Patent
US 9,596,788HEXAGONAL BORON NITRIDE HEAT DISSIPATION STRUCTURE
Chung-Ping LAI
US
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Patent
Atlas literature
Patent
US 9,596,788Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic view illustrating the assembly of a hexagonal boron nitride heat dissipation structure according to a 25 preferred embodiment of the …
FIG. 2 is another schematic view illustrating the assembly of the hexagonal boron nitride heat dissipation structure according to the preferred embodiment of …
FIG. 3 is a schematic diagram illustrating thermal 5 conductivity of h-BN film on various thicknesses according to the preferred embodiment of the present …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A hexagonal boron nitride heat dissipation structure comprising: a plurality of electronic components, plural thermally conductive buffer layers, and an electronic conductive heat dissipation element; wherein said each electronic component is fixed onto said thermally conductive buffer layer; wherein each thermally conductive buffer layer is made of hexagonal boron nitride with thermal conductivity ranging from 10 10 to 40 W/mk, and a total thickness of said each layer is at least larger than 0.01 mm with robust strength so as to hold the electronics; and wherein the electronic conductive heat dissipation element C is metal skin or is made in a heat dissipation coating manner.
The hexagonal boron nitride heat dissipation structure as 15 claimed in claim 1, wherein said each electronic component is fixed onto said thermally conductive buffer layer by thermally conductive glue or directly molded.
The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat 20 dissipation element is made of coating materials in the heat dissipation coating manner, the coating materials include any one of carbon materials, metal particles, far infrared-ray radiation oxide, and nitride powders.
The hexagonal boron nitride heat dissipation structure as 25 claimed in claim 1, wherein when the electronic conductive heat 9 dissipation element is made of carbon materials in the heat dissipation coating manner, the carbon materials include any one of graphene, carbon black, graphite, carbon nanotubes, activated carbon, and natural graphite.
5 5. The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat dissipation element is made of metal particles in the heat dissipation coating manner, the metal particles include any one of Cu, Ni, Zn, Fe, Co, Ag, Au, Pt and their alloys.
10 6. The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat dissipation element is made of far infrared-ray radiation powders in the heat dissipation coating manner, the far infrared-ray radiation powders include any one of SiO 2, A 12O 3, TiO 2, ZrO 2, ZrC, SiC, TaC, 15 TiB 2, ZrB 2, TiSi 2, Si 3 N 4, TiN, and BN.
Layer stacks claimed or described, ordered top of device to substrate.
hexagonal boron nitride heat dissipation structure
Materials described outside the worked examples.
hexagonal boron nitride
hBN
thermally conductive glue
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductivity of hBN thermally conductive buffer layer | 10–40 W/mK | hBN |
minimum total thickness of hBN thermally conductive buffer layer | ≥ 0.01 mm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,596,788Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic view illustrating the assembly of a hexagonal boron nitride heat dissipation structure according to a 25 preferred embodiment of the …
FIG. 2 is another schematic view illustrating the assembly of the hexagonal boron nitride heat dissipation structure according to the preferred embodiment of …
FIG. 3 is a schematic diagram illustrating thermal 5 conductivity of h-BN film on various thicknesses according to the preferred embodiment of the present …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A hexagonal boron nitride heat dissipation structure comprising: a plurality of electronic components, plural thermally conductive buffer layers, and an electronic conductive heat dissipation element; wherein said each electronic component is fixed onto said thermally conductive buffer layer; wherein each thermally conductive buffer layer is made of hexagonal boron nitride with thermal conductivity ranging from 10 10 to 40 W/mk, and a total thickness of said each layer is at least larger than 0.01 mm with robust strength so as to hold the electronics; and wherein the electronic conductive heat dissipation element C is metal skin or is made in a heat dissipation coating manner.
The hexagonal boron nitride heat dissipation structure as 15 claimed in claim 1, wherein said each electronic component is fixed onto said thermally conductive buffer layer by thermally conductive glue or directly molded.
The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat 20 dissipation element is made of coating materials in the heat dissipation coating manner, the coating materials include any one of carbon materials, metal particles, far infrared-ray radiation oxide, and nitride powders.
The hexagonal boron nitride heat dissipation structure as 25 claimed in claim 1, wherein when the electronic conductive heat 9 dissipation element is made of carbon materials in the heat dissipation coating manner, the carbon materials include any one of graphene, carbon black, graphite, carbon nanotubes, activated carbon, and natural graphite.
5 5. The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat dissipation element is made of metal particles in the heat dissipation coating manner, the metal particles include any one of Cu, Ni, Zn, Fe, Co, Ag, Au, Pt and their alloys.
10 6. The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat dissipation element is made of far infrared-ray radiation powders in the heat dissipation coating manner, the far infrared-ray radiation powders include any one of SiO 2, A 12O 3, TiO 2, ZrO 2, ZrC, SiC, TaC, 15 TiB 2, ZrB 2, TiSi 2, Si 3 N 4, TiN, and BN.
Layer stacks claimed or described, ordered top of device to substrate.
hexagonal boron nitride heat dissipation structure
Materials described outside the worked examples.
hexagonal boron nitride
hBN
thermally conductive glue
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductivity of hBN thermally conductive buffer layer | 10–40 W/mK | hBN |
minimum total thickness of hBN thermally conductive buffer layer | ≥ 0.01 mm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,596,788Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic view illustrating the assembly of a hexagonal boron nitride heat dissipation structure according to a 25 preferred embodiment of the …
FIG. 2 is another schematic view illustrating the assembly of the hexagonal boron nitride heat dissipation structure according to the preferred embodiment of …
FIG. 3 is a schematic diagram illustrating thermal 5 conductivity of h-BN film on various thicknesses according to the preferred embodiment of the present …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A hexagonal boron nitride heat dissipation structure comprising: a plurality of electronic components, plural thermally conductive buffer layers, and an electronic conductive heat dissipation element; wherein said each electronic component is fixed onto said thermally conductive buffer layer; wherein each thermally conductive buffer layer is made of hexagonal boron nitride with thermal conductivity ranging from 10 10 to 40 W/mk, and a total thickness of said each layer is at least larger than 0.01 mm with robust strength so as to hold the electronics; and wherein the electronic conductive heat dissipation element C is metal skin or is made in a heat dissipation coating manner.
The hexagonal boron nitride heat dissipation structure as 15 claimed in claim 1, wherein said each electronic component is fixed onto said thermally conductive buffer layer by thermally conductive glue or directly molded.
The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat 20 dissipation element is made of coating materials in the heat dissipation coating manner, the coating materials include any one of carbon materials, metal particles, far infrared-ray radiation oxide, and nitride powders.
The hexagonal boron nitride heat dissipation structure as 25 claimed in claim 1, wherein when the electronic conductive heat 9 dissipation element is made of carbon materials in the heat dissipation coating manner, the carbon materials include any one of graphene, carbon black, graphite, carbon nanotubes, activated carbon, and natural graphite.
5 5. The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat dissipation element is made of metal particles in the heat dissipation coating manner, the metal particles include any one of Cu, Ni, Zn, Fe, Co, Ag, Au, Pt and their alloys.
10 6. The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat dissipation element is made of far infrared-ray radiation powders in the heat dissipation coating manner, the far infrared-ray radiation powders include any one of SiO 2, A 12O 3, TiO 2, ZrO 2, ZrC, SiC, TaC, 15 TiB 2, ZrB 2, TiSi 2, Si 3 N 4, TiN, and BN.
Layer stacks claimed or described, ordered top of device to substrate.
hexagonal boron nitride heat dissipation structure
Materials described outside the worked examples.
hexagonal boron nitride
hBN
thermally conductive glue
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductivity of hBN thermally conductive buffer layer | 10–40 W/mK | hBN |
minimum total thickness of hBN thermally conductive buffer layer | ≥ 0.01 mm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,596,788Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic view illustrating the assembly of a hexagonal boron nitride heat dissipation structure according to a 25 preferred embodiment of the …
FIG. 2 is another schematic view illustrating the assembly of the hexagonal boron nitride heat dissipation structure according to the preferred embodiment of …
FIG. 3 is a schematic diagram illustrating thermal 5 conductivity of h-BN film on various thicknesses according to the preferred embodiment of the present …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A hexagonal boron nitride heat dissipation structure comprising: a plurality of electronic components, plural thermally conductive buffer layers, and an electronic conductive heat dissipation element; wherein said each electronic component is fixed onto said thermally conductive buffer layer; wherein each thermally conductive buffer layer is made of hexagonal boron nitride with thermal conductivity ranging from 10 10 to 40 W/mk, and a total thickness of said each layer is at least larger than 0.01 mm with robust strength so as to hold the electronics; and wherein the electronic conductive heat dissipation element C is metal skin or is made in a heat dissipation coating manner.
The hexagonal boron nitride heat dissipation structure as 15 claimed in claim 1, wherein said each electronic component is fixed onto said thermally conductive buffer layer by thermally conductive glue or directly molded.
The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat 20 dissipation element is made of coating materials in the heat dissipation coating manner, the coating materials include any one of carbon materials, metal particles, far infrared-ray radiation oxide, and nitride powders.
The hexagonal boron nitride heat dissipation structure as 25 claimed in claim 1, wherein when the electronic conductive heat 9 dissipation element is made of carbon materials in the heat dissipation coating manner, the carbon materials include any one of graphene, carbon black, graphite, carbon nanotubes, activated carbon, and natural graphite.
5 5. The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat dissipation element is made of metal particles in the heat dissipation coating manner, the metal particles include any one of Cu, Ni, Zn, Fe, Co, Ag, Au, Pt and their alloys.
10 6. The hexagonal boron nitride heat dissipation structure as claimed in claim 1, wherein when the electronic conductive heat dissipation element is made of far infrared-ray radiation powders in the heat dissipation coating manner, the far infrared-ray radiation powders include any one of SiO 2, A 12O 3, TiO 2, ZrO 2, ZrC, SiC, TaC, 15 TiB 2, ZrB 2, TiSi 2, Si 3 N 4, TiN, and BN.
Layer stacks claimed or described, ordered top of device to substrate.
hexagonal boron nitride heat dissipation structure
Materials described outside the worked examples.
hexagonal boron nitride
hBN
thermally conductive glue
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductivity of hBN thermally conductive buffer layer | 10–40 W/mK | hBN |
minimum total thickness of hBN thermally conductive buffer layer | ≥ 0.01 mm |
Related documents with shared materials, methods, properties, or citations.
carbon materials
metal particles
far infrared-ray radiation oxide
nitride powders
graphene
carbon black
graphite
carbon nanotubes
activated carbon
natural graphite
metal particles (Cu, Ni, Zn, Fe, Co, Ag, Au, Pt and alloys)
far infrared-ray radiation powders (SiO2, Al₂O3, TiO2, ZrO2, ZrC, SiC, TaC, TiB2, ZrB2, TiSi2, Si₃N4, TiN, BN)
metal skin
in-plane thermal conductivity of hBN (background) | 400 W/mK | hBN |
— | 10–40 W | — |
carbon materials
metal particles
far infrared-ray radiation oxide
nitride powders
graphene
carbon black
graphite
carbon nanotubes
activated carbon
natural graphite
metal particles (Cu, Ni, Zn, Fe, Co, Ag, Au, Pt and alloys)
far infrared-ray radiation powders (SiO2, Al₂O3, TiO2, ZrO2, ZrC, SiC, TaC, TiB2, ZrB2, TiSi2, Si₃N4, TiN, BN)
metal skin
in-plane thermal conductivity of hBN (background) | 400 W/mK | hBN |
— | 10–40 W | — |
carbon materials
metal particles
far infrared-ray radiation oxide
nitride powders
graphene
carbon black
graphite
carbon nanotubes
activated carbon
natural graphite
metal particles (Cu, Ni, Zn, Fe, Co, Ag, Au, Pt and alloys)
far infrared-ray radiation powders (SiO2, Al₂O3, TiO2, ZrO2, ZrC, SiC, TaC, TiB2, ZrB2, TiSi2, Si₃N4, TiN, BN)
metal skin
in-plane thermal conductivity of hBN (background) | 400 W/mK | hBN |
— | 10–40 W | — |
carbon materials
metal particles
far infrared-ray radiation oxide
nitride powders
graphene
carbon black
graphite
carbon nanotubes
activated carbon
natural graphite
metal particles (Cu, Ni, Zn, Fe, Co, Ag, Au, Pt and alloys)
far infrared-ray radiation powders (SiO2, Al₂O3, TiO2, ZrO2, ZrC, SiC, TaC, TiB2, ZrB2, TiSi2, Si₃N4, TiN, BN)
metal skin
in-plane thermal conductivity of hBN (background) | 400 W/mK | hBN |
— | 10–40 W | — |