Patent
US 9,536,953Method for Making a Sensor Device Using a Graphene Layer
Klaus Elian
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 9,536,953Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
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The sensor device of claim 1 8, further comprising a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The sensor device of claim 1 8, wherein the opening has lateral dimensions which are equal or smaller than a distance between the electrical contacts.
The sensor device of claim 1 8, wherein the semiconductor chip comprises an integrated circuit configured to measure an electrical resistance between the electrical contacts coupled to the graphene layer.
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1 8. A sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a sensor housing that accommodates the semiconductor chip and the graphene layer, wherein the sensor housing comprises an opening located above the graphene layer.
The sensor device of claim 18, wherein the sensor housing comprises a molded encapsulating material.
The sensor device of claim 18, wherein the sensor housing is a hollow housing.
An arrangement comprising: a carrier comprising carrier contacts; and a sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a sensor housing that accommodates the semiconductor chip and the graphene layer, wherein the sensor housing comprises an opening located vertically above the graphene layer, and wherein the electrical contacts of the sensor device are electrically connected to the carrier contacts of the carrier.
The arrangement of claim 28, wherein the sensor device further comprises a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The arrangement of claim 28, wherein the opening has lateral dimensions which are equal or smaller than a distance between the electrical contacts.
The arrangement of claim 28, wherein the carrier is a printed circuit board (PCB).
The arrangement of claim 28, wherein the circuit.
An arrangement comprising: a leadframe; and a sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a housing that accommodates the semiconductor chip and the graphene layer, wherein the housing comprises an opening located above the graphene layer, and wherein the electrical contacts of the sensor device are electrically connected to the leadframe.
The arrangement of claim 33, wherein the sensor device further comprises a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The arrangement of claim 33, wherein the electrical contacts of the sensor device are electrically connected to the leadframe via bond wires.
The arrangement of claim 33, wherein the housing further accommodates a portion of the leadframe.
The arrangement of claim 33, wherein the housing comprises a molded encapsulating material.
The arrangement of claim 33, wherein the circuit. INF 2011 P 5 0 697 US o 2 Page 6 of 1 0 opening has lateral dimensions which are equal to electrical contact and the fourth chip electrical semiconductor chip comprises an integrated semiconductor chip comprises an integrated
A leadless package comprising: a metal chip pad, a first metal contact and a second metal contact disposed in a bottom surface of the leadless package; a semiconductor chip disposed on the metal chip pad; a first electrical contact and a second electrical contact disposed at a top surface of the semiconductor chip, wherein the semiconductor chip comprises an integrated circuit configured to measure an empirical parameter between the first electrical contact and the second electrical contact; a first metal layer connection and a second metal layer connection, wherein the first metal layer connection connects the first electrical contact to the first metal contact, and wherein the second metal layer connection connects the second electrical contact to the second metal contact; and a graphene layer disposed over the semiconductor chip, wherein the graphene layer connects the first electrical contact and the second electrical contact.
The leadless package of claim 38, further comprising a plastic material disposed over the graphene layer, wherein the plastic material completely covers the graphene layer.
A sensor device comprising: an encapsulation body; a semiconductor chip disposed in the encapsulation body; a redistribution layer disposed on the semiconductor chip and the encapsulation body, wherein a first trace of the redistribution layer connects a first chip electrical contact to a first INF 2011 P 5 0 697 US o 2 Page 5 of 10 contact terminal on a first area of the encapsulation body, and wherein a second trace of the redistribution layer connects a second chip electrical contact to a second contact terminal on a second area of the encapsulation body; and a graphene layer disposed over the semiconductor chip and connected to a third chip electrical contact and a fourth chip electrical contact, wherein the encapsulation body comprises an opening located above the graphene layer.
The sensor device of claim 41, wherein a plastic material is disposed over the graphene layer, wherein the opening exposes the plastic material.
The sensor device of claim 41, wherein the or smaller than a distance between the third chip contact.
Layer stacks claimed or described, ordered top of device to substrate.
sensor device with sensor housing
arrangement with carrier and sensor device
Materials described outside the worked examples.
graphene
plastic material
polyethylenterephtalate
Additional fabrication and treatment steps described in the patent.
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,536,953Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1-17. canceled
The sensor device of claim 1 8, further comprising a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The sensor device of claim 1 8, wherein the opening has lateral dimensions which are equal or smaller than a distance between the electrical contacts.
The sensor device of claim 1 8, wherein the semiconductor chip comprises an integrated circuit configured to measure an electrical resistance between the electrical contacts coupled to the graphene layer.
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1 8. A sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a sensor housing that accommodates the semiconductor chip and the graphene layer, wherein the sensor housing comprises an opening located above the graphene layer.
The sensor device of claim 18, wherein the sensor housing comprises a molded encapsulating material.
The sensor device of claim 18, wherein the sensor housing is a hollow housing.
An arrangement comprising: a carrier comprising carrier contacts; and a sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a sensor housing that accommodates the semiconductor chip and the graphene layer, wherein the sensor housing comprises an opening located vertically above the graphene layer, and wherein the electrical contacts of the sensor device are electrically connected to the carrier contacts of the carrier.
The arrangement of claim 28, wherein the sensor device further comprises a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The arrangement of claim 28, wherein the opening has lateral dimensions which are equal or smaller than a distance between the electrical contacts.
The arrangement of claim 28, wherein the carrier is a printed circuit board (PCB).
The arrangement of claim 28, wherein the circuit.
An arrangement comprising: a leadframe; and a sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a housing that accommodates the semiconductor chip and the graphene layer, wherein the housing comprises an opening located above the graphene layer, and wherein the electrical contacts of the sensor device are electrically connected to the leadframe.
The arrangement of claim 33, wherein the sensor device further comprises a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The arrangement of claim 33, wherein the electrical contacts of the sensor device are electrically connected to the leadframe via bond wires.
The arrangement of claim 33, wherein the housing further accommodates a portion of the leadframe.
The arrangement of claim 33, wherein the housing comprises a molded encapsulating material.
The arrangement of claim 33, wherein the circuit. INF 2011 P 5 0 697 US o 2 Page 6 of 1 0 opening has lateral dimensions which are equal to electrical contact and the fourth chip electrical semiconductor chip comprises an integrated semiconductor chip comprises an integrated
A leadless package comprising: a metal chip pad, a first metal contact and a second metal contact disposed in a bottom surface of the leadless package; a semiconductor chip disposed on the metal chip pad; a first electrical contact and a second electrical contact disposed at a top surface of the semiconductor chip, wherein the semiconductor chip comprises an integrated circuit configured to measure an empirical parameter between the first electrical contact and the second electrical contact; a first metal layer connection and a second metal layer connection, wherein the first metal layer connection connects the first electrical contact to the first metal contact, and wherein the second metal layer connection connects the second electrical contact to the second metal contact; and a graphene layer disposed over the semiconductor chip, wherein the graphene layer connects the first electrical contact and the second electrical contact.
The leadless package of claim 38, further comprising a plastic material disposed over the graphene layer, wherein the plastic material completely covers the graphene layer.
A sensor device comprising: an encapsulation body; a semiconductor chip disposed in the encapsulation body; a redistribution layer disposed on the semiconductor chip and the encapsulation body, wherein a first trace of the redistribution layer connects a first chip electrical contact to a first INF 2011 P 5 0 697 US o 2 Page 5 of 10 contact terminal on a first area of the encapsulation body, and wherein a second trace of the redistribution layer connects a second chip electrical contact to a second contact terminal on a second area of the encapsulation body; and a graphene layer disposed over the semiconductor chip and connected to a third chip electrical contact and a fourth chip electrical contact, wherein the encapsulation body comprises an opening located above the graphene layer.
The sensor device of claim 41, wherein a plastic material is disposed over the graphene layer, wherein the opening exposes the plastic material.
The sensor device of claim 41, wherein the or smaller than a distance between the third chip contact.
Layer stacks claimed or described, ordered top of device to substrate.
sensor device with sensor housing
arrangement with carrier and sensor device
Materials described outside the worked examples.
graphene
plastic material
polyethylenterephtalate
Additional fabrication and treatment steps described in the patent.
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,536,953Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1-17. canceled
The sensor device of claim 1 8, further comprising a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The sensor device of claim 1 8, wherein the opening has lateral dimensions which are equal or smaller than a distance between the electrical contacts.
The sensor device of claim 1 8, wherein the semiconductor chip comprises an integrated circuit configured to measure an electrical resistance between the electrical contacts coupled to the graphene layer.
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1 8. A sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a sensor housing that accommodates the semiconductor chip and the graphene layer, wherein the sensor housing comprises an opening located above the graphene layer.
The sensor device of claim 18, wherein the sensor housing comprises a molded encapsulating material.
The sensor device of claim 18, wherein the sensor housing is a hollow housing.
An arrangement comprising: a carrier comprising carrier contacts; and a sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a sensor housing that accommodates the semiconductor chip and the graphene layer, wherein the sensor housing comprises an opening located vertically above the graphene layer, and wherein the electrical contacts of the sensor device are electrically connected to the carrier contacts of the carrier.
The arrangement of claim 28, wherein the sensor device further comprises a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The arrangement of claim 28, wherein the opening has lateral dimensions which are equal or smaller than a distance between the electrical contacts.
The arrangement of claim 28, wherein the carrier is a printed circuit board (PCB).
The arrangement of claim 28, wherein the circuit.
An arrangement comprising: a leadframe; and a sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a housing that accommodates the semiconductor chip and the graphene layer, wherein the housing comprises an opening located above the graphene layer, and wherein the electrical contacts of the sensor device are electrically connected to the leadframe.
The arrangement of claim 33, wherein the sensor device further comprises a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The arrangement of claim 33, wherein the electrical contacts of the sensor device are electrically connected to the leadframe via bond wires.
The arrangement of claim 33, wherein the housing further accommodates a portion of the leadframe.
The arrangement of claim 33, wherein the housing comprises a molded encapsulating material.
The arrangement of claim 33, wherein the circuit. INF 2011 P 5 0 697 US o 2 Page 6 of 1 0 opening has lateral dimensions which are equal to electrical contact and the fourth chip electrical semiconductor chip comprises an integrated semiconductor chip comprises an integrated
A leadless package comprising: a metal chip pad, a first metal contact and a second metal contact disposed in a bottom surface of the leadless package; a semiconductor chip disposed on the metal chip pad; a first electrical contact and a second electrical contact disposed at a top surface of the semiconductor chip, wherein the semiconductor chip comprises an integrated circuit configured to measure an empirical parameter between the first electrical contact and the second electrical contact; a first metal layer connection and a second metal layer connection, wherein the first metal layer connection connects the first electrical contact to the first metal contact, and wherein the second metal layer connection connects the second electrical contact to the second metal contact; and a graphene layer disposed over the semiconductor chip, wherein the graphene layer connects the first electrical contact and the second electrical contact.
The leadless package of claim 38, further comprising a plastic material disposed over the graphene layer, wherein the plastic material completely covers the graphene layer.
A sensor device comprising: an encapsulation body; a semiconductor chip disposed in the encapsulation body; a redistribution layer disposed on the semiconductor chip and the encapsulation body, wherein a first trace of the redistribution layer connects a first chip electrical contact to a first INF 2011 P 5 0 697 US o 2 Page 5 of 10 contact terminal on a first area of the encapsulation body, and wherein a second trace of the redistribution layer connects a second chip electrical contact to a second contact terminal on a second area of the encapsulation body; and a graphene layer disposed over the semiconductor chip and connected to a third chip electrical contact and a fourth chip electrical contact, wherein the encapsulation body comprises an opening located above the graphene layer.
The sensor device of claim 41, wherein a plastic material is disposed over the graphene layer, wherein the opening exposes the plastic material.
The sensor device of claim 41, wherein the or smaller than a distance between the third chip contact.
Layer stacks claimed or described, ordered top of device to substrate.
sensor device with sensor housing
arrangement with carrier and sensor device
Materials described outside the worked examples.
graphene
plastic material
polyethylenterephtalate
Additional fabrication and treatment steps described in the patent.
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,536,953Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1-17. canceled
The sensor device of claim 1 8, further comprising a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The sensor device of claim 1 8, wherein the opening has lateral dimensions which are equal or smaller than a distance between the electrical contacts.
The sensor device of claim 1 8, wherein the semiconductor chip comprises an integrated circuit configured to measure an electrical resistance between the electrical contacts coupled to the graphene layer.
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1 8. A sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a sensor housing that accommodates the semiconductor chip and the graphene layer, wherein the sensor housing comprises an opening located above the graphene layer.
The sensor device of claim 18, wherein the sensor housing comprises a molded encapsulating material.
The sensor device of claim 18, wherein the sensor housing is a hollow housing.
An arrangement comprising: a carrier comprising carrier contacts; and a sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a sensor housing that accommodates the semiconductor chip and the graphene layer, wherein the sensor housing comprises an opening located vertically above the graphene layer, and wherein the electrical contacts of the sensor device are electrically connected to the carrier contacts of the carrier.
The arrangement of claim 28, wherein the sensor device further comprises a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The arrangement of claim 28, wherein the opening has lateral dimensions which are equal or smaller than a distance between the electrical contacts.
The arrangement of claim 28, wherein the carrier is a printed circuit board (PCB).
The arrangement of claim 28, wherein the circuit.
An arrangement comprising: a leadframe; and a sensor device comprising: a semiconductor chip; a graphene layer disposed over the semiconductor chip; electrical contacts coupled to the graphene layer; and a housing that accommodates the semiconductor chip and the graphene layer, wherein the housing comprises an opening located above the graphene layer, and wherein the electrical contacts of the sensor device are electrically connected to the leadframe.
The arrangement of claim 33, wherein the sensor device further comprises a plastic material disposed over the graphene layer, wherein the opening exposes the plastic material.
The arrangement of claim 33, wherein the electrical contacts of the sensor device are electrically connected to the leadframe via bond wires.
The arrangement of claim 33, wherein the housing further accommodates a portion of the leadframe.
The arrangement of claim 33, wherein the housing comprises a molded encapsulating material.
The arrangement of claim 33, wherein the circuit. INF 2011 P 5 0 697 US o 2 Page 6 of 1 0 opening has lateral dimensions which are equal to electrical contact and the fourth chip electrical semiconductor chip comprises an integrated semiconductor chip comprises an integrated
A leadless package comprising: a metal chip pad, a first metal contact and a second metal contact disposed in a bottom surface of the leadless package; a semiconductor chip disposed on the metal chip pad; a first electrical contact and a second electrical contact disposed at a top surface of the semiconductor chip, wherein the semiconductor chip comprises an integrated circuit configured to measure an empirical parameter between the first electrical contact and the second electrical contact; a first metal layer connection and a second metal layer connection, wherein the first metal layer connection connects the first electrical contact to the first metal contact, and wherein the second metal layer connection connects the second electrical contact to the second metal contact; and a graphene layer disposed over the semiconductor chip, wherein the graphene layer connects the first electrical contact and the second electrical contact.
The leadless package of claim 38, further comprising a plastic material disposed over the graphene layer, wherein the plastic material completely covers the graphene layer.
A sensor device comprising: an encapsulation body; a semiconductor chip disposed in the encapsulation body; a redistribution layer disposed on the semiconductor chip and the encapsulation body, wherein a first trace of the redistribution layer connects a first chip electrical contact to a first INF 2011 P 5 0 697 US o 2 Page 5 of 10 contact terminal on a first area of the encapsulation body, and wherein a second trace of the redistribution layer connects a second chip electrical contact to a second contact terminal on a second area of the encapsulation body; and a graphene layer disposed over the semiconductor chip and connected to a third chip electrical contact and a fourth chip electrical contact, wherein the encapsulation body comprises an opening located above the graphene layer.
The sensor device of claim 41, wherein a plastic material is disposed over the graphene layer, wherein the opening exposes the plastic material.
The sensor device of claim 41, wherein the or smaller than a distance between the third chip contact.
Layer stacks claimed or described, ordered top of device to substrate.
sensor device with sensor housing
arrangement with carrier and sensor device
Materials described outside the worked examples.
graphene
plastic material
polyethylenterephtalate
Additional fabrication and treatment steps described in the patent.
Related documents with shared materials, methods, properties, or citations.
arrangement with leadframe and sensor device
leadless package
fan-out sensor device with redistribution layer
polyvinylidene
polyvinylidene chloride
ENHANCED SENSITIVITY OF GRAPHENE GAS SENSORS USING MOLECULAR DOPING
arrangement with leadframe and sensor device
leadless package
fan-out sensor device with redistribution layer
polyvinylidene
polyvinylidene chloride
ENHANCED SENSITIVITY OF GRAPHENE GAS SENSORS USING MOLECULAR DOPING
arrangement with leadframe and sensor device
leadless package
fan-out sensor device with redistribution layer
polyvinylidene
polyvinylidene chloride
ENHANCED SENSITIVITY OF GRAPHENE GAS SENSORS USING MOLECULAR DOPING
arrangement with leadframe and sensor device
leadless package
fan-out sensor device with redistribution layer
polyvinylidene
polyvinylidene chloride