Research paperTheoreticalComputational MultiscaleThermal Analysis of 3D GPU-Memory Architectures with Boron Nitride InterposerEric Han Wang, Weijia Yan, Ruihong Huang2025·10.1557/s43579-025-00913-8·arXiv:2510.11461AbstractAs artificial intelligence (AI) chips become more powerful, the thermal management capabilities of conventional silicon (Si) substrates become insufficient for 3D-stacked designs. This work integrates electrically insulative and thermally conductive hexagonal boron nitride (h-BN) interposers into AI chips for effective thermal management. Using COMSOL Multiphysics, the effects of High-Bandwidth Memory (HBM) distributions and thermal interface material configurations on heat dissipation and hotspot mitigation were studied. A 20 °C reduction in hot spots was achieved using h-BN interposers compared to Si interposers. Such an improvement could reduce AI chips' power leakage by 22% and significantly enhance their thermal performance.Read more
COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.6 propertiesSimulatedBNStudied MaterialExpand
COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.6 propertiesSimulatedSiSubstrate / DielectricExpand
Research paperTheoreticalComputational MultiscaleThermal Analysis of 3D GPU-Memory Architectures with Boron Nitride InterposerEric Han Wang, Weijia Yan, Ruihong Huang2025·10.1557/s43579-025-00913-8·arXiv:2510.11461AbstractAs artificial intelligence (AI) chips become more powerful, the thermal management capabilities of conventional silicon (Si) substrates become insufficient for 3D-stacked designs. This work integrates electrically insulative and thermally conductive hexagonal boron nitride (h-BN) interposers into AI chips for effective thermal management. Using COMSOL Multiphysics, the effects of High-Bandwidth Memory (HBM) distributions and thermal interface material configurations on heat dissipation and hotspot mitigation were studied. A 20 °C reduction in hot spots was achieved using h-BN interposers compared to Si interposers. Such an improvement could reduce AI chips' power leakage by 22% and significantly enhance their thermal performance.Read more
COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.6 propertiesSimulatedBNStudied MaterialExpand
COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.6 propertiesSimulatedSiSubstrate / DielectricExpand
Research paperTheoreticalComputational MultiscaleThermal Analysis of 3D GPU-Memory Architectures with Boron Nitride InterposerEric Han Wang, Weijia Yan, Ruihong Huang2025·10.1557/s43579-025-00913-8·arXiv:2510.11461AbstractAs artificial intelligence (AI) chips become more powerful, the thermal management capabilities of conventional silicon (Si) substrates become insufficient for 3D-stacked designs. This work integrates electrically insulative and thermally conductive hexagonal boron nitride (h-BN) interposers into AI chips for effective thermal management. Using COMSOL Multiphysics, the effects of High-Bandwidth Memory (HBM) distributions and thermal interface material configurations on heat dissipation and hotspot mitigation were studied. A 20 °C reduction in hot spots was achieved using h-BN interposers compared to Si interposers. Such an improvement could reduce AI chips' power leakage by 22% and significantly enhance their thermal performance.Read more
COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.6 propertiesSimulatedBNStudied MaterialExpand
COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.6 propertiesSimulatedSiSubstrate / DielectricExpand
Research paperTheoreticalComputational MultiscaleThermal Analysis of 3D GPU-Memory Architectures with Boron Nitride InterposerEric Han Wang, Weijia Yan, Ruihong Huang2025·10.1557/s43579-025-00913-8·arXiv:2510.11461AbstractAs artificial intelligence (AI) chips become more powerful, the thermal management capabilities of conventional silicon (Si) substrates become insufficient for 3D-stacked designs. This work integrates electrically insulative and thermally conductive hexagonal boron nitride (h-BN) interposers into AI chips for effective thermal management. Using COMSOL Multiphysics, the effects of High-Bandwidth Memory (HBM) distributions and thermal interface material configurations on heat dissipation and hotspot mitigation were studied. A 20 °C reduction in hot spots was achieved using h-BN interposers compared to Si interposers. Such an improvement could reduce AI chips' power leakage by 22% and significantly enhance their thermal performance.Read more
COMSOL-modeled 3D AI chip architecture with an h-BN interposer used for thermal management comparison.6 propertiesSimulatedBNStudied MaterialExpand
COMSOL-modeled 3D AI chip architecture with a silicon interposer used as the reference thermal-management case.6 propertiesSimulatedSiSubstrate / DielectricExpand
