Abstract

We report on the development of InP-based semiconductor amplifiers with a U-bend waveguide geometry having the input and output ports on one facet only. This waveguide geometry simplifies the chip alignment during the hybrid integration on silicon photonics platforms ultimately reducing the coupling losses, improving the integration yield, and minimizing the length of the optoelectronic chip. To achieve low loss U-bends with small footprint, we utilize the Euler bend geometry previously demonstrated on silicon and GaAs platforms. We analyze the gain properties of the devices by operating them as laser diodes at room temperature. Low loss U-bend performance with a 0.56 dB for a 50 µm effective bending radius bend in a single-mode strip InP waveguide is demonstrated. The interface between bend and straight waveguides was studied by comparing deep etched waveguides to a combination of shallow straight waveguides and deep etched bends. The effects of this interface on the device losses, electric properties and spectrum are reported. The implications related to having a bend section on the carrier injection and gain are discussed. Finally, results on the integration trials on silicon-on-insulator platform are presented.

Abstract

We report on the development of InP-based semiconductor amplifiers with a U-bend waveguide geometry having the input and output ports on one facet only. This waveguide geometry simplifies the chip alignment during the hybrid integration on silicon photonics platforms ultimately reducing the coupling losses, improving the integration yield, and minimizing the length of the optoelectronic chip. To achieve low loss U-bends with small footprint, we utilize the Euler bend geometry previously demonstrated on silicon and GaAs platforms. We analyze the gain properties of the devices by operating them as laser diodes at room temperature. Low loss U-bend performance with a 0.56 dB for a 50 µm effective bending radius bend in a single-mode strip InP waveguide is demonstrated. The interface between bend and straight waveguides was studied by comparing deep etched waveguides to a combination of shallow straight waveguides and deep etched bends. The effects of this interface on the device losses, electric properties and spectrum are reported. The implications related to having a bend section on the carrier injection and gain are discussed. Finally, results on the integration trials on silicon-on-insulator platform are presented.

Abstract

We report on the development of InP-based semiconductor amplifiers with a U-bend waveguide geometry having the input and output ports on one facet only. This waveguide geometry simplifies the chip alignment during the hybrid integration on silicon photonics platforms ultimately reducing the coupling losses, improving the integration yield, and minimizing the length of the optoelectronic chip. To achieve low loss U-bends with small footprint, we utilize the Euler bend geometry previously demonstrated on silicon and GaAs platforms. We analyze the gain properties of the devices by operating them as laser diodes at room temperature. Low loss U-bend performance with a 0.56 dB for a 50 µm effective bending radius bend in a single-mode strip InP waveguide is demonstrated. The interface between bend and straight waveguides was studied by comparing deep etched waveguides to a combination of shallow straight waveguides and deep etched bends. The effects of this interface on the device losses, electric properties and spectrum are reported. The implications related to having a bend section on the carrier injection and gain are discussed. Finally, results on the integration trials on silicon-on-insulator platform are presented.

Abstract

We report on the development of InP-based semiconductor amplifiers with a U-bend waveguide geometry having the input and output ports on one facet only. This waveguide geometry simplifies the chip alignment during the hybrid integration on silicon photonics platforms ultimately reducing the coupling losses, improving the integration yield, and minimizing the length of the optoelectronic chip. To achieve low loss U-bends with small footprint, we utilize the Euler bend geometry previously demonstrated on silicon and GaAs platforms. We analyze the gain properties of the devices by operating them as laser diodes at room temperature. Low loss U-bend performance with a 0.56 dB for a 50 µm effective bending radius bend in a single-mode strip InP waveguide is demonstrated. The interface between bend and straight waveguides was studied by comparing deep etched waveguides to a combination of shallow straight waveguides and deep etched bends. The effects of this interface on the device losses, electric properties and spectrum are reported. The implications related to having a bend section on the carrier injection and gain are discussed. Finally, results on the integration trials on silicon-on-insulator platform are presented.