Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Eric Han Wang; Weijia Yan; Ruihong Huang

doi:10.1557/s43579-025-00913-8

Paper details

Research paper

TheoreticalComputational Multiscale

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Eric Han Wang, Weijia Yan, Ruihong Huang

2025·10.1557/s43579-025-00913-8·arXiv:2510.11461

Samples

Each sample groups how it was prepared, characterized, and measured. Click a card to expand.

COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.

6 properties

SimulatedBNStudied Material

COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.

6 properties

SimulatedSiSubstrate / Dielectric

Materials

hexagonal boron nitride

Studied Material

Also known as

h-BN

studied material

silicon

Substrate / Dielectric

Also known as

Why these are connected

Related documents with shared materials, methods, properties, or citations.

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer | Matter42 Literature

Properties

Type	Label	Value	Material	Sample	Source
Thermal Conductivity	in-plane	751W/m·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Thermal Conductivity	through-plane	2–20W/m·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Thermal Conductivity	in-plane	130–150W/m·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Thermal Conductivity	through-plane	130–150W/m·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Coefficient Of Thermal Expansion	CTE	1–4 × 10⁻⁶/K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Coefficient Of Thermal Expansion	CTE	~2.6 × 10⁻⁶/K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Specific Heat Capacity	Cp	~0.8J/g·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Specific Heat Capacity	Cp	~0.7J/g·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Hotspot Temperature	GPU hotspot temperature	315°C	BN Si	COMSOL-modeled 3D AI chip architecture with an h-BN interpos COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Hotspot Temperature	temperature reduction with h-BN vs Si interposer	20°C	BN Si	COMSOL-modeled 3D AI chip architecture with an h-BN interpos COMSOL-modeled 3D AI chip architecture with a silicon interp	—

Properties

Type	Label	Value	Material	Sample	Source
Thermal Conductivity	in-plane	751W/m·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Thermal Conductivity	through-plane	2–20W/m·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Thermal Conductivity	in-plane	130–150W/m·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Thermal Conductivity	through-plane	130–150W/m·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Coefficient Of Thermal Expansion	CTE	1–4 × 10⁻⁶/K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Coefficient Of Thermal Expansion	CTE	~2.6 × 10⁻⁶/K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Specific Heat Capacity	Cp	~0.8J/g·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Specific Heat Capacity	Cp	~0.7J/g·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Hotspot Temperature	GPU hotspot temperature	315°C	BN Si	COMSOL-modeled 3D AI chip architecture with an h-BN interpos COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Hotspot Temperature	temperature reduction with h-BN vs Si interposer	20°C	BN Si	COMSOL-modeled 3D AI chip architecture with an h-BN interpos COMSOL-modeled 3D AI chip architecture with a silicon interp	—

Properties

Type	Label	Value	Material	Sample	Source
Thermal Conductivity	in-plane	751W/m·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Thermal Conductivity	through-plane	2–20W/m·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Thermal Conductivity	in-plane	130–150W/m·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Thermal Conductivity	through-plane	130–150W/m·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Coefficient Of Thermal Expansion	CTE	1–4 × 10⁻⁶/K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Coefficient Of Thermal Expansion	CTE	~2.6 × 10⁻⁶/K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Specific Heat Capacity	Cp	~0.8J/g·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Specific Heat Capacity	Cp	~0.7J/g·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Hotspot Temperature	GPU hotspot temperature	315°C	BN Si	COMSOL-modeled 3D AI chip architecture with an h-BN interpos COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Hotspot Temperature	temperature reduction with h-BN vs Si interposer	20°C	BN Si	COMSOL-modeled 3D AI chip architecture with an h-BN interpos COMSOL-modeled 3D AI chip architecture with a silicon interp	—

Properties

Type	Label	Value	Material	Sample	Source
Thermal Conductivity	in-plane	751W/m·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Thermal Conductivity	through-plane	2–20W/m·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Thermal Conductivity	in-plane	130–150W/m·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Thermal Conductivity	through-plane	130–150W/m·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Coefficient Of Thermal Expansion	CTE	1–4 × 10⁻⁶/K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Coefficient Of Thermal Expansion	CTE	~2.6 × 10⁻⁶/K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Specific Heat Capacity	Cp	~0.8J/g·K	BN	COMSOL-modeled 3D AI chip architecture with an h-BN interpos	—
Specific Heat Capacity	Cp	~0.7J/g·K	Si	COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Hotspot Temperature	GPU hotspot temperature	315°C	BN Si	COMSOL-modeled 3D AI chip architecture with an h-BN interpos COMSOL-modeled 3D AI chip architecture with a silicon interp	—
Hotspot Temperature	temperature reduction with h-BN vs Si interposer	20°C	BN Si	COMSOL-modeled 3D AI chip architecture with an h-BN interpos COMSOL-modeled 3D AI chip architecture with a silicon interp	—

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Samples

COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.

COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.

Materials

Why these are connected

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Samples

COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.

COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.

Materials

Why these are connected

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Samples

COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.

COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.

Materials

Why these are connected

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Samples

COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.

COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.

Materials

Why these are connected

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Samples

COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.

COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.

Materials

Why these are connected

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Samples

COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.

COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.

Materials

Why these are connected

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Samples

COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.

COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.

Materials

Why these are connected

Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer

Samples

COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.

COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.

Materials

Why these are connected

Properties

Simulations

Properties

Simulations

Properties

Simulations

Properties

Simulations