Patent
US 9,994,752ethylene glycol
C₂H₆O₂
| — |
copper oxide thermal conductivity | 76.5 W/m.K | — |
silicon oxide thermal conductivity | 1.38 W/m.K | — |
water thermal conductivity | 0.613 W/m.K | H₂O |
monoethylene glycol thermal conductivity | 0.252 W/m.K | — |
typical oil thermal conductivity | 0.107 W/m.K | — |
Thickness | 50–350 nm | — |
Thickness | 5–20 nm | — |
ethylene glycol
C₂H₆O₂
| — |
copper oxide thermal conductivity | 76.5 W/m.K | — |
silicon oxide thermal conductivity | 1.38 W/m.K | — |
water thermal conductivity | 0.613 W/m.K | H₂O |
monoethylene glycol thermal conductivity | 0.252 W/m.K | — |
typical oil thermal conductivity | 0.107 W/m.K | — |
Thickness | 50–350 nm | — |
Thickness | 5–20 nm | — |
ethylene glycol
C₂H₆O₂
| — |
copper oxide thermal conductivity | 76.5 W/m.K | — |
silicon oxide thermal conductivity | 1.38 W/m.K | — |
water thermal conductivity | 0.613 W/m.K | H₂O |
monoethylene glycol thermal conductivity | 0.252 W/m.K | — |
typical oil thermal conductivity | 0.107 W/m.K | — |
Thickness | 50–350 nm | — |
Thickness | 5–20 nm | — |
ethylene glycol
C₂H₆O₂
| — |
copper oxide thermal conductivity | 76.5 W/m.K | — |
silicon oxide thermal conductivity | 1.38 W/m.K | — |
water thermal conductivity | 0.613 W/m.K | H₂O |
monoethylene glycol thermal conductivity | 0.252 W/m.K | — |
typical oil thermal conductivity | 0.107 W/m.K | — |
Thickness | 50–350 nm | — |
Thickness | 5–20 nm | — |