Patent
US 10,113,230FORMATION METHOD OF HEXAGONAL BORON NITRIDE THICK FILM ON A SUBSTRATE AND HEXAGONAL BORON NITRIDE THICK FILM LAMINATES THEREBY
Soo-Min KIM
US
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Patent
Atlas literature
Patent
US 10,113,230Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a flowchart of a method of producing a multilayer h-BN thick film on a substrate according to an aspect of the present disclosure. First, summing the …
FIG. 2 is a conceptual diagram of a method of producing a multilayer h-BN thick film on a substrate according to an aspect of the present disclosure.
FIG. 3 is a conceptual diagram illustrating a second substrate forming step of 10 forming a second substrate on a h-BN thick film and a h-BN thick film …
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
FIG. 5A shows a result of observing the surface of the h-BN thick film separated 10 from the iron foil through the example 2 using an optical microscope, and it …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of forming a multilayer hexagonal boron nitride (h-BN) thick film on a substrate, the method comprising: (a) a substrate heating step of heating a first substrate Koflprisingwrm_(L; (b) a h-BN precursor supply step of supplying h-BN precursors co ri sin gn borazjine Bi;NI-i to the heated first substrate; (c) a precursor dissolving step of dissolving the supplied h-BN precursors in the first substrate; -a, (d) a substrate cooling step of cooling the first substrate containing the dissolved h-BN precursors therein'a,
The method of forming a multilayer h-BN thick film on a substrate according to claim 1, after the substrate cooling step further comprising: a second substrate forming step of forming a second substrate on the cooled substrate.
A hexagonal boron nitride (h-BN) thick film laminate comprising: a multilayer h-BN thick film prepared by a method according to claim 1; and a substrate which forms a stack structure with the h-BN thick film. withdrawn
. canceled
A hexagonal boron nitride (h-BN) thick film laminate comprising: a multilayer h-BN thick film prepared by a method according claim 6; and a substrate which forms a stack structure with the h-BN thick film. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
h-BN thick film laminate
Materials described outside the worked examples.
hexagonal boron nitride thick film
BN
borazine
B₃N₃H₆
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
Table 1
First Au Cu Fe Mn Ni Co Pd Ti Pt substrate j _ _ _ _ _ _ _ _ _ _ _ _ Melting temperature 1
The following table 1 enumerates the types of metals usable as a first substrate a
p. 6
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,113,230Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a flowchart of a method of producing a multilayer h-BN thick film on a substrate according to an aspect of the present disclosure. First, summing the …
FIG. 2 is a conceptual diagram of a method of producing a multilayer h-BN thick film on a substrate according to an aspect of the present disclosure.
FIG. 3 is a conceptual diagram illustrating a second substrate forming step of 10 forming a second substrate on a h-BN thick film and a h-BN thick film …
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
FIG. 5A shows a result of observing the surface of the h-BN thick film separated 10 from the iron foil through the example 2 using an optical microscope, and it …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of forming a multilayer hexagonal boron nitride (h-BN) thick film on a substrate, the method comprising: (a) a substrate heating step of heating a first substrate Koflprisingwrm_(L; (b) a h-BN precursor supply step of supplying h-BN precursors co ri sin gn borazjine Bi;NI-i to the heated first substrate; (c) a precursor dissolving step of dissolving the supplied h-BN precursors in the first substrate; -a, (d) a substrate cooling step of cooling the first substrate containing the dissolved h-BN precursors therein'a,
The method of forming a multilayer h-BN thick film on a substrate according to claim 1, after the substrate cooling step further comprising: a second substrate forming step of forming a second substrate on the cooled substrate.
A hexagonal boron nitride (h-BN) thick film laminate comprising: a multilayer h-BN thick film prepared by a method according to claim 1; and a substrate which forms a stack structure with the h-BN thick film. withdrawn
. canceled
A hexagonal boron nitride (h-BN) thick film laminate comprising: a multilayer h-BN thick film prepared by a method according claim 6; and a substrate which forms a stack structure with the h-BN thick film. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
h-BN thick film laminate
Materials described outside the worked examples.
hexagonal boron nitride thick film
BN
borazine
B₃N₃H₆
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
Table 1
First Au Cu Fe Mn Ni Co Pd Ti Pt substrate j _ _ _ _ _ _ _ _ _ _ _ _ Melting temperature 1
The following table 1 enumerates the types of metals usable as a first substrate a
p. 6
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,113,230Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a flowchart of a method of producing a multilayer h-BN thick film on a substrate according to an aspect of the present disclosure. First, summing the …
FIG. 2 is a conceptual diagram of a method of producing a multilayer h-BN thick film on a substrate according to an aspect of the present disclosure.
FIG. 3 is a conceptual diagram illustrating a second substrate forming step of 10 forming a second substrate on a h-BN thick film and a h-BN thick film …
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
FIG. 5A shows a result of observing the surface of the h-BN thick film separated 10 from the iron foil through the example 2 using an optical microscope, and it …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of forming a multilayer hexagonal boron nitride (h-BN) thick film on a substrate, the method comprising: (a) a substrate heating step of heating a first substrate Koflprisingwrm_(L; (b) a h-BN precursor supply step of supplying h-BN precursors co ri sin gn borazjine Bi;NI-i to the heated first substrate; (c) a precursor dissolving step of dissolving the supplied h-BN precursors in the first substrate; -a, (d) a substrate cooling step of cooling the first substrate containing the dissolved h-BN precursors therein'a,
The method of forming a multilayer h-BN thick film on a substrate according to claim 1, after the substrate cooling step further comprising: a second substrate forming step of forming a second substrate on the cooled substrate.
A hexagonal boron nitride (h-BN) thick film laminate comprising: a multilayer h-BN thick film prepared by a method according to claim 1; and a substrate which forms a stack structure with the h-BN thick film. withdrawn
. canceled
A hexagonal boron nitride (h-BN) thick film laminate comprising: a multilayer h-BN thick film prepared by a method according claim 6; and a substrate which forms a stack structure with the h-BN thick film. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
h-BN thick film laminate
Materials described outside the worked examples.
hexagonal boron nitride thick film
BN
borazine
B₃N₃H₆
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
Table 1
First Au Cu Fe Mn Ni Co Pd Ti Pt substrate j _ _ _ _ _ _ _ _ _ _ _ _ Melting temperature 1
The following table 1 enumerates the types of metals usable as a first substrate a
p. 6
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,113,230Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a flowchart of a method of producing a multilayer h-BN thick film on a substrate according to an aspect of the present disclosure. First, summing the …
FIG. 2 is a conceptual diagram of a method of producing a multilayer h-BN thick film on a substrate according to an aspect of the present disclosure.
FIG. 3 is a conceptual diagram illustrating a second substrate forming step of 10 forming a second substrate on a h-BN thick film and a h-BN thick film …
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
FIG. 5A shows a result of observing the surface of the h-BN thick film separated 10 from the iron foil through the example 2 using an optical microscope, and it …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of forming a multilayer hexagonal boron nitride (h-BN) thick film on a substrate, the method comprising: (a) a substrate heating step of heating a first substrate Koflprisingwrm_(L; (b) a h-BN precursor supply step of supplying h-BN precursors co ri sin gn borazjine Bi;NI-i to the heated first substrate; (c) a precursor dissolving step of dissolving the supplied h-BN precursors in the first substrate; -a, (d) a substrate cooling step of cooling the first substrate containing the dissolved h-BN precursors therein'a,
The method of forming a multilayer h-BN thick film on a substrate according to claim 1, after the substrate cooling step further comprising: a second substrate forming step of forming a second substrate on the cooled substrate.
A hexagonal boron nitride (h-BN) thick film laminate comprising: a multilayer h-BN thick film prepared by a method according to claim 1; and a substrate which forms a stack structure with the h-BN thick film. withdrawn
. canceled
A hexagonal boron nitride (h-BN) thick film laminate comprising: a multilayer h-BN thick film prepared by a method according claim 6; and a substrate which forms a stack structure with the h-BN thick film. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
h-BN thick film laminate
Materials described outside the worked examples.
hexagonal boron nitride thick film
BN
borazine
B₃N₃H₆
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
Table 1
First Au Cu Fe Mn Ni Co Pd Ti Pt substrate j _ _ _ _ _ _ _ _ _ _ _ _ Melting temperature 1
The following table 1 enumerates the types of metals usable as a first substrate a
p. 6
Related documents with shared materials, methods, properties, or citations.
first substrate (metal catalyst)
second substrate
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
FIG. 5A shows a result of observing the surface of the h-BN thick film separated 10 from the iron foil through the example 2 using an optical microscope, and it …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
first substrate (metal catalyst)
second substrate
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
FIG. 5A shows a result of observing the surface of the h-BN thick film separated 10 from the iron foil through the example 2 using an optical microscope, and it …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
first substrate (metal catalyst)
second substrate
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
FIG. 5A shows a result of observing the surface of the h-BN thick film separated 10 from the iron foil through the example 2 using an optical microscope, and it …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
first substrate (metal catalyst)
second substrate
FIG. 4A shows a result of observing the surface of h-BN on the h-BN/iron foil using a field emission scanning electronic microscope (FE-SEM) through the example …
FIG. 5A shows a result of observing the surface of the h-BN thick film separated 10 from the iron foil through the example 2 using an optical microscope, and it …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …
FIG. 6 illustrates Raman peaks based on a thickness change of a h-BN thick film produced according to an aspect of the present disclosure. DISCLOSURE FOR …