Ballistic transport in nanodevices based on single-crystalline Cu thin film

Yongjin Cho; Su Jae Kim; Min-Hyoung Jung; Yousil Lee; Hu Young Jeong; Young-Min Kim; Hu-Jong Lee; Seong-Gon Kim; Se-Young Jeong; Gil-Ho Lee

Paper details

Research paper

Experimental GrowthExperimental Characterization

Ballistic transport in nanodevices based on single-crystalline Cu thin film

Yongjin Cho, Su Jae Kim, Min-Hyoung Jung, Yousil Lee et al.

2026·arXiv:2602.13624

Samples

Each sample groups how it was prepared, characterized, and measured. Click a card to expand.

Single-crystalline Cu(111) thin film (SCCF) used to fabricate cross-geometry Hall-bar devices for ballistic transport measurements.

2 preparations4 characterizations6 properties2 figures

ExperimentalCuStudied Material

Polycrystalline Cu thin film (PCCF) used for comparison in microstructure characterization.

2 characterizations2 figures

ReferenceCuStudied Material

Materials

Studied Material

Also known as

Cu(111) thin filmsingle-crystalline Cu thin filmSCCFpolycrystalline Cu thin film

Why these are connected

Related documents with shared materials, methods, properties, or citations.

Ballistic transport in nanodevices based on single-crystalline Cu thin film | Matter42 Literature

Properties

Type	Label	Value	Material	Sample	Condition	Source
Substrate Thickness	Cu thin film thickness	90nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat	—	—
Lattice Spacing	[111] spacing	2.07angstrom	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Debye Temperature	Bloch-Gruneisen fit parameter	270K	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Electronic Mean Free Path	mean free path	170nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Electronic Mean Free Path	mean free path	150nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Bend Resistance	RB	negative	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—

Properties

Type	Label	Value	Material	Sample	Condition	Source
Substrate Thickness	Cu thin film thickness	90nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat	—	—
Lattice Spacing	[111] spacing	2.07angstrom	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Debye Temperature	Bloch-Gruneisen fit parameter	270K	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Electronic Mean Free Path	mean free path	170nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Electronic Mean Free Path	mean free path	150nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Bend Resistance	RB	negative	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—

Properties

Type	Label	Value	Material	Sample	Condition	Source
Substrate Thickness	Cu thin film thickness	90nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat	—	—
Lattice Spacing	[111] spacing	2.07angstrom	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Debye Temperature	Bloch-Gruneisen fit parameter	270K	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Electronic Mean Free Path	mean free path	170nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Electronic Mean Free Path	mean free path	150nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Bend Resistance	RB	negative	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—

Properties

Type	Label	Value	Material	Sample	Condition	Source
Substrate Thickness	Cu thin film thickness	90nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat	—	—
Lattice Spacing	[111] spacing	2.07angstrom	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Debye Temperature	Bloch-Gruneisen fit parameter	270K	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Electronic Mean Free Path	mean free path	170nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Electronic Mean Free Path	mean free path	150nm	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—
Bend Resistance	RB	negative	Cu	Single-crystalline Cu(111) thin film (SCCF) used to fabricat		—

Ballistic transport in nanodevices based on single-crystalline Cu thin film

Samples

Single-crystalline Cu(111) thin film (SCCF) used to fabricate cross-geometry Hall-bar devices for ballistic transport measurements.

Polycrystalline Cu thin film (PCCF) used for comparison in microstructure characterization.

Materials

Why these are connected

Ballistic transport in nanodevices based on single-crystalline Cu thin film

Samples

Single-crystalline Cu(111) thin film (SCCF) used to fabricate cross-geometry Hall-bar devices for ballistic transport measurements.

Polycrystalline Cu thin film (PCCF) used for comparison in microstructure characterization.

Materials

Why these are connected

Ballistic transport in nanodevices based on single-crystalline Cu thin film

Samples

Single-crystalline Cu(111) thin film (SCCF) used to fabricate cross-geometry Hall-bar devices for ballistic transport measurements.

Polycrystalline Cu thin film (PCCF) used for comparison in microstructure characterization.

Materials

Why these are connected

Ballistic transport in nanodevices based on single-crystalline Cu thin film

Samples

Single-crystalline Cu(111) thin film (SCCF) used to fabricate cross-geometry Hall-bar devices for ballistic transport measurements.

Polycrystalline Cu thin film (PCCF) used for comparison in microstructure characterization.

Materials

Why these are connected

Ballistic transport in nanodevices based on single-crystalline Cu thin film

Samples

Single-crystalline Cu(111) thin film (SCCF) used to fabricate cross-geometry Hall-bar devices for ballistic transport measurements.

Polycrystalline Cu thin film (PCCF) used for comparison in microstructure characterization.

Materials

Why these are connected

Ballistic transport in nanodevices based on single-crystalline Cu thin film

Samples

Single-crystalline Cu(111) thin film (SCCF) used to fabricate cross-geometry Hall-bar devices for ballistic transport measurements.

Polycrystalline Cu thin film (PCCF) used for comparison in microstructure characterization.

Materials

Why these are connected

Ballistic transport in nanodevices based on single-crystalline Cu thin film

Samples

Single-crystalline Cu(111) thin film (SCCF) used to fabricate cross-geometry Hall-bar devices for ballistic transport measurements.

Polycrystalline Cu thin film (PCCF) used for comparison in microstructure characterization.

Materials

Why these are connected

Ballistic transport in nanodevices based on single-crystalline Cu thin film

Samples

Single-crystalline Cu(111) thin film (SCCF) used to fabricate cross-geometry Hall-bar devices for ballistic transport measurements.

Polycrystalline Cu thin film (PCCF) used for comparison in microstructure characterization.

Materials

Why these are connected

Growth

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Growth

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Growth

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Growth

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