Patent
US 9,384,875METHOD FOR TRANSFERRING GRAPHENE FILM AND METHOD FOR MANUFACTURING TRANSPARENT CONDUCTIVE FILM
Nozomi Kimura
US
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Atlas literature
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US 9,384,875Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 D, the first substrate 11 is pressurized against the second substrate 14 to reduce a thickness of the resin layer 13 to a desired thickness. A …
FIG. 2B, on the graphene film 12, a resin layer 13 that contains at least 1% by weight or more of a volatile component and has adhesiveness is coated. A …
FIG. 3, it is found that, while graphene films of Comparative Examples 1, 2 have large sheet resistance and large in-plane distributions thereof, graphene films …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a graphene film comprising the steps of: sticking one layer or a plurality of layers of graphene films formed on a first substrate and a second substrate with a resin layer that contains less than 1% by weight of a volatile component and has adhesiveness; and removing the first substrate.
The method for transferring a graphene film according to claim 1, wherein a content of the volatile component of the resin layer is 0.1% by weight or less.
The method for transferring a graphene film according to claim 1, wherein on the graphene film formed on the first substrate, the resin layer is coated.
The method for transferring a graphene film according to claim 1, wherein, after coating a resin layer that contains at least 1% by weight or more of a volatile component on the graphene film formed on the first substrate, the resin layer is dried to remove a volatile component to form the resin layer that contains less than 1% by weight of a volatile component and has adhesiveness.
The method for transferring a graphene film according to claim 1, wherein a thickness of the resin layer is 2 p m or more and 20 p m or less.
The method for transferring a graphene film according to claim 1, wherein the second substrate is a transparent substrate.
1 0. A method for manufacturing a transparent conductive film comprising the steps of: sticking one layer or a plurality of layers of graphene films formed on a first substrate and a second substrate with a resin layer that contains less than 1% by weight of a volatile component and has adhesiveness; and removing the first substrate.
The method for manufacturing a transparent conductive film according to claim 10, wherein a content of the volatile component of the resin layer is 0.1% by weight or less.
The method for manufacturing a transparent conductive film according to claim 10, wherein, after coating [[a]] the resin layer that contains at least Page 5 of 9 Application No. 13/992,308 Reply to Office Action of 1 % by weight or more of [[a]] the volatile component on the graphene film formed on the first substrate, the resin layer is dried to remove the volatile component to form the resin layer that contains less than 1% by weight of [[a]] the volatile component and has adhesiveness.
1 7. The method for manufacturing a transparent conductive film according to claim 10, wherein a thickness of the resin layer is 2 p m or more and 20 p m or less.
1 8. The method for manufacturing a transparent conductive film according to claim 10, wherein the second substrate is a transparent substrate. Page 6 of 9
Layer stacks claimed or described, ordered top of device to substrate.
transparent conductive film
Materials described outside the worked examples.
graphene film
resin layer
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1 D, the first substrate 11 is pressurized against the second substrate 14 to reduce a thickness of the resin layer 13 to a desired thickness. A …
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,384,875Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 D, the first substrate 11 is pressurized against the second substrate 14 to reduce a thickness of the resin layer 13 to a desired thickness. A …
FIG. 2B, on the graphene film 12, a resin layer 13 that contains at least 1% by weight or more of a volatile component and has adhesiveness is coated. A …
FIG. 3, it is found that, while graphene films of Comparative Examples 1, 2 have large sheet resistance and large in-plane distributions thereof, graphene films …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a graphene film comprising the steps of: sticking one layer or a plurality of layers of graphene films formed on a first substrate and a second substrate with a resin layer that contains less than 1% by weight of a volatile component and has adhesiveness; and removing the first substrate.
The method for transferring a graphene film according to claim 1, wherein a content of the volatile component of the resin layer is 0.1% by weight or less.
The method for transferring a graphene film according to claim 1, wherein on the graphene film formed on the first substrate, the resin layer is coated.
The method for transferring a graphene film according to claim 1, wherein, after coating a resin layer that contains at least 1% by weight or more of a volatile component on the graphene film formed on the first substrate, the resin layer is dried to remove a volatile component to form the resin layer that contains less than 1% by weight of a volatile component and has adhesiveness.
The method for transferring a graphene film according to claim 1, wherein a thickness of the resin layer is 2 p m or more and 20 p m or less.
The method for transferring a graphene film according to claim 1, wherein the second substrate is a transparent substrate.
1 0. A method for manufacturing a transparent conductive film comprising the steps of: sticking one layer or a plurality of layers of graphene films formed on a first substrate and a second substrate with a resin layer that contains less than 1% by weight of a volatile component and has adhesiveness; and removing the first substrate.
The method for manufacturing a transparent conductive film according to claim 10, wherein a content of the volatile component of the resin layer is 0.1% by weight or less.
The method for manufacturing a transparent conductive film according to claim 10, wherein, after coating [[a]] the resin layer that contains at least Page 5 of 9 Application No. 13/992,308 Reply to Office Action of 1 % by weight or more of [[a]] the volatile component on the graphene film formed on the first substrate, the resin layer is dried to remove the volatile component to form the resin layer that contains less than 1% by weight of [[a]] the volatile component and has adhesiveness.
1 7. The method for manufacturing a transparent conductive film according to claim 10, wherein a thickness of the resin layer is 2 p m or more and 20 p m or less.
1 8. The method for manufacturing a transparent conductive film according to claim 10, wherein the second substrate is a transparent substrate. Page 6 of 9
Layer stacks claimed or described, ordered top of device to substrate.
transparent conductive film
Materials described outside the worked examples.
graphene film
resin layer
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1 D, the first substrate 11 is pressurized against the second substrate 14 to reduce a thickness of the resin layer 13 to a desired thickness. A …
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,384,875Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 D, the first substrate 11 is pressurized against the second substrate 14 to reduce a thickness of the resin layer 13 to a desired thickness. A …
FIG. 2B, on the graphene film 12, a resin layer 13 that contains at least 1% by weight or more of a volatile component and has adhesiveness is coated. A …
FIG. 3, it is found that, while graphene films of Comparative Examples 1, 2 have large sheet resistance and large in-plane distributions thereof, graphene films …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a graphene film comprising the steps of: sticking one layer or a plurality of layers of graphene films formed on a first substrate and a second substrate with a resin layer that contains less than 1% by weight of a volatile component and has adhesiveness; and removing the first substrate.
The method for transferring a graphene film according to claim 1, wherein a content of the volatile component of the resin layer is 0.1% by weight or less.
The method for transferring a graphene film according to claim 1, wherein on the graphene film formed on the first substrate, the resin layer is coated.
The method for transferring a graphene film according to claim 1, wherein, after coating a resin layer that contains at least 1% by weight or more of a volatile component on the graphene film formed on the first substrate, the resin layer is dried to remove a volatile component to form the resin layer that contains less than 1% by weight of a volatile component and has adhesiveness.
The method for transferring a graphene film according to claim 1, wherein a thickness of the resin layer is 2 p m or more and 20 p m or less.
The method for transferring a graphene film according to claim 1, wherein the second substrate is a transparent substrate.
1 0. A method for manufacturing a transparent conductive film comprising the steps of: sticking one layer or a plurality of layers of graphene films formed on a first substrate and a second substrate with a resin layer that contains less than 1% by weight of a volatile component and has adhesiveness; and removing the first substrate.
The method for manufacturing a transparent conductive film according to claim 10, wherein a content of the volatile component of the resin layer is 0.1% by weight or less.
The method for manufacturing a transparent conductive film according to claim 10, wherein, after coating [[a]] the resin layer that contains at least Page 5 of 9 Application No. 13/992,308 Reply to Office Action of 1 % by weight or more of [[a]] the volatile component on the graphene film formed on the first substrate, the resin layer is dried to remove the volatile component to form the resin layer that contains less than 1% by weight of [[a]] the volatile component and has adhesiveness.
1 7. The method for manufacturing a transparent conductive film according to claim 10, wherein a thickness of the resin layer is 2 p m or more and 20 p m or less.
1 8. The method for manufacturing a transparent conductive film according to claim 10, wherein the second substrate is a transparent substrate. Page 6 of 9
Layer stacks claimed or described, ordered top of device to substrate.
transparent conductive film
Materials described outside the worked examples.
graphene film
resin layer
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1 D, the first substrate 11 is pressurized against the second substrate 14 to reduce a thickness of the resin layer 13 to a desired thickness. A …
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,384,875Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 D, the first substrate 11 is pressurized against the second substrate 14 to reduce a thickness of the resin layer 13 to a desired thickness. A …
FIG. 2B, on the graphene film 12, a resin layer 13 that contains at least 1% by weight or more of a volatile component and has adhesiveness is coated. A …
FIG. 3, it is found that, while graphene films of Comparative Examples 1, 2 have large sheet resistance and large in-plane distributions thereof, graphene films …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a graphene film comprising the steps of: sticking one layer or a plurality of layers of graphene films formed on a first substrate and a second substrate with a resin layer that contains less than 1% by weight of a volatile component and has adhesiveness; and removing the first substrate.
The method for transferring a graphene film according to claim 1, wherein a content of the volatile component of the resin layer is 0.1% by weight or less.
The method for transferring a graphene film according to claim 1, wherein on the graphene film formed on the first substrate, the resin layer is coated.
The method for transferring a graphene film according to claim 1, wherein, after coating a resin layer that contains at least 1% by weight or more of a volatile component on the graphene film formed on the first substrate, the resin layer is dried to remove a volatile component to form the resin layer that contains less than 1% by weight of a volatile component and has adhesiveness.
The method for transferring a graphene film according to claim 1, wherein a thickness of the resin layer is 2 p m or more and 20 p m or less.
The method for transferring a graphene film according to claim 1, wherein the second substrate is a transparent substrate.
1 0. A method for manufacturing a transparent conductive film comprising the steps of: sticking one layer or a plurality of layers of graphene films formed on a first substrate and a second substrate with a resin layer that contains less than 1% by weight of a volatile component and has adhesiveness; and removing the first substrate.
The method for manufacturing a transparent conductive film according to claim 10, wherein a content of the volatile component of the resin layer is 0.1% by weight or less.
The method for manufacturing a transparent conductive film according to claim 10, wherein, after coating [[a]] the resin layer that contains at least Page 5 of 9 Application No. 13/992,308 Reply to Office Action of 1 % by weight or more of [[a]] the volatile component on the graphene film formed on the first substrate, the resin layer is dried to remove the volatile component to form the resin layer that contains less than 1% by weight of [[a]] the volatile component and has adhesiveness.
1 7. The method for manufacturing a transparent conductive film according to claim 10, wherein a thickness of the resin layer is 2 p m or more and 20 p m or less.
1 8. The method for manufacturing a transparent conductive film according to claim 10, wherein the second substrate is a transparent substrate. Page 6 of 9
Layer stacks claimed or described, ordered top of device to substrate.
transparent conductive film
Materials described outside the worked examples.
graphene film
resin layer
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1 D, the first substrate 11 is pressurized against the second substrate 14 to reduce a thickness of the resin layer 13 to a desired thickness. A …
Related documents with shared materials, methods, properties, or citations.
UV-curable resin
thermosetting resin
thermoplastic resin
FIG. 2B, on the graphene film 12, a resin layer 13 that contains at least 1% by weight or more of a volatile component and has adhesiveness is coated. A …
FIG. 3, it is found that, while graphene films of Comparative Examples 1, 2 have large sheet resistance and large in-plane distributions thereof, graphene films …
UV-curable resin
thermosetting resin
thermoplastic resin
FIG. 2B, on the graphene film 12, a resin layer 13 that contains at least 1% by weight or more of a volatile component and has adhesiveness is coated. A …
FIG. 3, it is found that, while graphene films of Comparative Examples 1, 2 have large sheet resistance and large in-plane distributions thereof, graphene films …
UV-curable resin
thermosetting resin
thermoplastic resin
FIG. 2B, on the graphene film 12, a resin layer 13 that contains at least 1% by weight or more of a volatile component and has adhesiveness is coated. A …
FIG. 3, it is found that, while graphene films of Comparative Examples 1, 2 have large sheet resistance and large in-plane distributions thereof, graphene films …
UV-curable resin
thermosetting resin
thermoplastic resin
FIG. 2B, on the graphene film 12, a resin layer 13 that contains at least 1% by weight or more of a volatile component and has adhesiveness is coated. A …
FIG. 3, it is found that, while graphene films of Comparative Examples 1, 2 have large sheet resistance and large in-plane distributions thereof, graphene films …