Patent
US 8,784,980A FILM PREPARED FROM A CASTING COMPOSITION COMPRISING A POLYMER
Pui-Yan Lin
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 8,784,980Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 is a schematic representation of the structure of a hexagonal boron nitride particle. Figure 2a is a transmission electron micrograph (TEM) of the platelet edges of hBN as received (Comparative Example A). Figure 2b is a TEM of the platelet edges of the SMhBN prepared 20 according to …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A film having a thickness of less than 500 pm comprising a polymer and a plurality of surface-modified hexagonal boron nitride ("SMhBN") particles dispersed erwttherewithin, the surface modified boron nitride particle comprising a hexagonal boron nitride particle reacted with a substituted p hen y l diazonium chloride represented by the structure (1): X NN CI- R, (I) to covalently bond a substituted p henyl radical to the surface of the hexa g onal boron nitride particle, the substituted phenyl radical being represented by the structure (l: wherein X is a radical selected from NH₂--, HO--, R₂ 0C (O)--, R₂C(O)O --, HS O 3--, NH₂ CO --, halogens, alkyl and substituted or unsubstituted aryl; wherein R ' is hydrogen, alkyl or alkoxy, and R₂ is hydrogen, alkyl, or substituted or unsubstituted aryl.
The film of Claim 1 wherein R ' is hydrogen, and X is NH₂--.
The film of Claim 1 wherein R ' is hydrogen, and X is.HO--.
The film of Claim 1 wherein the polymer is polyamic acid.
The film of Claim 1 wherein the polymer is polyimide.
The film of Claim 1 wherein the polymer is a cured epoxy resin composition.
The film of Claim 1 wherein the polymer is an uncured epoxy resin composition.
The film of Claim 1 wherein the SMhBN particles have a size within the range of 0.5 to 50 pm.
The process of Claim 1 wherein the polymer is polyamic acid. withdrawn
The process of Claim 1 wherein the polymer is an uncured epoxy resin composition. withdrawn
A process comprising casting onto a release surface a dispersion of a plurality of surface modified hexagonal boron nitride particles in a solution of a polymer in a solvent, forming the thus cast dispersion into a viscous liquid film, and, extracting the solvent to form a film having a thickness of less than 500 pm; wherein the surface modified hexagonal boron nitride particles comprise hexagonal boron nitride particles having a surface and a substituted phenyl radical bonded thereto, the substituted phenyl radical being represented by the structure: \/RI wherein X is a radical selected from NH₂--, HO--, R₂ O C(O)--, R₂C(O)O --, HS O 3--, NH₂CO--, halogens, alkyl and substituted or unsubstituted aryl; wherein R ' is alkyl or alkoxy, and R₂ is hydrogen, alkyl, or substituted or unsubstituted aryl.. withdrawn
The process of Claim 10 wherein R ' is hydrogen, and X is N H₂--. withdrawn
The process of Claim 10 wherein R ' is hydrogen, and X is HO-. withdrawn
The process of Claim 10 wherein the SMhBN particles have a size within the range of 0.5 to 50 pm. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
polymer composite film with SMhBN
Materials described outside the worked examples.
surface-modified hexagonal boron nitride (SMhBN)
hexagonal boron nitride
hBN
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
Figure 1 is a schematic representation of the structure of a hexagonal boron nitride particle. Figure 2a is a transmission electron micrograph (TEM) of the platelet edges of hBN as received (Comparative Example A). Figure 2b is a TEM of the platelet edges of the SMhBN prepared 20 according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
substituted phenyl radical concentration on SMhBN surface | 1.93 wt% | surface-modified hexagonal boron nitride (SMhBN) |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 8,784,980Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 is a schematic representation of the structure of a hexagonal boron nitride particle. Figure 2a is a transmission electron micrograph (TEM) of the platelet edges of hBN as received (Comparative Example A). Figure 2b is a TEM of the platelet edges of the SMhBN prepared 20 according to …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A film having a thickness of less than 500 pm comprising a polymer and a plurality of surface-modified hexagonal boron nitride ("SMhBN") particles dispersed erwttherewithin, the surface modified boron nitride particle comprising a hexagonal boron nitride particle reacted with a substituted p hen y l diazonium chloride represented by the structure (1): X NN CI- R, (I) to covalently bond a substituted p henyl radical to the surface of the hexa g onal boron nitride particle, the substituted phenyl radical being represented by the structure (l: wherein X is a radical selected from NH₂--, HO--, R₂ 0C (O)--, R₂C(O)O --, HS O 3--, NH₂ CO --, halogens, alkyl and substituted or unsubstituted aryl; wherein R ' is hydrogen, alkyl or alkoxy, and R₂ is hydrogen, alkyl, or substituted or unsubstituted aryl.
The film of Claim 1 wherein R ' is hydrogen, and X is NH₂--.
The film of Claim 1 wherein R ' is hydrogen, and X is.HO--.
The film of Claim 1 wherein the polymer is polyamic acid.
The film of Claim 1 wherein the polymer is polyimide.
The film of Claim 1 wherein the polymer is a cured epoxy resin composition.
The film of Claim 1 wherein the polymer is an uncured epoxy resin composition.
The film of Claim 1 wherein the SMhBN particles have a size within the range of 0.5 to 50 pm.
The process of Claim 1 wherein the polymer is polyamic acid. withdrawn
The process of Claim 1 wherein the polymer is an uncured epoxy resin composition. withdrawn
A process comprising casting onto a release surface a dispersion of a plurality of surface modified hexagonal boron nitride particles in a solution of a polymer in a solvent, forming the thus cast dispersion into a viscous liquid film, and, extracting the solvent to form a film having a thickness of less than 500 pm; wherein the surface modified hexagonal boron nitride particles comprise hexagonal boron nitride particles having a surface and a substituted phenyl radical bonded thereto, the substituted phenyl radical being represented by the structure: \/RI wherein X is a radical selected from NH₂--, HO--, R₂ O C(O)--, R₂C(O)O --, HS O 3--, NH₂CO--, halogens, alkyl and substituted or unsubstituted aryl; wherein R ' is alkyl or alkoxy, and R₂ is hydrogen, alkyl, or substituted or unsubstituted aryl.. withdrawn
The process of Claim 10 wherein R ' is hydrogen, and X is N H₂--. withdrawn
The process of Claim 10 wherein R ' is hydrogen, and X is HO-. withdrawn
The process of Claim 10 wherein the SMhBN particles have a size within the range of 0.5 to 50 pm. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
polymer composite film with SMhBN
Materials described outside the worked examples.
surface-modified hexagonal boron nitride (SMhBN)
hexagonal boron nitride
hBN
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
Figure 1 is a schematic representation of the structure of a hexagonal boron nitride particle. Figure 2a is a transmission electron micrograph (TEM) of the platelet edges of hBN as received (Comparative Example A). Figure 2b is a TEM of the platelet edges of the SMhBN prepared 20 according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
substituted phenyl radical concentration on SMhBN surface | 1.93 wt% | surface-modified hexagonal boron nitride (SMhBN) |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 8,784,980Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 is a schematic representation of the structure of a hexagonal boron nitride particle. Figure 2a is a transmission electron micrograph (TEM) of the platelet edges of hBN as received (Comparative Example A). Figure 2b is a TEM of the platelet edges of the SMhBN prepared 20 according to …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A film having a thickness of less than 500 pm comprising a polymer and a plurality of surface-modified hexagonal boron nitride ("SMhBN") particles dispersed erwttherewithin, the surface modified boron nitride particle comprising a hexagonal boron nitride particle reacted with a substituted p hen y l diazonium chloride represented by the structure (1): X NN CI- R, (I) to covalently bond a substituted p henyl radical to the surface of the hexa g onal boron nitride particle, the substituted phenyl radical being represented by the structure (l: wherein X is a radical selected from NH₂--, HO--, R₂ 0C (O)--, R₂C(O)O --, HS O 3--, NH₂ CO --, halogens, alkyl and substituted or unsubstituted aryl; wherein R ' is hydrogen, alkyl or alkoxy, and R₂ is hydrogen, alkyl, or substituted or unsubstituted aryl.
The film of Claim 1 wherein R ' is hydrogen, and X is NH₂--.
The film of Claim 1 wherein R ' is hydrogen, and X is.HO--.
The film of Claim 1 wherein the polymer is polyamic acid.
The film of Claim 1 wherein the polymer is polyimide.
The film of Claim 1 wherein the polymer is a cured epoxy resin composition.
The film of Claim 1 wherein the polymer is an uncured epoxy resin composition.
The film of Claim 1 wherein the SMhBN particles have a size within the range of 0.5 to 50 pm.
The process of Claim 1 wherein the polymer is polyamic acid. withdrawn
The process of Claim 1 wherein the polymer is an uncured epoxy resin composition. withdrawn
A process comprising casting onto a release surface a dispersion of a plurality of surface modified hexagonal boron nitride particles in a solution of a polymer in a solvent, forming the thus cast dispersion into a viscous liquid film, and, extracting the solvent to form a film having a thickness of less than 500 pm; wherein the surface modified hexagonal boron nitride particles comprise hexagonal boron nitride particles having a surface and a substituted phenyl radical bonded thereto, the substituted phenyl radical being represented by the structure: \/RI wherein X is a radical selected from NH₂--, HO--, R₂ O C(O)--, R₂C(O)O --, HS O 3--, NH₂CO--, halogens, alkyl and substituted or unsubstituted aryl; wherein R ' is alkyl or alkoxy, and R₂ is hydrogen, alkyl, or substituted or unsubstituted aryl.. withdrawn
The process of Claim 10 wherein R ' is hydrogen, and X is N H₂--. withdrawn
The process of Claim 10 wherein R ' is hydrogen, and X is HO-. withdrawn
The process of Claim 10 wherein the SMhBN particles have a size within the range of 0.5 to 50 pm. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
polymer composite film with SMhBN
Materials described outside the worked examples.
surface-modified hexagonal boron nitride (SMhBN)
hexagonal boron nitride
hBN
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
Figure 1 is a schematic representation of the structure of a hexagonal boron nitride particle. Figure 2a is a transmission electron micrograph (TEM) of the platelet edges of hBN as received (Comparative Example A). Figure 2b is a TEM of the platelet edges of the SMhBN prepared 20 according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
substituted phenyl radical concentration on SMhBN surface | 1.93 wt% | surface-modified hexagonal boron nitride (SMhBN) |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 8,784,980Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 is a schematic representation of the structure of a hexagonal boron nitride particle. Figure 2a is a transmission electron micrograph (TEM) of the platelet edges of hBN as received (Comparative Example A). Figure 2b is a TEM of the platelet edges of the SMhBN prepared 20 according to …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A film having a thickness of less than 500 pm comprising a polymer and a plurality of surface-modified hexagonal boron nitride ("SMhBN") particles dispersed erwttherewithin, the surface modified boron nitride particle comprising a hexagonal boron nitride particle reacted with a substituted p hen y l diazonium chloride represented by the structure (1): X NN CI- R, (I) to covalently bond a substituted p henyl radical to the surface of the hexa g onal boron nitride particle, the substituted phenyl radical being represented by the structure (l: wherein X is a radical selected from NH₂--, HO--, R₂ 0C (O)--, R₂C(O)O --, HS O 3--, NH₂ CO --, halogens, alkyl and substituted or unsubstituted aryl; wherein R ' is hydrogen, alkyl or alkoxy, and R₂ is hydrogen, alkyl, or substituted or unsubstituted aryl.
The film of Claim 1 wherein R ' is hydrogen, and X is NH₂--.
The film of Claim 1 wherein R ' is hydrogen, and X is.HO--.
The film of Claim 1 wherein the polymer is polyamic acid.
The film of Claim 1 wherein the polymer is polyimide.
The film of Claim 1 wherein the polymer is a cured epoxy resin composition.
The film of Claim 1 wherein the polymer is an uncured epoxy resin composition.
The film of Claim 1 wherein the SMhBN particles have a size within the range of 0.5 to 50 pm.
The process of Claim 1 wherein the polymer is polyamic acid. withdrawn
The process of Claim 1 wherein the polymer is an uncured epoxy resin composition. withdrawn
A process comprising casting onto a release surface a dispersion of a plurality of surface modified hexagonal boron nitride particles in a solution of a polymer in a solvent, forming the thus cast dispersion into a viscous liquid film, and, extracting the solvent to form a film having a thickness of less than 500 pm; wherein the surface modified hexagonal boron nitride particles comprise hexagonal boron nitride particles having a surface and a substituted phenyl radical bonded thereto, the substituted phenyl radical being represented by the structure: \/RI wherein X is a radical selected from NH₂--, HO--, R₂ O C(O)--, R₂C(O)O --, HS O 3--, NH₂CO--, halogens, alkyl and substituted or unsubstituted aryl; wherein R ' is alkyl or alkoxy, and R₂ is hydrogen, alkyl, or substituted or unsubstituted aryl.. withdrawn
The process of Claim 10 wherein R ' is hydrogen, and X is N H₂--. withdrawn
The process of Claim 10 wherein R ' is hydrogen, and X is HO-. withdrawn
The process of Claim 10 wherein the SMhBN particles have a size within the range of 0.5 to 50 pm. withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
polymer composite film with SMhBN
Materials described outside the worked examples.
surface-modified hexagonal boron nitride (SMhBN)
hexagonal boron nitride
hBN
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
Figure 1 is a schematic representation of the structure of a hexagonal boron nitride particle. Figure 2a is a transmission electron micrograph (TEM) of the platelet edges of hBN as received (Comparative Example A). Figure 2b is a TEM of the platelet edges of the SMhBN prepared 20 according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
substituted phenyl radical concentration on SMhBN surface | 1.93 wt% | surface-modified hexagonal boron nitride (SMhBN) |
Related documents with shared materials, methods, properties, or citations.
substituted phenyl diazonium chloride
4-aminophenyl radical (aminophenyl-functionalized hBN)
4-hydroxyphenyl radical (hydroxyphenyl-functionalized hBN)
polyamic acid
polyimide
cured epoxy resin
uncured epoxy resin composition
4-amino-benzene diazonium chloride
4-hydroxy-benzene diazonium chloride
4-carboxy-benzene diazonium chloride
metallic iron powder
Fe
dilute hydrochloric acid
HCl
substituted phenyl radical concentration on SMhBN surface | 0.42 wt% | surface-modified hexagonal boron nitride (SMhBN) |
Temperature | 120–300 °C | — |
Temperature | 250–290 °C | — |
Temperature | 0–225 °C | — |
Temperature | 0–300 °C | — |
Temperature | 25–150 °C | — |
Temperature | 170–240 °C | — |
Temperature | 150–200 °C | — |
Thickness | 1–2 mm | — |
Thickness | 0.5–50 µm | — |
Temperature | 250–600 °C | — |
substituted phenyl diazonium chloride
4-aminophenyl radical (aminophenyl-functionalized hBN)
4-hydroxyphenyl radical (hydroxyphenyl-functionalized hBN)
polyamic acid
polyimide
cured epoxy resin
uncured epoxy resin composition
4-amino-benzene diazonium chloride
4-hydroxy-benzene diazonium chloride
4-carboxy-benzene diazonium chloride
metallic iron powder
Fe
dilute hydrochloric acid
HCl
substituted phenyl radical concentration on SMhBN surface | 0.42 wt% | surface-modified hexagonal boron nitride (SMhBN) |
Temperature | 120–300 °C | — |
Temperature | 250–290 °C | — |
Temperature | 0–225 °C | — |
Temperature | 0–300 °C | — |
Temperature | 25–150 °C | — |
Temperature | 170–240 °C | — |
Temperature | 150–200 °C | — |
Thickness | 1–2 mm | — |
Thickness | 0.5–50 µm | — |
Temperature | 250–600 °C | — |
substituted phenyl diazonium chloride
4-aminophenyl radical (aminophenyl-functionalized hBN)
4-hydroxyphenyl radical (hydroxyphenyl-functionalized hBN)
polyamic acid
polyimide
cured epoxy resin
uncured epoxy resin composition
4-amino-benzene diazonium chloride
4-hydroxy-benzene diazonium chloride
4-carboxy-benzene diazonium chloride
metallic iron powder
Fe
dilute hydrochloric acid
HCl
substituted phenyl radical concentration on SMhBN surface | 0.42 wt% | surface-modified hexagonal boron nitride (SMhBN) |
Temperature | 120–300 °C | — |
Temperature | 250–290 °C | — |
Temperature | 0–225 °C | — |
Temperature | 0–300 °C | — |
Temperature | 25–150 °C | — |
Temperature | 170–240 °C | — |
Temperature | 150–200 °C | — |
Thickness | 1–2 mm | — |
Thickness | 0.5–50 µm | — |
Temperature | 250–600 °C | — |
substituted phenyl diazonium chloride
4-aminophenyl radical (aminophenyl-functionalized hBN)
4-hydroxyphenyl radical (hydroxyphenyl-functionalized hBN)
polyamic acid
polyimide
cured epoxy resin
uncured epoxy resin composition
4-amino-benzene diazonium chloride
4-hydroxy-benzene diazonium chloride
4-carboxy-benzene diazonium chloride
metallic iron powder
Fe
dilute hydrochloric acid
HCl
substituted phenyl radical concentration on SMhBN surface | 0.42 wt% | surface-modified hexagonal boron nitride (SMhBN) |
Temperature | 120–300 °C | — |
Temperature | 250–290 °C | — |
Temperature | 0–225 °C | — |
Temperature | 0–300 °C | — |
Temperature | 25–150 °C | — |
Temperature | 170–240 °C | — |
Temperature | 150–200 °C | — |
Thickness | 1–2 mm | — |
Thickness | 0.5–50 µm | — |
Temperature | 250–600 °C | — |