Patent
US 9,184,266N-type semiconductor material
ZnO
BN
InGaN
InAsP
InP
InGaAs
InAlAs
InGaSb
GaN
GaAs
Silicon
Si
4H-SiC
SiC
GaSb
Germanium
Ge
AlP
ZnS
GaP
AlSb
AlAs
AlN
metal emitter material
CdSe
InAs
SnO2:F
InSb
CdTe
CdS
In₂O3:Sn
semimetal emitter material
FIG. 2 B, the collector transition layer can be a bandgap smoothing transition region used to smooth the potential barrier (grade the potential in the …
FIGS. 3A and 3B. [094] In the exemplary device having the conduction band minimum diagram shown in FI G. 3A, an emitter comprising a N- doped semiconductor …
FIG. 5A, an exemplary transistor in accordance with the present invention can have an emitter made from N+ GaN, N+ AlGaN, or N+ A l N; an optional emitter …
FIG. 6A, a transistor device in accordance with this embodiment of the present invention can have an N+ polysilicon emitter; an optional emitter transition …
FIG. 7A, a transistor device in accordance with this embodiment of the present invention can have an N+ GaN or N+ AlGaN emitter; an optional emitter transition …
FIG. 8A, a transistor device in accordance with this embodiment of the present invention can have an N+ I nGaAs or other appropriate semiconductor emitter; an …
FIG. 9A, a transistor device in accordance with this embodiment of the present invention can have an N+ InGaAs or other appropriate semiconductor emitter; Page …
FIG. 10 A, a transistor device in accordance with this embodiment of the present invention can have an N+ emitter comprising, for example, one of the SMNHE I …
FIG. 11 A, a transistor device in accordance with this embodiment of the present invention can have an N+ emitter comprising, for example, one of the SMNHEI …
few-layer graphene minimum sheet resistance | 100 ohm/square | C |
N-type semiconductor material
ZnO
BN
InGaN
InAsP
InP
InGaAs
InAlAs
InGaSb
GaN
GaAs
Silicon
Si
4H-SiC
SiC
GaSb
Germanium
Ge
AlP
ZnS
GaP
AlSb
AlAs
AlN
metal emitter material
CdSe
InAs
SnO2:F
InSb
CdTe
CdS
In₂O3:Sn
semimetal emitter material
FIG. 2 B, the collector transition layer can be a bandgap smoothing transition region used to smooth the potential barrier (grade the potential in the …
FIGS. 3A and 3B. [094] In the exemplary device having the conduction band minimum diagram shown in FI G. 3A, an emitter comprising a N- doped semiconductor …
FIG. 5A, an exemplary transistor in accordance with the present invention can have an emitter made from N+ GaN, N+ AlGaN, or N+ A l N; an optional emitter …
FIG. 6A, a transistor device in accordance with this embodiment of the present invention can have an N+ polysilicon emitter; an optional emitter transition …
FIG. 7A, a transistor device in accordance with this embodiment of the present invention can have an N+ GaN or N+ AlGaN emitter; an optional emitter transition …
FIG. 8A, a transistor device in accordance with this embodiment of the present invention can have an N+ I nGaAs or other appropriate semiconductor emitter; an …
FIG. 9A, a transistor device in accordance with this embodiment of the present invention can have an N+ InGaAs or other appropriate semiconductor emitter; Page …
FIG. 10 A, a transistor device in accordance with this embodiment of the present invention can have an N+ emitter comprising, for example, one of the SMNHE I …
FIG. 11 A, a transistor device in accordance with this embodiment of the present invention can have an N+ emitter comprising, for example, one of the SMNHEI …
few-layer graphene minimum sheet resistance | 100 ohm/square | C |
N-type semiconductor material
ZnO
BN
InGaN
InAsP
InP
InGaAs
InAlAs
InGaSb
GaN
GaAs
Silicon
Si
4H-SiC
SiC
GaSb
Germanium
Ge
AlP
ZnS
GaP
AlSb
AlAs
AlN
metal emitter material
CdSe
InAs
SnO2:F
InSb
CdTe
CdS
In₂O3:Sn
semimetal emitter material
FIG. 2 B, the collector transition layer can be a bandgap smoothing transition region used to smooth the potential barrier (grade the potential in the …
FIGS. 3A and 3B. [094] In the exemplary device having the conduction band minimum diagram shown in FI G. 3A, an emitter comprising a N- doped semiconductor …
FIG. 5A, an exemplary transistor in accordance with the present invention can have an emitter made from N+ GaN, N+ AlGaN, or N+ A l N; an optional emitter …
FIG. 6A, a transistor device in accordance with this embodiment of the present invention can have an N+ polysilicon emitter; an optional emitter transition …
FIG. 7A, a transistor device in accordance with this embodiment of the present invention can have an N+ GaN or N+ AlGaN emitter; an optional emitter transition …
FIG. 8A, a transistor device in accordance with this embodiment of the present invention can have an N+ I nGaAs or other appropriate semiconductor emitter; an …
FIG. 9A, a transistor device in accordance with this embodiment of the present invention can have an N+ InGaAs or other appropriate semiconductor emitter; Page …
FIG. 10 A, a transistor device in accordance with this embodiment of the present invention can have an N+ emitter comprising, for example, one of the SMNHE I …
FIG. 11 A, a transistor device in accordance with this embodiment of the present invention can have an N+ emitter comprising, for example, one of the SMNHEI …
few-layer graphene minimum sheet resistance | 100 ohm/square | C |
N-type semiconductor material
ZnO
BN
InGaN
InAsP
InP
InGaAs
InAlAs
InGaSb
GaN
GaAs
Silicon
Si
4H-SiC
SiC
GaSb
Germanium
Ge
AlP
ZnS
GaP
AlSb
AlAs
AlN
metal emitter material
CdSe
InAs
SnO2:F
InSb
CdTe
CdS
In₂O3:Sn
semimetal emitter material
FIG. 2 B, the collector transition layer can be a bandgap smoothing transition region used to smooth the potential barrier (grade the potential in the …
FIGS. 3A and 3B. [094] In the exemplary device having the conduction band minimum diagram shown in FI G. 3A, an emitter comprising a N- doped semiconductor …
FIG. 5A, an exemplary transistor in accordance with the present invention can have an emitter made from N+ GaN, N+ AlGaN, or N+ A l N; an optional emitter …
FIG. 6A, a transistor device in accordance with this embodiment of the present invention can have an N+ polysilicon emitter; an optional emitter transition …
FIG. 7A, a transistor device in accordance with this embodiment of the present invention can have an N+ GaN or N+ AlGaN emitter; an optional emitter transition …
FIG. 8A, a transistor device in accordance with this embodiment of the present invention can have an N+ I nGaAs or other appropriate semiconductor emitter; an …
FIG. 9A, a transistor device in accordance with this embodiment of the present invention can have an N+ InGaAs or other appropriate semiconductor emitter; Page …
FIG. 10 A, a transistor device in accordance with this embodiment of the present invention can have an N+ emitter comprising, for example, one of the SMNHE I …
FIG. 11 A, a transistor device in accordance with this embodiment of the present invention can have an N+ emitter comprising, for example, one of the SMNHEI …
few-layer graphene minimum sheet resistance | 100 ohm/square | C |