Research paper
Experimental Characterization| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Substrate Thickness | Si substrate thickness | 200um | — | |||
| Capping Layer Thickness | Au clamp thickness | 50nm | — | |||
| Channel Length | Device A₁ channel length | 28nm | — | |||
| Suspension Length | Lsus | 650nm | — | |||
| Suspension Length | Lsus | 580nm | — | |||
| Suspension Length | Lsus | 890nm | — | |||
| Tube Diameter | SWCNT diameter | 2.1nm | — | |||
| Tube Diameter | SWCNT diameter | 1.6nm | — | |||
| Electromigration Power | Device A₁ | 34mW | — | |||
| Electromigration Power | Device A₂ | 19mW | — | |||
| Electromigration Power | Device B | 12mW | — | |||
| Channel Resistance | Device A₂ resistance | 20000ohm | — | |||
| Channel Resistance | Device B resistance | 20000ohm | — |
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Substrate Thickness | Si substrate thickness | 200um | — | |||
| Capping Layer Thickness | Au clamp thickness | 50nm | — | |||
| Channel Length | Device A₁ channel length | 28nm | — | |||
| Suspension Length | Lsus | 650nm | — | |||
| Suspension Length | Lsus | 580nm | — | |||
| Suspension Length | Lsus | 890nm | — | |||
| Tube Diameter | SWCNT diameter | 2.1nm | — | |||
| Tube Diameter | SWCNT diameter | 1.6nm | — | |||
| Electromigration Power | Device A₁ | 34mW | — | |||
| Electromigration Power | Device A₂ | 19mW | — | |||
| Electromigration Power | Device B | 12mW | — | |||
| Channel Resistance | Device A₂ resistance | 20000ohm | — | |||
| Channel Resistance | Device B resistance | 20000ohm | — |
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Substrate Thickness | Si substrate thickness | 200um | — | |||
| Capping Layer Thickness | Au clamp thickness | 50nm | — | |||
| Channel Length | Device A₁ channel length | 28nm | — | |||
| Suspension Length | Lsus | 650nm | — | |||
| Suspension Length | Lsus | 580nm | — | |||
| Suspension Length | Lsus | 890nm | — | |||
| Tube Diameter | SWCNT diameter | 2.1nm | — | |||
| Tube Diameter | SWCNT diameter | 1.6nm | — | |||
| Electromigration Power | Device A₁ | 34mW | — | |||
| Electromigration Power | Device A₂ | 19mW | — | |||
| Electromigration Power | Device B | 12mW | — | |||
| Channel Resistance | Device A₂ resistance | 20000ohm | — | |||
| Channel Resistance | Device B resistance | 20000ohm | — |
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Substrate Thickness | Si substrate thickness | 200um | — | |||
| Capping Layer Thickness | Au clamp thickness | 50nm | — | |||
| Channel Length | Device A₁ channel length | 28nm | — | |||
| Suspension Length | Lsus | 650nm | — | |||
| Suspension Length | Lsus | 580nm | — | |||
| Suspension Length | Lsus | 890nm | — | |||
| Tube Diameter | SWCNT diameter | 2.1nm | — | |||
| Tube Diameter | SWCNT diameter | 1.6nm | — | |||
| Electromigration Power | Device A₁ | 34mW | — | |||
| Electromigration Power | Device A₂ | 19mW | — | |||
| Electromigration Power | Device B | 12mW | — | |||
| Channel Resistance | Device A₂ resistance | 20000ohm | — | |||
| Channel Resistance | Device B resistance | 20000ohm | — |