2015examiner
CN 110323955 BCN 110323955 B * 12/2020................ H01P 5/12examiner
Why these are connected
Related documents with shared materials, methods, properties, or citations.
A switched-mode neutral forming device, comprising: one or more windings coupled to (i) a plurality of line terminals via a plurality of switches and (ii) a neutral terminal, wherein each switch of the plurality of switches is a native four quadrant bi-directional switch that is a gallium nitride (GaN) high mobility electron transistor (HEMT) comprising two gate-source struc-tures that extend to an aluminum gallium nitride (Al-GaN) layer, one of which used in place of a drain which allows a common drift region to be used for at least one of current flowing in a direction from a first source terminal to a second source terminal, for current flow-ing in a direction from the second source terminal to the first source terminal, or to block either a positive or a negative voltage; an inert passivation layer that contacts and covers a top surface of the aluminum gallium nitride (AlGaN) layer and extends at least partially along a gallium nitride (GaN) layer; and a controller, coupled to the plurality of switches, for driving the switches at a frequency orders or magnitude about 1000 times greater than an AC mains frequency such that a switching frequency of the switched-mode neutral forming device is about 50 KHz to about 60 KHz.
The switched-mode neutral forming device of claim 1, wherein the gallium nitride (GaN) high mobility electron transistor (HEMT) comprises: 60 a base layer; a transition layer disposed atop the base layer; the gallium nitride (GaN) layer is disposed atop the transition layer; and the aluminum gallium nitride (AlGaN) layer is disposed atop the gallium nitride (GaN) layer, wherein the two gate-source structures comprises source terminals that extend to the gallium nitride (GaN) layer and gate terminals that extend to the aluminum gallium nitride (AlGaN) layer.
The switched-mode neutral forming device of claim 1, wherein the source terminals and the gate terminals are at least partially surrounded by the inert passivation layer.
The switched-mode neutral forming device of claim 1, wherein a ratio of gate drive loss to conduction loss ratio for the plurality of switches is based on a die area per switch difference that provides for only one of the gates of two gate-source structures to be switched at any given time during operation.
The switched-mode neutral forming device of claim 1, wherein the inert passivation layer covers the entire top surface of the aluminum gallium nitride (AlGaN) layer.
12
Independent
The switched-mode neutral forming device of claim 10, wherein a second set of three of the nine bi-directional switches are respectively coupled between a second line terminal and a first terminal of the star winding, the second line terminal and a second terminal of the star winding, and the second line terminal and a third terminal of the star winding.
A switched-mode neutral forming device, comprising: one or more windings coupled to (i) a plurality of line terminals via a plurality of switches and (ii) a neutral terminal, wherein each switch of the plurality of switches is a native four quadrant bi-directional switch that is a gallium nitride (GaN) high mobility electron transistor (HEMT) comprising two gate-source struc-tures that extend to an aluminum gallium nitride (Al-GaN) layer, one of which used in place of a drain which allows a common drift region to be used for at least one of current flowing in a direction from a first source terminal to a second source terminal, for current flow-ing in a direction from the second source terminal to the first source terminal, or to block either a positive or a negative voltage, wherein the plurality of switches are operable in one of a split-phase configuration or three-phase configuration; an inert passivation layer that contacts and covers a top surface of the aluminum gallium nitride (AlGaN) layer and extends at least partially along a gallium nitride (GaN) layer; and a controller, coupled to the plurality of switches, for driving the switches at a frequency orders or magnitude about 1000 times greater than an AC mains frequency such that a switching frequency of the switched-mode neutral forming device is about 50 KHz to about 60 KHz.
19
Dependent← claim 18
The switched-mode neutral forming device of claim 18, wherein in the split-phase configuration, the switched-mode neutral forming device comprises two bi-directional switches, an inductor, and two capacitors and in three-phase configuration the switched-mode neutral forming device comprises nine bi-directional switches and a star-delta transformer having a star winding on a load side and a delta winding on a power grid side.
The switched-mode neutral forming device of claim 18, wherein a ratio of gate drive loss to conduction loss ratio for the plurality of switches is based on a die area per switch difference that provides for only one of the gates of two gate-source structures to be switched at any given time during operation. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN HEMT native four-quadrant bi-directional switch
inert passivation layerpassivation layer
AlGaNbarrier layer
GaNchannel layer
transitionlayertransition layer
baselayerbase layer
Materials
Materials described outside the worked examples.
gallium nitride
GaN
Channel Layer In HEMT
aluminum gallium nitride
AlGaN
Barrier Layer In HEMT
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 19
US 4,922,400 A4,922,400 A 5/1990 Cook
US 5,198,971 A5,198,971 A 3/1993 Recker et al.
US 8,169,179 B28,169,179 B2 * 5/2012 Mohan.............. H02M 7/53873examiner
CN 104701364 ACN 104701364 A * 6/2015examiner
CN 110323955 BCN 110323955 B * 12/2020................ H01P 5/12examiner
Why these are connected
Related documents with shared materials, methods, properties, or citations.
KR 20160109745 AKR 20160109745 A * 9/2016............ H02M 5/458examiner
Cited non-patent literature · 3
Umesh K. Pulication aˆ AlGaN/GaN HEMTsaAn Overview of Device Operation and Applicationsaˆ, Proceedings of the IEEE, vol. 90, No. 6, Jun. 2002 (Year: 2002).
Machine Translation CN-104701364-A (Year: 2015).* Machine Translation JP-5669119-B1 (Year: 2015).* PCT International Search Report and Written Opinion for Applica- tion PCT/US2022/027253 dated Aug. 18, 2022, 10 pgs.
Carrier Based Pulse Width Modulation for Matric Converters. Li et al., “Carrier Based Pulse Width Modulation for Matric Converters”, Applied Power Electronics Conference and Exposi- tion, 2009.APEC 2009,Twenty-FourthAnnual IEEE, IEEE Piscataway, NJ, Feb. 15, 2009, pp. 1709-1715, XP031442921, ISBNH: 978-1- 4244-2811-3.
KR 20160109745 AKR 20160109745 A * 9/2016............ H02M 5/458examiner
Cited non-patent literature · 3
Umesh K. Pulication aˆ AlGaN/GaN HEMTsaAn Overview of Device Operation and Applicationsaˆ, Proceedings of the IEEE, vol. 90, No. 6, Jun. 2002 (Year: 2002).
Machine Translation CN-104701364-A (Year: 2015).* Machine Translation JP-5669119-B1 (Year: 2015).* PCT International Search Report and Written Opinion for Applica- tion PCT/US2022/027253 dated Aug. 18, 2022, 10 pgs.
Carrier Based Pulse Width Modulation for Matric Converters. Li et al., “Carrier Based Pulse Width Modulation for Matric Converters”, Applied Power Electronics Conference and Exposi- tion, 2009.APEC 2009,Twenty-FourthAnnual IEEE, IEEE Piscataway, NJ, Feb. 15, 2009, pp. 1709-1715, XP031442921, ISBNH: 978-1- 4244-2811-3.
KR 20160109745 AKR 20160109745 A * 9/2016............ H02M 5/458examiner
Cited non-patent literature · 3
Umesh K. Pulication aˆ AlGaN/GaN HEMTsaAn Overview of Device Operation and Applicationsaˆ, Proceedings of the IEEE, vol. 90, No. 6, Jun. 2002 (Year: 2002).
Machine Translation CN-104701364-A (Year: 2015).* Machine Translation JP-5669119-B1 (Year: 2015).* PCT International Search Report and Written Opinion for Applica- tion PCT/US2022/027253 dated Aug. 18, 2022, 10 pgs.
Carrier Based Pulse Width Modulation for Matric Converters. Li et al., “Carrier Based Pulse Width Modulation for Matric Converters”, Applied Power Electronics Conference and Exposi- tion, 2009.APEC 2009,Twenty-FourthAnnual IEEE, IEEE Piscataway, NJ, Feb. 15, 2009, pp. 1709-1715, XP031442921, ISBNH: 978-1- 4244-2811-3.
KR 20160109745 AKR 20160109745 A * 9/2016............ H02M 5/458examiner
Cited non-patent literature · 3
Umesh K. Pulication aˆ AlGaN/GaN HEMTsaAn Overview of Device Operation and Applicationsaˆ, Proceedings of the IEEE, vol. 90, No. 6, Jun. 2002 (Year: 2002).
Machine Translation CN-104701364-A (Year: 2015).* Machine Translation JP-5669119-B1 (Year: 2015).* PCT International Search Report and Written Opinion for Applica- tion PCT/US2022/027253 dated Aug. 18, 2022, 10 pgs.
Carrier Based Pulse Width Modulation for Matric Converters. Li et al., “Carrier Based Pulse Width Modulation for Matric Converters”, Applied Power Electronics Conference and Exposi- tion, 2009.APEC 2009,Twenty-FourthAnnual IEEE, IEEE Piscataway, NJ, Feb. 15, 2009, pp. 1709-1715, XP031442921, ISBNH: 978-1- 4244-2811-3.