Figure 1 is a schematic ill ustrat in g the action of the rm al in terface material, which fills the gaps between two contacting surfaces. The heat removal generally improves -4- with higher ther m al conductivity, smaller bond lin e thickness and contact resistance of the material. [0014 1

Figure 2 is an example thermal in terface material in accordance with certain embodiments described herein. [0015 1

Figure 3 i llustrates the synthesis and characterization of certa in embodiments of graphene-multilayer graphene (MLG) polymer nanocomposite TIMs as described herein (a) graphite source material, (b) li quid-phase exfoliated graphene and MLG in solution; (c) SEM image of MLG revealing overlapping …

Figure 4 illustrates the thermal conductivity enhancement in certa in embodiments of graphene-MLG-nanocomposite epoxy TIMs as described herein. (a) Measured thermal conductivity enhancement factor as a fraction of the filler volume loading fraction. Note an e xtremely large enhancement of ~ 2300 % …

Figure 5 i llustrates the calculated the rm al conductivity of graphene-MLG- polymer TIMs in accordance with certain embodiments described herein: (a) Comparison of thermal conductivity of MGL (n = 5) and CNTs based TIMs Note the dependence of the rmal conductivity of CNT composites on the aspect …

Figure 6 is a flowchart of an example method 200 of manufacturing a thermal in terface material 100 in accordance with certain embodiments described here in. -5- [0019 1

Figure 7 is a schematic of an example hybrid graphene-MLG epoxy composite TIM process. [0020 1

Figure 8 shows an example method of determining the weight of the utilized materials-natural graphite and sodium cholate. [0021 1

Figure 9 shows an example solution after the first ultraso ni cation in accordance with certain embodiments described herein. [0022 1

Figure 10 shows an example epoxy resin mixed with curing agent under continuous sti rr ing in accordance with certain embodiments described herein. [0023 1

Figure 11 shows an example oven used for cur ing [0024 1

Figure 12 shows prepared graphene-MLG-hybrid epoxy TIMs in accordance with certa in embodiments described herein [0025 1

Figure 13 is a schematic diagram illustrating an example LASER Flash tech ni que. [0026 1

Figure 14 shows (a) an example laser flash equipment used for the measurements; and (b) an example sample holder. [0027 1

Figure 15 is an example thermal interface material in accordance with certain embodiments described here in. [0028 1

Figure 16 is a flowchart of an example method of manufacturing a thermal in terface material in accordance with certa in embodiments described herein [0029 1

Figure 17 shows (a) an example optical image of graphene solution; and (b) an example electron diffraction pattern of the graphene sample show in g crystall inin ty of graphene flakes. [0030 1

Figure 18 shows a schematic of (a) an example sta in less steel mold; and (b) example silver epoxy/graphene molded disks. [0031 1

Figure 19 illustrates the thermal conductivity of pristine silver epoxy, certain embodiments of silver epoxy/graphene composites, and silver epoxy/carbon black composites as a function of vol % of graphene filler. Dotted lin es are to guide eyes [0032 1

Figure 20 illustrates the thermal conductivity as a function of temperature for epoxy/graphene composites with different vol% of graphene in accordance with certa in embodiments described herein. -6-

Figure 21 i s a schematic of an example of L i -ion batteries inside the battery pack in accordance with certain embodiments described herein. The space between the battery cylinders can be filled not with phase change materials (PCM) but with the graphene- based TIMs.

Figure 1 is a schematic ill ustrat in g the action of the rm al in terface material, which fills the gaps between two contacting surfaces. The heat removal generally improves -4- with higher ther m al conductivity, smaller bond lin e thickness and contact resistance of the material. [0014 1

Figure 2 is an example thermal in terface material in accordance with certain embodiments described herein. [0015 1

Figure 3 i llustrates the synthesis and characterization of certa in embodiments of graphene-multilayer graphene (MLG) polymer nanocomposite TIMs as described herein (a) graphite source material, (b) li quid-phase exfoliated graphene and MLG in solution; (c) SEM image of MLG revealing overlapping …

Figure 4 illustrates the thermal conductivity enhancement in certa in embodiments of graphene-MLG-nanocomposite epoxy TIMs as described herein. (a) Measured thermal conductivity enhancement factor as a fraction of the filler volume loading fraction. Note an e xtremely large enhancement of ~ 2300 % …

Figure 5 i llustrates the calculated the rm al conductivity of graphene-MLG- polymer TIMs in accordance with certain embodiments described herein: (a) Comparison of thermal conductivity of MGL (n = 5) and CNTs based TIMs Note the dependence of the rmal conductivity of CNT composites on the aspect …

Figure 6 is a flowchart of an example method 200 of manufacturing a thermal in terface material 100 in accordance with certain embodiments described here in. -5- [0019 1

Figure 7 is a schematic of an example hybrid graphene-MLG epoxy composite TIM process. [0020 1

Figure 8 shows an example method of determining the weight of the utilized materials-natural graphite and sodium cholate. [0021 1

Figure 9 shows an example solution after the first ultraso ni cation in accordance with certain embodiments described herein. [0022 1

Figure 10 shows an example epoxy resin mixed with curing agent under continuous sti rr ing in accordance with certain embodiments described herein. [0023 1

Figure 11 shows an example oven used for cur ing [0024 1

Figure 12 shows prepared graphene-MLG-hybrid epoxy TIMs in accordance with certa in embodiments described herein [0025 1

Figure 13 is a schematic diagram illustrating an example LASER Flash tech ni que. [0026 1

Figure 14 shows (a) an example laser flash equipment used for the measurements; and (b) an example sample holder. [0027 1

Figure 15 is an example thermal interface material in accordance with certain embodiments described here in. [0028 1

Figure 16 is a flowchart of an example method of manufacturing a thermal in terface material in accordance with certa in embodiments described herein [0029 1

Figure 17 shows (a) an example optical image of graphene solution; and (b) an example electron diffraction pattern of the graphene sample show in g crystall inin ty of graphene flakes. [0030 1

Figure 18 shows a schematic of (a) an example sta in less steel mold; and (b) example silver epoxy/graphene molded disks. [0031 1

Figure 19 illustrates the thermal conductivity of pristine silver epoxy, certain embodiments of silver epoxy/graphene composites, and silver epoxy/carbon black composites as a function of vol % of graphene filler. Dotted lin es are to guide eyes [0032 1

Figure 20 illustrates the thermal conductivity as a function of temperature for epoxy/graphene composites with different vol% of graphene in accordance with certa in embodiments described herein. -6-

Figure 21 i s a schematic of an example of L i -ion batteries inside the battery pack in accordance with certain embodiments described herein. The space between the battery cylinders can be filled not with phase change materials (PCM) but with the graphene- based TIMs.

Figure 1 is a schematic ill ustrat in g the action of the rm al in terface material, which fills the gaps between two contacting surfaces. The heat removal generally improves -4- with higher ther m al conductivity, smaller bond lin e thickness and contact resistance of the material. [0014 1

Figure 2 is an example thermal in terface material in accordance with certain embodiments described herein. [0015 1

Figure 3 i llustrates the synthesis and characterization of certa in embodiments of graphene-multilayer graphene (MLG) polymer nanocomposite TIMs as described herein (a) graphite source material, (b) li quid-phase exfoliated graphene and MLG in solution; (c) SEM image of MLG revealing overlapping …

Figure 4 illustrates the thermal conductivity enhancement in certa in embodiments of graphene-MLG-nanocomposite epoxy TIMs as described herein. (a) Measured thermal conductivity enhancement factor as a fraction of the filler volume loading fraction. Note an e xtremely large enhancement of ~ 2300 % …

Figure 5 i llustrates the calculated the rm al conductivity of graphene-MLG- polymer TIMs in accordance with certain embodiments described herein: (a) Comparison of thermal conductivity of MGL (n = 5) and CNTs based TIMs Note the dependence of the rmal conductivity of CNT composites on the aspect …

Figure 6 is a flowchart of an example method 200 of manufacturing a thermal in terface material 100 in accordance with certain embodiments described here in. -5- [0019 1

Figure 7 is a schematic of an example hybrid graphene-MLG epoxy composite TIM process. [0020 1

Figure 8 shows an example method of determining the weight of the utilized materials-natural graphite and sodium cholate. [0021 1

Figure 9 shows an example solution after the first ultraso ni cation in accordance with certain embodiments described herein. [0022 1

Figure 10 shows an example epoxy resin mixed with curing agent under continuous sti rr ing in accordance with certain embodiments described herein. [0023 1

Figure 11 shows an example oven used for cur ing [0024 1

Figure 12 shows prepared graphene-MLG-hybrid epoxy TIMs in accordance with certa in embodiments described herein [0025 1

Figure 13 is a schematic diagram illustrating an example LASER Flash tech ni que. [0026 1

Figure 14 shows (a) an example laser flash equipment used for the measurements; and (b) an example sample holder. [0027 1

Figure 15 is an example thermal interface material in accordance with certain embodiments described here in. [0028 1

Figure 16 is a flowchart of an example method of manufacturing a thermal in terface material in accordance with certa in embodiments described herein [0029 1

Figure 17 shows (a) an example optical image of graphene solution; and (b) an example electron diffraction pattern of the graphene sample show in g crystall inin ty of graphene flakes. [0030 1

Figure 18 shows a schematic of (a) an example sta in less steel mold; and (b) example silver epoxy/graphene molded disks. [0031 1

Figure 19 illustrates the thermal conductivity of pristine silver epoxy, certain embodiments of silver epoxy/graphene composites, and silver epoxy/carbon black composites as a function of vol % of graphene filler. Dotted lin es are to guide eyes [0032 1

Figure 20 illustrates the thermal conductivity as a function of temperature for epoxy/graphene composites with different vol% of graphene in accordance with certa in embodiments described herein. -6-

Figure 21 i s a schematic of an example of L i -ion batteries inside the battery pack in accordance with certain embodiments described herein. The space between the battery cylinders can be filled not with phase change materials (PCM) but with the graphene- based TIMs.

Figure 1 is a schematic ill ustrat in g the action of the rm al in terface material, which fills the gaps between two contacting surfaces. The heat removal generally improves -4- with higher ther m al conductivity, smaller bond lin e thickness and contact resistance of the material. [0014 1

Figure 2 is an example thermal in terface material in accordance with certain embodiments described herein. [0015 1

Figure 3 i llustrates the synthesis and characterization of certa in embodiments of graphene-multilayer graphene (MLG) polymer nanocomposite TIMs as described herein (a) graphite source material, (b) li quid-phase exfoliated graphene and MLG in solution; (c) SEM image of MLG revealing overlapping …

Figure 4 illustrates the thermal conductivity enhancement in certa in embodiments of graphene-MLG-nanocomposite epoxy TIMs as described herein. (a) Measured thermal conductivity enhancement factor as a fraction of the filler volume loading fraction. Note an e xtremely large enhancement of ~ 2300 % …

Figure 5 i llustrates the calculated the rm al conductivity of graphene-MLG- polymer TIMs in accordance with certain embodiments described herein: (a) Comparison of thermal conductivity of MGL (n = 5) and CNTs based TIMs Note the dependence of the rmal conductivity of CNT composites on the aspect …

Figure 6 is a flowchart of an example method 200 of manufacturing a thermal in terface material 100 in accordance with certain embodiments described here in. -5- [0019 1

Figure 7 is a schematic of an example hybrid graphene-MLG epoxy composite TIM process. [0020 1

Figure 8 shows an example method of determining the weight of the utilized materials-natural graphite and sodium cholate. [0021 1

Figure 9 shows an example solution after the first ultraso ni cation in accordance with certain embodiments described herein. [0022 1

Figure 10 shows an example epoxy resin mixed with curing agent under continuous sti rr ing in accordance with certain embodiments described herein. [0023 1

Figure 11 shows an example oven used for cur ing [0024 1

Figure 12 shows prepared graphene-MLG-hybrid epoxy TIMs in accordance with certa in embodiments described herein [0025 1

Figure 13 is a schematic diagram illustrating an example LASER Flash tech ni que. [0026 1

Figure 14 shows (a) an example laser flash equipment used for the measurements; and (b) an example sample holder. [0027 1

Figure 15 is an example thermal interface material in accordance with certain embodiments described here in. [0028 1

Figure 16 is a flowchart of an example method of manufacturing a thermal in terface material in accordance with certa in embodiments described herein [0029 1

Figure 17 shows (a) an example optical image of graphene solution; and (b) an example electron diffraction pattern of the graphene sample show in g crystall inin ty of graphene flakes. [0030 1

Figure 18 shows a schematic of (a) an example sta in less steel mold; and (b) example silver epoxy/graphene molded disks. [0031 1

Figure 19 illustrates the thermal conductivity of pristine silver epoxy, certain embodiments of silver epoxy/graphene composites, and silver epoxy/carbon black composites as a function of vol % of graphene filler. Dotted lin es are to guide eyes [0032 1

Figure 20 illustrates the thermal conductivity as a function of temperature for epoxy/graphene composites with different vol% of graphene in accordance with certa in embodiments described herein. -6-

Figure 21 i s a schematic of an example of L i -ion batteries inside the battery pack in accordance with certain embodiments described herein. The space between the battery cylinders can be filled not with phase change materials (PCM) but with the graphene- based TIMs.