Patent
US 10,829,867Ax(1)-standard deviation of Raman shift of LO phonon peak relative to neon emission line | ≤ 20 cm⁻¹ | GaAs |
Average FWHM of first peak (LO phonon) | ≤ 5 cm⁻¹ | GaAs |
Carrier concentration of semi-insulating GaAs crystal | ≤ 10000000 cm⁻³ | GaAs |
n-type dopant concentration of n-type GaAs crystal | ≥ 1000000000000000 cm⁻³ | GaAs |
GaAs crystal diameter | ≥ 101.6 mm | GaAs |
Thickness | ≥ 30 cm | — |
Temperature | 970–1100 °C | — |
Thickness | 0.05–30 cm | — |
Temperature | 430–560 °C | — |
Thickness | 0.05–80 cm | — |
Thickness | ≤ 0.05 cm | — |
Thickness | ≥ 20 cm | — |
Thickness | ≥ 5 cm | — |
Thickness | ≥ 10 cm | — |
PROCESS FOR PRODUCING DOPED GALLIUM ARSENIDE SUBSTRATE WAFERS HAVING LOW OPTICAL ABSORPTION COEFFICIENT
Ax(1)-standard deviation of Raman shift of LO phonon peak relative to neon emission line | ≤ 20 cm⁻¹ | GaAs |
Average FWHM of first peak (LO phonon) | ≤ 5 cm⁻¹ | GaAs |
Carrier concentration of semi-insulating GaAs crystal | ≤ 10000000 cm⁻³ | GaAs |
n-type dopant concentration of n-type GaAs crystal | ≥ 1000000000000000 cm⁻³ | GaAs |
GaAs crystal diameter | ≥ 101.6 mm | GaAs |
Thickness | ≥ 30 cm | — |
Temperature | 970–1100 °C | — |
Thickness | 0.05–30 cm | — |
Temperature | 430–560 °C | — |
Thickness | 0.05–80 cm | — |
Thickness | ≤ 0.05 cm | — |
Thickness | ≥ 20 cm | — |
Thickness | ≥ 5 cm | — |
Thickness | ≥ 10 cm | — |
PROCESS FOR PRODUCING DOPED GALLIUM ARSENIDE SUBSTRATE WAFERS HAVING LOW OPTICAL ABSORPTION COEFFICIENT
Ax(1)-standard deviation of Raman shift of LO phonon peak relative to neon emission line | ≤ 20 cm⁻¹ | GaAs |
Average FWHM of first peak (LO phonon) | ≤ 5 cm⁻¹ | GaAs |
Carrier concentration of semi-insulating GaAs crystal | ≤ 10000000 cm⁻³ | GaAs |
n-type dopant concentration of n-type GaAs crystal | ≥ 1000000000000000 cm⁻³ | GaAs |
GaAs crystal diameter | ≥ 101.6 mm | GaAs |
Thickness | ≥ 30 cm | — |
Temperature | 970–1100 °C | — |
Thickness | 0.05–30 cm | — |
Temperature | 430–560 °C | — |
Thickness | 0.05–80 cm | — |
Thickness | ≤ 0.05 cm | — |
Thickness | ≥ 20 cm | — |
Thickness | ≥ 5 cm | — |
Thickness | ≥ 10 cm | — |
PROCESS FOR PRODUCING DOPED GALLIUM ARSENIDE SUBSTRATE WAFERS HAVING LOW OPTICAL ABSORPTION COEFFICIENT
Ax(1)-standard deviation of Raman shift of LO phonon peak relative to neon emission line | ≤ 20 cm⁻¹ | GaAs |
Average FWHM of first peak (LO phonon) | ≤ 5 cm⁻¹ | GaAs |
Carrier concentration of semi-insulating GaAs crystal | ≤ 10000000 cm⁻³ | GaAs |
n-type dopant concentration of n-type GaAs crystal | ≥ 1000000000000000 cm⁻³ | GaAs |
GaAs crystal diameter | ≥ 101.6 mm | GaAs |
Thickness | ≥ 30 cm | — |
Temperature | 970–1100 °C | — |
Thickness | 0.05–30 cm | — |
Temperature | 430–560 °C | — |
Thickness | 0.05–80 cm | — |
Thickness | ≤ 0.05 cm | — |
Thickness | ≥ 20 cm | — |
Thickness | ≥ 5 cm | — |
Thickness | ≥ 10 cm | — |
PROCESS FOR PRODUCING DOPED GALLIUM ARSENIDE SUBSTRATE WAFERS HAVING LOW OPTICAL ABSORPTION COEFFICIENT