Research paper
Experimental GrowthExperimental CharacterizationEach sample groups how it was prepared, characterized, and measured. Click a card to expand.
1 preparation3 characterizations10 properties4 figures
1 preparation5 characterizations11 properties7 figures
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Xrd Peak Two Theta | (003) | 14.82deg | — | |||
| Xrd Peak Two Theta | (003) | 14.03deg | — | |||
| Xrd D Spacing | interlayer spacing | 6angstrom | — | |||
| Xrd D Spacing | interlayer spacing | 6.3angstrom | — | |||
| Substrate Thickness | flake thickness | 1.57nm | — | |||
| Substrate Thickness | flake thickness | 9.7nm | — | |||
| Raman Peak | mode | 146cm⁻¹ | — | |||
| Raman Peak | mode | 206cm⁻¹ | — | |||
| Raman Peak | mode | 276cm⁻¹ | — | |||
| Raman Peak | mode | 323cm⁻¹ | — | |||
| Raman Peak | mode | 401cm⁻¹ | — | |||
| Raman Peak | mode | 158cm⁻¹ | — | |||
| Raman Peak | mode | 260cm⁻¹ | — | |||
| Raman Peak | mode | 315cm⁻¹ | — | |||
| Raman Peak | E2g | 380cm⁻¹ | — | |||
| Raman Peak | E2g | 380cm⁻¹ | — | |||
| Raman Intensity Ratio | I(T)/I₀ | decreases significantly above 80°C | — | |||
| Raman Intensity Ratio | I(T)/I₀ | decreases only above 300°C | — | |||
| Atomic Ratio | Cu atomic ratio | 0.08 | — | |||
| Transport Behavior | electrical behavior | insulating hopping transport | — | |||
| Temperature Coefficient Of Resistance | TCR | -4 ~ -2%·K⁻¹ | — |
Related documents with shared materials, methods, properties, or citations.
Dative epitaxy of commensurate monocrystalline covalent-van der Waals moiré supercrystal
Fe-assisted epitaxial growth of 4-inch single-crystal transition-metal dichalcogenides on c-plane sapphire without miscut angle
Substrate induced optimization of the Electrocatalytic Hydrogen Evolution Reaction (HER) performances of MoS2 thin films
CMOS-compatible Strain Engineering for High-Performance Monolayer Semiconductor Transistors
Janus-induced atomic reconstruction amplifies twist-angle modulation of interlayer thermal transport in moiré bilayers
NOVEL PROCESS FOR SCALABLE SYNTHESIS OF MOLYBDENUM DISULFIDE MONOLAYER AND FEW-LAYER FILMS
METHOD FOR FORMING HEXAGONAL BORON NITRIDE THIN FILM, METHOD FOR FORMING MULTI-LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SWITCHING ELEMENT USING THE SAME
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
1 preparation3 characterizations10 properties4 figures
1 preparation5 characterizations11 properties7 figures
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Xrd Peak Two Theta | (003) | 14.82deg | — | |||
| Xrd Peak Two Theta | (003) | 14.03deg | — | |||
| Xrd D Spacing | interlayer spacing | 6angstrom | — | |||
| Xrd D Spacing | interlayer spacing | 6.3angstrom | — | |||
| Substrate Thickness | flake thickness | 1.57nm | — | |||
| Substrate Thickness | flake thickness | 9.7nm | — | |||
| Raman Peak | mode | 146cm⁻¹ | — | |||
| Raman Peak | mode | 206cm⁻¹ | — | |||
| Raman Peak | mode | 276cm⁻¹ | — | |||
| Raman Peak | mode | 323cm⁻¹ | — | |||
| Raman Peak | mode | 401cm⁻¹ | — | |||
| Raman Peak | mode | 158cm⁻¹ | — | |||
| Raman Peak | mode | 260cm⁻¹ | — | |||
| Raman Peak | mode | 315cm⁻¹ | — | |||
| Raman Peak | E2g | 380cm⁻¹ | — | |||
| Raman Peak | E2g | 380cm⁻¹ | — | |||
| Raman Intensity Ratio | I(T)/I₀ | decreases significantly above 80°C | — | |||
| Raman Intensity Ratio | I(T)/I₀ | decreases only above 300°C | — | |||
| Atomic Ratio | Cu atomic ratio | 0.08 | — | |||
| Transport Behavior | electrical behavior | insulating hopping transport | — | |||
| Temperature Coefficient Of Resistance | TCR | -4 ~ -2%·K⁻¹ | — |
Related documents with shared materials, methods, properties, or citations.
Dative epitaxy of commensurate monocrystalline covalent-van der Waals moiré supercrystal
Fe-assisted epitaxial growth of 4-inch single-crystal transition-metal dichalcogenides on c-plane sapphire without miscut angle
Substrate induced optimization of the Electrocatalytic Hydrogen Evolution Reaction (HER) performances of MoS2 thin films
CMOS-compatible Strain Engineering for High-Performance Monolayer Semiconductor Transistors
Janus-induced atomic reconstruction amplifies twist-angle modulation of interlayer thermal transport in moiré bilayers
NOVEL PROCESS FOR SCALABLE SYNTHESIS OF MOLYBDENUM DISULFIDE MONOLAYER AND FEW-LAYER FILMS
METHOD FOR FORMING HEXAGONAL BORON NITRIDE THIN FILM, METHOD FOR FORMING MULTI-LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SWITCHING ELEMENT USING THE SAME
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
1 preparation3 characterizations10 properties4 figures
1 preparation5 characterizations11 properties7 figures
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Xrd Peak Two Theta | (003) | 14.82deg | — | |||
| Xrd Peak Two Theta | (003) | 14.03deg | — | |||
| Xrd D Spacing | interlayer spacing | 6angstrom | — | |||
| Xrd D Spacing | interlayer spacing | 6.3angstrom | — | |||
| Substrate Thickness | flake thickness | 1.57nm | — | |||
| Substrate Thickness | flake thickness | 9.7nm | — | |||
| Raman Peak | mode | 146cm⁻¹ | — | |||
| Raman Peak | mode | 206cm⁻¹ | — | |||
| Raman Peak | mode | 276cm⁻¹ | — | |||
| Raman Peak | mode | 323cm⁻¹ | — | |||
| Raman Peak | mode | 401cm⁻¹ | — | |||
| Raman Peak | mode | 158cm⁻¹ | — | |||
| Raman Peak | mode | 260cm⁻¹ | — | |||
| Raman Peak | mode | 315cm⁻¹ | — | |||
| Raman Peak | E2g | 380cm⁻¹ | — | |||
| Raman Peak | E2g | 380cm⁻¹ | — | |||
| Raman Intensity Ratio | I(T)/I₀ | decreases significantly above 80°C | — | |||
| Raman Intensity Ratio | I(T)/I₀ | decreases only above 300°C | — | |||
| Atomic Ratio | Cu atomic ratio | 0.08 | — | |||
| Transport Behavior | electrical behavior | insulating hopping transport | — | |||
| Temperature Coefficient Of Resistance | TCR | -4 ~ -2%·K⁻¹ | — |
Related documents with shared materials, methods, properties, or citations.
Dative epitaxy of commensurate monocrystalline covalent-van der Waals moiré supercrystal
Fe-assisted epitaxial growth of 4-inch single-crystal transition-metal dichalcogenides on c-plane sapphire without miscut angle
Substrate induced optimization of the Electrocatalytic Hydrogen Evolution Reaction (HER) performances of MoS2 thin films
CMOS-compatible Strain Engineering for High-Performance Monolayer Semiconductor Transistors
Janus-induced atomic reconstruction amplifies twist-angle modulation of interlayer thermal transport in moiré bilayers
NOVEL PROCESS FOR SCALABLE SYNTHESIS OF MOLYBDENUM DISULFIDE MONOLAYER AND FEW-LAYER FILMS
METHOD FOR FORMING HEXAGONAL BORON NITRIDE THIN FILM, METHOD FOR FORMING MULTI-LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SWITCHING ELEMENT USING THE SAME
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
1 preparation3 characterizations10 properties4 figures
1 preparation5 characterizations11 properties7 figures
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Xrd Peak Two Theta | (003) | 14.82deg | — | |||
| Xrd Peak Two Theta | (003) | 14.03deg | — | |||
| Xrd D Spacing | interlayer spacing | 6angstrom | — | |||
| Xrd D Spacing | interlayer spacing | 6.3angstrom | — | |||
| Substrate Thickness | flake thickness | 1.57nm | — | |||
| Substrate Thickness | flake thickness | 9.7nm | — | |||
| Raman Peak | mode | 146cm⁻¹ | — | |||
| Raman Peak | mode | 206cm⁻¹ | — | |||
| Raman Peak | mode | 276cm⁻¹ | — | |||
| Raman Peak | mode | 323cm⁻¹ | — | |||
| Raman Peak | mode | 401cm⁻¹ | — | |||
| Raman Peak | mode | 158cm⁻¹ | — | |||
| Raman Peak | mode | 260cm⁻¹ | — | |||
| Raman Peak | mode | 315cm⁻¹ | — | |||
| Raman Peak | E2g | 380cm⁻¹ | — | |||
| Raman Peak | E2g | 380cm⁻¹ | — | |||
| Raman Intensity Ratio | I(T)/I₀ | decreases significantly above 80°C | — | |||
| Raman Intensity Ratio | I(T)/I₀ | decreases only above 300°C | — | |||
| Atomic Ratio | Cu atomic ratio | 0.08 | — | |||
| Transport Behavior | electrical behavior | insulating hopping transport | — | |||
| Temperature Coefficient Of Resistance | TCR | -4 ~ -2%·K⁻¹ | — |
Related documents with shared materials, methods, properties, or citations.
Dative epitaxy of commensurate monocrystalline covalent-van der Waals moiré supercrystal
Fe-assisted epitaxial growth of 4-inch single-crystal transition-metal dichalcogenides on c-plane sapphire without miscut angle
Substrate induced optimization of the Electrocatalytic Hydrogen Evolution Reaction (HER) performances of MoS2 thin films
CMOS-compatible Strain Engineering for High-Performance Monolayer Semiconductor Transistors
Janus-induced atomic reconstruction amplifies twist-angle modulation of interlayer thermal transport in moiré bilayers
NOVEL PROCESS FOR SCALABLE SYNTHESIS OF MOLYBDENUM DISULFIDE MONOLAYER AND FEW-LAYER FILMS
METHOD FOR FORMING HEXAGONAL BORON NITRIDE THIN FILM, METHOD FOR FORMING MULTI-LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SWITCHING ELEMENT USING THE SAME