DIRECT-DRIVE D-MODE GAN HALF-BRIDGE POWER MODULE | Matter42 Literature
Patent
Atlas literature
Patent
US 11,909,384 B2
DIRECT-DRIVE D-MODE GAN HALF-BRIDGE POWER MODULE
Di Chen
GaN Systems Inc.·Feb. 20, 2024·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1. The foregoing and other features, aspects and advantages will become more apparent from the following detailed description, taken in conjunction with …
FIG. 2
FIG. 2 shows a circuit schematic for a direct drive D-mode GaN half-bridge module and gate driver circuit of an example embodiment;
FIG. 3
FIG. 3 shows some schematic diagrams to illustrate switching waveforms for various operational modes of the direct drive D-mode GaN half-bridge module of the …
FIG. 4
FIG. 4 shows a table to illustrate switching states of each element of the direct drive D-mode GaN half-bridge module of the example embodiment for the …
FIG. 5
FIG. 5 shows a circuit schematic for a 3-phase inverter of an example embodiment for driving a motor, wherein each phase leg comprises a direct drive D-mode …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
4 independent · 9 dependent
1
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A direct drive D-mode half-bridge power module comprising a high-side switch and a low-side switch con-nected in series, wherein the high-side switch is a D-mode normally-on GaN transistor switch (Q₁) in series with an E-mode normally-off Si MOSFET switch (M₁) and the low-side switch is a D-mode normally-on GaN transistor switch (Q₂), wherein gates of the D-mode normally-on GaN transistor switches Q₁ and Q₂ are directly driven, and the gate of E-mode normally-off Si MOSFET M₁ is directly driven by a control signal, wherein M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and during a fault condition.
2
Dependent← claim 1Direct-drive D-mode GaN half-bridge power module
The direct drive D-mode half-bridge power module of claim 1, comprising a control circuit which determines the operational mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indica-tive of an overcurrent event.
4
Dependent← claim 1Direct-drive D-mode GaN half-bridge power moduleTraction inverter multi-phase motor driver
A traction inverter comprising a multi-phase motor driver, wherein each phase leg comprises a half-bridge module as defined in claim 1.
5
Dependent← claim 1Direct-drive D-mode GaN half-bridge power module
A method of operation of a half-bridge module as defined in claim 1, wherein a control circuit is configured to determine an operational mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indicative of an overcurrent event, the control circuit operating so that: M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if overcurrent protection (OCP) is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
6
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); wherein gates of the D-mode normally-on GaN transistor switches Q₁ or Q₂ are directly driven, and the gate of the E-mode normally-off Si MOSFET M₁ is directly driven by a control circuit, wherein M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and during a fault condition; and the control circuit is configured to determine an opera-tional mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indicative of an overcurrent event, the control circuit operating so that: M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if overcurrent protection (OCP) is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
11
Dependent← claim 6D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 6 wherein: Q₁ comprises a plurality of GaN transistors connected in parallel; M₁ comprises a plurality of Si MOSFETs connected in parallel; Q₂ comprises a plurality of GaN transistors connected in parallel.
7
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; the low side switch is a normally-on switch, comprising a second normally-on GaN transitory switch (Q₂); and Q₁ has a source, a drain and a gate, wherein the drain of Q₁ is connected to the high voltage DC bus and the source of Q₁ is connected to a drain of M1, and the gate of Q₁ is connected to a first gate drive terminal for directly driving the gate of Q1; the source of M₁ is connected to the switching node, a gate of M₁ is connected to an enable (control) terminal for directly driving the gate of the M1; a high-side ground terminal is connected to the source of M1; and a voltage sense B₂ terminal is connected to a common point between the source of Q₁ and the drain of M1; and Q₂ has a source, a drain and a gate, the drain of Q₂ is connected to the switching node and the source of Q₂ is connected to the low voltage DC bus, and the gate of Q₂ is connected to a second gate drive terminal for directly driving the gate of Q2; and a low-side ground terminal is connected to the source of Q2.
8
Dependent← claim 7Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7 wherein: M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and a fault condition.
9
Dependent← claim 7D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7, wherein: Q₁ comprises a plurality of GaN transistors connected in parallel; M₁ comprises a plurality of Si MOSFETs connected in parallel; Q₂ comprises a plurality of GaN transistors connected in parallel.
10
Dependent← claim 7D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)GaN HEMTDirect-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7, wherein: Q₁ comprises a plurality of GaN HEMTs connected in parallel; M₁ comprises a plurality of Si MOSFET connected in parallel; Q₂ comprises a plurality of GaN HEMTs connected in parallel.
12
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power moduleHalf-bridge driver circuit with control circuit for M1
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; and the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); and a half-bridge driver circuit comprising: a high-side driver for directly driving a gate of Q1; a low-side driver for directly driving a gate of Q2; wherein the high-side driver and the low-side driver are driven by PWM input signals INH and INL respec-tively; and a control circuit for driving M1, wherein the control circuit comprises a gate driver for providing an enable (control) signal for directly driving the gate of M₁ in response to a gate input signal PGOOD, the control circuit having a voltage sense input Vsen from a voltage sense terminal connected to a node between the source of Q₁ and the drain of M1, circuitry for receiving an undervoltage lock-out (UVLO) signal, and determining a power status and operational mode for M1, circuitry for comparing the voltage sense input Vsen to a reference overcurrent protection (OCP) limit volt-age VOCPlimit, wherein said enable signal provides that M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if OCP is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
13
Dependent← claim 12D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power moduleHalf-bridge driver circuit with control circuit for M1
The power semiconductor switching device of claim 12 comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus (rail) and a low voltage DC bus (rail), the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁); and the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); wherein: Q₁ has a source, a drain and a gate, wherein the drain of Q₁ is connected to the high voltage DC bus and the source of Q₁ is connected to a drain of M1, and the gate of Q₁ is connected to a first gate drive terminal for directly driving the gate of Q1; the source of M₁ is connected to the switching node, a gate of M₁ is connected to an enable (control) terminal for directly driving the gate of the M1; a high-side ground terminal is connected to the source of M1; and a voltage sense B₂ terminal is connected a common point between the source of Q₁ and the drain of M1; and Q₂ has a source, a drain and a gate, the drain of Q₂ is connected to the switching node and the source of Q₂ is connected to the low voltage DC bus, and the gate of Q₂ is connected to a second gate drive terminal for directly driving the gate of Q2; and a low-side ground terminal is connected to the source of Q2; a half-bridge driver circuit comprising: a high-side driver for directly driving a gate of Q1; a low-side driver for directly driving a gate of Q2; wherein the high-side driver and the low-side driver are driven by PWM input signals INH and INL respec-tively; and a control circuit for driving M1, wherein the control circuit comprises a gate driver for providing an enable (control) signal for directly driving the gate of M₁ in response to a gate input signal PGOOD, a voltage sense input Vsen from a voltage sense ter-minal connected to a node between the source of Q₁ and the drain of M1, a UVLO signal input, and circuitry for determining a power status and operational mode for M1, circuitry for comparing the voltage sense input Vsen to a reference OCP limit voltage VOCPlimit and trig-gering OCP if Vsen exceeds the OCP limit voltage; wherein said enable signal provides that M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if OCP is triggered, M₁ is ON and Q₁ and Q₂ are turned-off. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
Direct-drive D-mode GaN half-bridge power module
D-mode GaN transistor (normally-on)low-side switch (normally-on D-mode GaN Q2)
E-mode Si MOSFET (normally-off)protection/enable FET in series with Q1 (E-mode Si MOSFET M1)
D-mode GaN transistor (normally-on)high-side switch (normally-on D-mode GaN Q1)
Traction inverter multi-phase motor driver
No layer stack recorded.
Half-bridge driver circuit with control circuit for M₁
No layer stack recorded.
Materials
Materials described outside the worked examples.
D-mode GaN transistor (normally-on)
High-Side And Low-Side Switch Active Material (GaN)
E-mode Si MOSFET (normally-off)
Protection FET In Series With High-Side GaN Switch
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Voltage
1.5–1.7 V
—
Voltage
0–15 V
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 11
US 9,349,715 B29,349,715 B2 5/2016 Briere
US 9,406,674 B29,406,674 B2 8/2016 Briere
US 9,692,408 B29,692,408 B2 6/2017 Roberts et al.
US 9,754,937 B19,754,937 B1 9/2017 Lu et al.
US 10,720,913 B110,720,913 B1 7/2020 Leong et al.
US 2014/0055109 A12014/0055109 A1 * 2/2014 Guerra.................. H02M 7/538examiner
Why these are connected
Related documents with shared materials, methods, properties, or citations.
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1. The foregoing and other features, aspects and advantages will become more apparent from the following detailed description, taken in conjunction with …
FIG. 2
FIG. 2 shows a circuit schematic for a direct drive D-mode GaN half-bridge module and gate driver circuit of an example embodiment;
FIG. 3
FIG. 3 shows some schematic diagrams to illustrate switching waveforms for various operational modes of the direct drive D-mode GaN half-bridge module of the …
FIG. 4
FIG. 4 shows a table to illustrate switching states of each element of the direct drive D-mode GaN half-bridge module of the example embodiment for the …
FIG. 5
FIG. 5 shows a circuit schematic for a 3-phase inverter of an example embodiment for driving a motor, wherein each phase leg comprises a direct drive D-mode …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
4 independent · 9 dependent
1
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A direct drive D-mode half-bridge power module comprising a high-side switch and a low-side switch con-nected in series, wherein the high-side switch is a D-mode normally-on GaN transistor switch (Q₁) in series with an E-mode normally-off Si MOSFET switch (M₁) and the low-side switch is a D-mode normally-on GaN transistor switch (Q₂), wherein gates of the D-mode normally-on GaN transistor switches Q₁ and Q₂ are directly driven, and the gate of E-mode normally-off Si MOSFET M₁ is directly driven by a control signal, wherein M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and during a fault condition.
2
Dependent← claim 1Direct-drive D-mode GaN half-bridge power module
The direct drive D-mode half-bridge power module of claim 1, comprising a control circuit which determines the operational mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indica-tive of an overcurrent event.
4
Dependent← claim 1Direct-drive D-mode GaN half-bridge power moduleTraction inverter multi-phase motor driver
A traction inverter comprising a multi-phase motor driver, wherein each phase leg comprises a half-bridge module as defined in claim 1.
5
Dependent← claim 1Direct-drive D-mode GaN half-bridge power module
A method of operation of a half-bridge module as defined in claim 1, wherein a control circuit is configured to determine an operational mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indicative of an overcurrent event, the control circuit operating so that: M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if overcurrent protection (OCP) is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
6
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); wherein gates of the D-mode normally-on GaN transistor switches Q₁ or Q₂ are directly driven, and the gate of the E-mode normally-off Si MOSFET M₁ is directly driven by a control circuit, wherein M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and during a fault condition; and the control circuit is configured to determine an opera-tional mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indicative of an overcurrent event, the control circuit operating so that: M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if overcurrent protection (OCP) is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
11
Dependent← claim 6D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 6 wherein: Q₁ comprises a plurality of GaN transistors connected in parallel; M₁ comprises a plurality of Si MOSFETs connected in parallel; Q₂ comprises a plurality of GaN transistors connected in parallel.
7
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; the low side switch is a normally-on switch, comprising a second normally-on GaN transitory switch (Q₂); and Q₁ has a source, a drain and a gate, wherein the drain of Q₁ is connected to the high voltage DC bus and the source of Q₁ is connected to a drain of M1, and the gate of Q₁ is connected to a first gate drive terminal for directly driving the gate of Q1; the source of M₁ is connected to the switching node, a gate of M₁ is connected to an enable (control) terminal for directly driving the gate of the M1; a high-side ground terminal is connected to the source of M1; and a voltage sense B₂ terminal is connected to a common point between the source of Q₁ and the drain of M1; and Q₂ has a source, a drain and a gate, the drain of Q₂ is connected to the switching node and the source of Q₂ is connected to the low voltage DC bus, and the gate of Q₂ is connected to a second gate drive terminal for directly driving the gate of Q2; and a low-side ground terminal is connected to the source of Q2.
8
Dependent← claim 7Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7 wherein: M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and a fault condition.
9
Dependent← claim 7D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7, wherein: Q₁ comprises a plurality of GaN transistors connected in parallel; M₁ comprises a plurality of Si MOSFETs connected in parallel; Q₂ comprises a plurality of GaN transistors connected in parallel.
10
Dependent← claim 7D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)GaN HEMTDirect-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7, wherein: Q₁ comprises a plurality of GaN HEMTs connected in parallel; M₁ comprises a plurality of Si MOSFET connected in parallel; Q₂ comprises a plurality of GaN HEMTs connected in parallel.
12
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power moduleHalf-bridge driver circuit with control circuit for M1
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; and the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); and a half-bridge driver circuit comprising: a high-side driver for directly driving a gate of Q1; a low-side driver for directly driving a gate of Q2; wherein the high-side driver and the low-side driver are driven by PWM input signals INH and INL respec-tively; and a control circuit for driving M1, wherein the control circuit comprises a gate driver for providing an enable (control) signal for directly driving the gate of M₁ in response to a gate input signal PGOOD, the control circuit having a voltage sense input Vsen from a voltage sense terminal connected to a node between the source of Q₁ and the drain of M1, circuitry for receiving an undervoltage lock-out (UVLO) signal, and determining a power status and operational mode for M1, circuitry for comparing the voltage sense input Vsen to a reference overcurrent protection (OCP) limit volt-age VOCPlimit, wherein said enable signal provides that M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if OCP is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
13
Dependent← claim 12D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power moduleHalf-bridge driver circuit with control circuit for M1
The power semiconductor switching device of claim 12 comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus (rail) and a low voltage DC bus (rail), the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁); and the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); wherein: Q₁ has a source, a drain and a gate, wherein the drain of Q₁ is connected to the high voltage DC bus and the source of Q₁ is connected to a drain of M1, and the gate of Q₁ is connected to a first gate drive terminal for directly driving the gate of Q1; the source of M₁ is connected to the switching node, a gate of M₁ is connected to an enable (control) terminal for directly driving the gate of the M1; a high-side ground terminal is connected to the source of M1; and a voltage sense B₂ terminal is connected a common point between the source of Q₁ and the drain of M1; and Q₂ has a source, a drain and a gate, the drain of Q₂ is connected to the switching node and the source of Q₂ is connected to the low voltage DC bus, and the gate of Q₂ is connected to a second gate drive terminal for directly driving the gate of Q2; and a low-side ground terminal is connected to the source of Q2; a half-bridge driver circuit comprising: a high-side driver for directly driving a gate of Q1; a low-side driver for directly driving a gate of Q2; wherein the high-side driver and the low-side driver are driven by PWM input signals INH and INL respec-tively; and a control circuit for driving M1, wherein the control circuit comprises a gate driver for providing an enable (control) signal for directly driving the gate of M₁ in response to a gate input signal PGOOD, a voltage sense input Vsen from a voltage sense ter-minal connected to a node between the source of Q₁ and the drain of M1, a UVLO signal input, and circuitry for determining a power status and operational mode for M1, circuitry for comparing the voltage sense input Vsen to a reference OCP limit voltage VOCPlimit and trig-gering OCP if Vsen exceeds the OCP limit voltage; wherein said enable signal provides that M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if OCP is triggered, M₁ is ON and Q₁ and Q₂ are turned-off. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
Direct-drive D-mode GaN half-bridge power module
D-mode GaN transistor (normally-on)low-side switch (normally-on D-mode GaN Q2)
E-mode Si MOSFET (normally-off)protection/enable FET in series with Q1 (E-mode Si MOSFET M1)
D-mode GaN transistor (normally-on)high-side switch (normally-on D-mode GaN Q1)
Traction inverter multi-phase motor driver
No layer stack recorded.
Half-bridge driver circuit with control circuit for M₁
No layer stack recorded.
Materials
Materials described outside the worked examples.
D-mode GaN transistor (normally-on)
High-Side And Low-Side Switch Active Material (GaN)
E-mode Si MOSFET (normally-off)
Protection FET In Series With High-Side GaN Switch
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Voltage
1.5–1.7 V
—
Voltage
0–15 V
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 11
US 9,349,715 B29,349,715 B2 5/2016 Briere
US 9,406,674 B29,406,674 B2 8/2016 Briere
US 9,692,408 B29,692,408 B2 6/2017 Roberts et al.
US 9,754,937 B19,754,937 B1 9/2017 Lu et al.
US 10,720,913 B110,720,913 B1 7/2020 Leong et al.
US 2014/0055109 A12014/0055109 A1 * 2/2014 Guerra.................. H02M 7/538examiner
Why these are connected
Related documents with shared materials, methods, properties, or citations.
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1. The foregoing and other features, aspects and advantages will become more apparent from the following detailed description, taken in conjunction with …
FIG. 2
FIG. 2 shows a circuit schematic for a direct drive D-mode GaN half-bridge module and gate driver circuit of an example embodiment;
FIG. 3
FIG. 3 shows some schematic diagrams to illustrate switching waveforms for various operational modes of the direct drive D-mode GaN half-bridge module of the …
FIG. 4
FIG. 4 shows a table to illustrate switching states of each element of the direct drive D-mode GaN half-bridge module of the example embodiment for the …
FIG. 5
FIG. 5 shows a circuit schematic for a 3-phase inverter of an example embodiment for driving a motor, wherein each phase leg comprises a direct drive D-mode …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
4 independent · 9 dependent
1
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A direct drive D-mode half-bridge power module comprising a high-side switch and a low-side switch con-nected in series, wherein the high-side switch is a D-mode normally-on GaN transistor switch (Q₁) in series with an E-mode normally-off Si MOSFET switch (M₁) and the low-side switch is a D-mode normally-on GaN transistor switch (Q₂), wherein gates of the D-mode normally-on GaN transistor switches Q₁ and Q₂ are directly driven, and the gate of E-mode normally-off Si MOSFET M₁ is directly driven by a control signal, wherein M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and during a fault condition.
2
Dependent← claim 1Direct-drive D-mode GaN half-bridge power module
The direct drive D-mode half-bridge power module of claim 1, comprising a control circuit which determines the operational mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indica-tive of an overcurrent event.
4
Dependent← claim 1Direct-drive D-mode GaN half-bridge power moduleTraction inverter multi-phase motor driver
A traction inverter comprising a multi-phase motor driver, wherein each phase leg comprises a half-bridge module as defined in claim 1.
5
Dependent← claim 1Direct-drive D-mode GaN half-bridge power module
A method of operation of a half-bridge module as defined in claim 1, wherein a control circuit is configured to determine an operational mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indicative of an overcurrent event, the control circuit operating so that: M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if overcurrent protection (OCP) is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
6
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); wherein gates of the D-mode normally-on GaN transistor switches Q₁ or Q₂ are directly driven, and the gate of the E-mode normally-off Si MOSFET M₁ is directly driven by a control circuit, wherein M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and during a fault condition; and the control circuit is configured to determine an opera-tional mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indicative of an overcurrent event, the control circuit operating so that: M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if overcurrent protection (OCP) is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
11
Dependent← claim 6D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 6 wherein: Q₁ comprises a plurality of GaN transistors connected in parallel; M₁ comprises a plurality of Si MOSFETs connected in parallel; Q₂ comprises a plurality of GaN transistors connected in parallel.
7
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; the low side switch is a normally-on switch, comprising a second normally-on GaN transitory switch (Q₂); and Q₁ has a source, a drain and a gate, wherein the drain of Q₁ is connected to the high voltage DC bus and the source of Q₁ is connected to a drain of M1, and the gate of Q₁ is connected to a first gate drive terminal for directly driving the gate of Q1; the source of M₁ is connected to the switching node, a gate of M₁ is connected to an enable (control) terminal for directly driving the gate of the M1; a high-side ground terminal is connected to the source of M1; and a voltage sense B₂ terminal is connected to a common point between the source of Q₁ and the drain of M1; and Q₂ has a source, a drain and a gate, the drain of Q₂ is connected to the switching node and the source of Q₂ is connected to the low voltage DC bus, and the gate of Q₂ is connected to a second gate drive terminal for directly driving the gate of Q2; and a low-side ground terminal is connected to the source of Q2.
8
Dependent← claim 7Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7 wherein: M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and a fault condition.
9
Dependent← claim 7D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7, wherein: Q₁ comprises a plurality of GaN transistors connected in parallel; M₁ comprises a plurality of Si MOSFETs connected in parallel; Q₂ comprises a plurality of GaN transistors connected in parallel.
10
Dependent← claim 7D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)GaN HEMTDirect-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7, wherein: Q₁ comprises a plurality of GaN HEMTs connected in parallel; M₁ comprises a plurality of Si MOSFET connected in parallel; Q₂ comprises a plurality of GaN HEMTs connected in parallel.
12
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power moduleHalf-bridge driver circuit with control circuit for M1
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; and the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); and a half-bridge driver circuit comprising: a high-side driver for directly driving a gate of Q1; a low-side driver for directly driving a gate of Q2; wherein the high-side driver and the low-side driver are driven by PWM input signals INH and INL respec-tively; and a control circuit for driving M1, wherein the control circuit comprises a gate driver for providing an enable (control) signal for directly driving the gate of M₁ in response to a gate input signal PGOOD, the control circuit having a voltage sense input Vsen from a voltage sense terminal connected to a node between the source of Q₁ and the drain of M1, circuitry for receiving an undervoltage lock-out (UVLO) signal, and determining a power status and operational mode for M1, circuitry for comparing the voltage sense input Vsen to a reference overcurrent protection (OCP) limit volt-age VOCPlimit, wherein said enable signal provides that M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if OCP is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
13
Dependent← claim 12D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power moduleHalf-bridge driver circuit with control circuit for M1
The power semiconductor switching device of claim 12 comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus (rail) and a low voltage DC bus (rail), the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁); and the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); wherein: Q₁ has a source, a drain and a gate, wherein the drain of Q₁ is connected to the high voltage DC bus and the source of Q₁ is connected to a drain of M1, and the gate of Q₁ is connected to a first gate drive terminal for directly driving the gate of Q1; the source of M₁ is connected to the switching node, a gate of M₁ is connected to an enable (control) terminal for directly driving the gate of the M1; a high-side ground terminal is connected to the source of M1; and a voltage sense B₂ terminal is connected a common point between the source of Q₁ and the drain of M1; and Q₂ has a source, a drain and a gate, the drain of Q₂ is connected to the switching node and the source of Q₂ is connected to the low voltage DC bus, and the gate of Q₂ is connected to a second gate drive terminal for directly driving the gate of Q2; and a low-side ground terminal is connected to the source of Q2; a half-bridge driver circuit comprising: a high-side driver for directly driving a gate of Q1; a low-side driver for directly driving a gate of Q2; wherein the high-side driver and the low-side driver are driven by PWM input signals INH and INL respec-tively; and a control circuit for driving M1, wherein the control circuit comprises a gate driver for providing an enable (control) signal for directly driving the gate of M₁ in response to a gate input signal PGOOD, a voltage sense input Vsen from a voltage sense ter-minal connected to a node between the source of Q₁ and the drain of M1, a UVLO signal input, and circuitry for determining a power status and operational mode for M1, circuitry for comparing the voltage sense input Vsen to a reference OCP limit voltage VOCPlimit and trig-gering OCP if Vsen exceeds the OCP limit voltage; wherein said enable signal provides that M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if OCP is triggered, M₁ is ON and Q₁ and Q₂ are turned-off. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
Direct-drive D-mode GaN half-bridge power module
D-mode GaN transistor (normally-on)low-side switch (normally-on D-mode GaN Q2)
E-mode Si MOSFET (normally-off)protection/enable FET in series with Q1 (E-mode Si MOSFET M1)
D-mode GaN transistor (normally-on)high-side switch (normally-on D-mode GaN Q1)
Traction inverter multi-phase motor driver
No layer stack recorded.
Half-bridge driver circuit with control circuit for M₁
No layer stack recorded.
Materials
Materials described outside the worked examples.
D-mode GaN transistor (normally-on)
High-Side And Low-Side Switch Active Material (GaN)
E-mode Si MOSFET (normally-off)
Protection FET In Series With High-Side GaN Switch
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Voltage
1.5–1.7 V
—
Voltage
0–15 V
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 11
US 9,349,715 B29,349,715 B2 5/2016 Briere
US 9,406,674 B29,406,674 B2 8/2016 Briere
US 9,692,408 B29,692,408 B2 6/2017 Roberts et al.
US 9,754,937 B19,754,937 B1 9/2017 Lu et al.
US 10,720,913 B110,720,913 B1 7/2020 Leong et al.
US 2014/0055109 A12014/0055109 A1 * 2/2014 Guerra.................. H02M 7/538examiner
Why these are connected
Related documents with shared materials, methods, properties, or citations.
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1. The foregoing and other features, aspects and advantages will become more apparent from the following detailed description, taken in conjunction with …
FIG. 2
FIG. 2 shows a circuit schematic for a direct drive D-mode GaN half-bridge module and gate driver circuit of an example embodiment;
FIG. 3
FIG. 3 shows some schematic diagrams to illustrate switching waveforms for various operational modes of the direct drive D-mode GaN half-bridge module of the …
FIG. 4
FIG. 4 shows a table to illustrate switching states of each element of the direct drive D-mode GaN half-bridge module of the example embodiment for the …
FIG. 5
FIG. 5 shows a circuit schematic for a 3-phase inverter of an example embodiment for driving a motor, wherein each phase leg comprises a direct drive D-mode …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
4 independent · 9 dependent
1
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A direct drive D-mode half-bridge power module comprising a high-side switch and a low-side switch con-nected in series, wherein the high-side switch is a D-mode normally-on GaN transistor switch (Q₁) in series with an E-mode normally-off Si MOSFET switch (M₁) and the low-side switch is a D-mode normally-on GaN transistor switch (Q₂), wherein gates of the D-mode normally-on GaN transistor switches Q₁ and Q₂ are directly driven, and the gate of E-mode normally-off Si MOSFET M₁ is directly driven by a control signal, wherein M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and during a fault condition.
2
Dependent← claim 1Direct-drive D-mode GaN half-bridge power module
The direct drive D-mode half-bridge power module of claim 1, comprising a control circuit which determines the operational mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indica-tive of an overcurrent event.
4
Dependent← claim 1Direct-drive D-mode GaN half-bridge power moduleTraction inverter multi-phase motor driver
A traction inverter comprising a multi-phase motor driver, wherein each phase leg comprises a half-bridge module as defined in claim 1.
5
Dependent← claim 1Direct-drive D-mode GaN half-bridge power module
A method of operation of a half-bridge module as defined in claim 1, wherein a control circuit is configured to determine an operational mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indicative of an overcurrent event, the control circuit operating so that: M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if overcurrent protection (OCP) is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
6
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); wherein gates of the D-mode normally-on GaN transistor switches Q₁ or Q₂ are directly driven, and the gate of the E-mode normally-off Si MOSFET M₁ is directly driven by a control circuit, wherein M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and during a fault condition; and the control circuit is configured to determine an opera-tional mode of M₁ responsive to an undervoltage lock-out (UVLO) signal and a voltage sense signal indicative of an overcurrent event, the control circuit operating so that: M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if overcurrent protection (OCP) is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
11
Dependent← claim 6D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 6 wherein: Q₁ comprises a plurality of GaN transistors connected in parallel; M₁ comprises a plurality of Si MOSFETs connected in parallel; Q₂ comprises a plurality of GaN transistors connected in parallel.
7
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; the low side switch is a normally-on switch, comprising a second normally-on GaN transitory switch (Q₂); and Q₁ has a source, a drain and a gate, wherein the drain of Q₁ is connected to the high voltage DC bus and the source of Q₁ is connected to a drain of M1, and the gate of Q₁ is connected to a first gate drive terminal for directly driving the gate of Q1; the source of M₁ is connected to the switching node, a gate of M₁ is connected to an enable (control) terminal for directly driving the gate of the M1; a high-side ground terminal is connected to the source of M1; and a voltage sense B₂ terminal is connected to a common point between the source of Q₁ and the drain of M1; and Q₂ has a source, a drain and a gate, the drain of Q₂ is connected to the switching node and the source of Q₂ is connected to the low voltage DC bus, and the gate of Q₂ is connected to a second gate drive terminal for directly driving the gate of Q2; and a low-side ground terminal is connected to the source of Q2.
8
Dependent← claim 7Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7 wherein: M₁ acts as a protection FET to hold the high-side switch in an off-state during start-up and a fault condition.
9
Dependent← claim 7D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7, wherein: Q₁ comprises a plurality of GaN transistors connected in parallel; M₁ comprises a plurality of Si MOSFETs connected in parallel; Q₂ comprises a plurality of GaN transistors connected in parallel.
10
Dependent← claim 7D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)GaN HEMTDirect-drive D-mode GaN half-bridge power module
The power semiconductor switching device of claim 7, wherein: Q₁ comprises a plurality of GaN HEMTs connected in parallel; M₁ comprises a plurality of Si MOSFET connected in parallel; Q₂ comprises a plurality of GaN HEMTs connected in parallel.
12
IndependentD-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power moduleHalf-bridge driver circuit with control circuit for M1
A power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus and a low voltage DC bus, the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁), the source of Q₁ being connected to the drain of M1; and the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); and a half-bridge driver circuit comprising: a high-side driver for directly driving a gate of Q1; a low-side driver for directly driving a gate of Q2; wherein the high-side driver and the low-side driver are driven by PWM input signals INH and INL respec-tively; and a control circuit for driving M1, wherein the control circuit comprises a gate driver for providing an enable (control) signal for directly driving the gate of M₁ in response to a gate input signal PGOOD, the control circuit having a voltage sense input Vsen from a voltage sense terminal connected to a node between the source of Q₁ and the drain of M1, circuitry for receiving an undervoltage lock-out (UVLO) signal, and determining a power status and operational mode for M1, circuitry for comparing the voltage sense input Vsen to a reference overcurrent protection (OCP) limit volt-age VOCPlimit, wherein said enable signal provides that M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if OCP is triggered, M₁ is ON and Q₁ and Q₂ are turned-off.
13
Dependent← claim 12D-mode GaN transistor (normally-on)E-mode Si MOSFET (normally-off)Direct-drive D-mode GaN half-bridge power moduleHalf-bridge driver circuit with control circuit for M1
The power semiconductor switching device of claim 12 comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, between a high voltage DC bus (rail) and a low voltage DC bus (rail), the high side switch being connected to the low side switch at a switching node, wherein: the high-side switch is a normally-off switch wherein a first normally-on GaN transistor switch (Q₁) is con-nected in series with a normally-off Si MOSFET switch (M₁); and the low side switch is a normally-on switch, comprising a second normally-on GaN transistor switch (Q₂); wherein: Q₁ has a source, a drain and a gate, wherein the drain of Q₁ is connected to the high voltage DC bus and the source of Q₁ is connected to a drain of M1, and the gate of Q₁ is connected to a first gate drive terminal for directly driving the gate of Q1; the source of M₁ is connected to the switching node, a gate of M₁ is connected to an enable (control) terminal for directly driving the gate of the M1; a high-side ground terminal is connected to the source of M1; and a voltage sense B₂ terminal is connected a common point between the source of Q₁ and the drain of M1; and Q₂ has a source, a drain and a gate, the drain of Q₂ is connected to the switching node and the source of Q₂ is connected to the low voltage DC bus, and the gate of Q₂ is connected to a second gate drive terminal for directly driving the gate of Q2; and a low-side ground terminal is connected to the source of Q2; a half-bridge driver circuit comprising: a high-side driver for directly driving a gate of Q1; a low-side driver for directly driving a gate of Q2; wherein the high-side driver and the low-side driver are driven by PWM input signals INH and INL respec-tively; and a control circuit for driving M1, wherein the control circuit comprises a gate driver for providing an enable (control) signal for directly driving the gate of M₁ in response to a gate input signal PGOOD, a voltage sense input Vsen from a voltage sense ter-minal connected to a node between the source of Q₁ and the drain of M1, a UVLO signal input, and circuitry for determining a power status and operational mode for M1, circuitry for comparing the voltage sense input Vsen to a reference OCP limit voltage VOCPlimit and trig-gering OCP if Vsen exceeds the OCP limit voltage; wherein said enable signal provides that M₁ is OFF during start-up until UVLO is off; M₁ is ON for normal operation; M₁ is turned-off during a fault condition if UVLO is turned-on; and if OCP is triggered, M₁ is ON and Q₁ and Q₂ are turned-off. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
Direct-drive D-mode GaN half-bridge power module
D-mode GaN transistor (normally-on)low-side switch (normally-on D-mode GaN Q2)
E-mode Si MOSFET (normally-off)protection/enable FET in series with Q1 (E-mode Si MOSFET M1)
D-mode GaN transistor (normally-on)high-side switch (normally-on D-mode GaN Q1)
Traction inverter multi-phase motor driver
No layer stack recorded.
Half-bridge driver circuit with control circuit for M₁
No layer stack recorded.
Materials
Materials described outside the worked examples.
D-mode GaN transistor (normally-on)
High-Side And Low-Side Switch Active Material (GaN)
E-mode Si MOSFET (normally-off)
Protection FET In Series With High-Side GaN Switch
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Voltage
1.5–1.7 V
—
Voltage
0–15 V
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 11
US 9,349,715 B29,349,715 B2 5/2016 Briere
US 9,406,674 B29,406,674 B2 8/2016 Briere
US 9,692,408 B29,692,408 B2 6/2017 Roberts et al.
US 9,754,937 B19,754,937 B1 9/2017 Lu et al.
US 10,720,913 B110,720,913 B1 7/2020 Leong et al.
US 2014/0055109 A12014/0055109 A1 * 2/2014 Guerra.................. H02M 7/538examiner
Why these are connected
Related documents with shared materials, methods, properties, or citations.
High-Side And Low-Side Switch Active Material (GaN HEMT Variant)
—
Voltage
≥ 10 V
—
US 2014/0070786 A12014/0070786 A1 * 3/2014 Guerra.................... G05F 1/618examiner
US 2014/0225162 A12014/0225162 A1 * 8/2014 Briere................. H01L 27/0688examiner
US 2015/0014698 A12015/0014698 A1 * 1/2015 Briere.................. H03K 17/223examiner
US 2020/0153427 A12020/0153427 A1 5/2020 Bagheri et al.
US 2020/0287536 A12020/0287536 A1 9/2020 Udrea et al.
Cited non-patent literature · 6
Design Considerations of GaN devices for improv- ing power-converter efficiency and density. S. Chellappan, “Design Considerations of GaN devices for improv- ing power-converter efficiency and density” Texas Instruments Tech. Rep. SLYY124, Nov. 2017; pp. 1-8.
Direct-Drive Configuration for GaN devices. P.L. Brohlin et al., “Direct-Drive Configuration for GaN devices”, Texas Instruments Tech. Rep. LSPY008A, Oct. 2016; pp. 1-7.
Gallium Nitride—delivering its promise in Automotive Applications. G. Patterson et al., “Gallium Nitride—delivering its promise in Automotive Applications”,6th Hybrid and Electric Vehicles Con- ference (HEVC 2016), 2016, pp. 1-6, doi: 10.1049/cp.2016.0982. R. Allan, “SiC and GaN vs. IGBTs: The Imminent Tug of War for Supremacy” in Power Electronics, Jul. 27, 2017; pp. 1-6.10.1049/cp.2016.0982
A Performance Comparison of GaN E-HEMTs Versus SiC MOSFETS in Power Switching Applications. J. Xu et al., entitled “A Performance Comparison of GaN E-HEMTs Versus SiC MOSFETS in Power Switching Applications” Bodo’’s Power Systems Jun. 2017; pp. 36-39.
Loss Distribution among Paralleled GaN HEMTs. J. Lu et al., “Loss Distribution among Paralleled GaN HEMTs”, 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 2018, pp. 1914-1919, doi: 10.1109/ECCE.2018.8557988. T. Yoshida et al., “Gate Drive Circuit for Normally on Type GaN FET” 2013; 2nd International Conference on Electric Power Equip- ment—Switching Technology (ICEPE-ST) Matsue, 2013, pp. 1-4, doi: 10.1109/ICEPE-ST.2013.6804367. Advanced Propulsion Centre UK, “Power Electronics Roadmap 2020” Narrative Report; Version 1.0 Feb. 2021; 19 pages.10.1109/ECCE.2018.8557988
The 2018 GaN power electronics roadmap. H. Amano et al., “The 2018 GaN power electronics roadmap” J. Phys D: Appl. Phys. 51 163001; pp. 0-48 2018 IOP Publishing Ltd. (https://doi.org/10.1088/1361-6463/aaaf9d).10.1088/1361-6463/aaaf9d
High-Side And Low-Side Switch Active Material (GaN HEMT Variant)
—
Voltage
≥ 10 V
—
US 2014/0070786 A12014/0070786 A1 * 3/2014 Guerra.................... G05F 1/618examiner
US 2014/0225162 A12014/0225162 A1 * 8/2014 Briere................. H01L 27/0688examiner
US 2015/0014698 A12015/0014698 A1 * 1/2015 Briere.................. H03K 17/223examiner
US 2020/0153427 A12020/0153427 A1 5/2020 Bagheri et al.
US 2020/0287536 A12020/0287536 A1 9/2020 Udrea et al.
Cited non-patent literature · 6
Design Considerations of GaN devices for improv- ing power-converter efficiency and density. S. Chellappan, “Design Considerations of GaN devices for improv- ing power-converter efficiency and density” Texas Instruments Tech. Rep. SLYY124, Nov. 2017; pp. 1-8.
Direct-Drive Configuration for GaN devices. P.L. Brohlin et al., “Direct-Drive Configuration for GaN devices”, Texas Instruments Tech. Rep. LSPY008A, Oct. 2016; pp. 1-7.
Gallium Nitride—delivering its promise in Automotive Applications. G. Patterson et al., “Gallium Nitride—delivering its promise in Automotive Applications”,6th Hybrid and Electric Vehicles Con- ference (HEVC 2016), 2016, pp. 1-6, doi: 10.1049/cp.2016.0982. R. Allan, “SiC and GaN vs. IGBTs: The Imminent Tug of War for Supremacy” in Power Electronics, Jul. 27, 2017; pp. 1-6.10.1049/cp.2016.0982
A Performance Comparison of GaN E-HEMTs Versus SiC MOSFETS in Power Switching Applications. J. Xu et al., entitled “A Performance Comparison of GaN E-HEMTs Versus SiC MOSFETS in Power Switching Applications” Bodo’’s Power Systems Jun. 2017; pp. 36-39.
Loss Distribution among Paralleled GaN HEMTs. J. Lu et al., “Loss Distribution among Paralleled GaN HEMTs”, 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 2018, pp. 1914-1919, doi: 10.1109/ECCE.2018.8557988. T. Yoshida et al., “Gate Drive Circuit for Normally on Type GaN FET” 2013; 2nd International Conference on Electric Power Equip- ment—Switching Technology (ICEPE-ST) Matsue, 2013, pp. 1-4, doi: 10.1109/ICEPE-ST.2013.6804367. Advanced Propulsion Centre UK, “Power Electronics Roadmap 2020” Narrative Report; Version 1.0 Feb. 2021; 19 pages.10.1109/ECCE.2018.8557988
The 2018 GaN power electronics roadmap. H. Amano et al., “The 2018 GaN power electronics roadmap” J. Phys D: Appl. Phys. 51 163001; pp. 0-48 2018 IOP Publishing Ltd. (https://doi.org/10.1088/1361-6463/aaaf9d).10.1088/1361-6463/aaaf9d
High-Side And Low-Side Switch Active Material (GaN HEMT Variant)
—
Voltage
≥ 10 V
—
US 2014/0070786 A12014/0070786 A1 * 3/2014 Guerra.................... G05F 1/618examiner
US 2014/0225162 A12014/0225162 A1 * 8/2014 Briere................. H01L 27/0688examiner
US 2015/0014698 A12015/0014698 A1 * 1/2015 Briere.................. H03K 17/223examiner
US 2020/0153427 A12020/0153427 A1 5/2020 Bagheri et al.
US 2020/0287536 A12020/0287536 A1 9/2020 Udrea et al.
Cited non-patent literature · 6
Design Considerations of GaN devices for improv- ing power-converter efficiency and density. S. Chellappan, “Design Considerations of GaN devices for improv- ing power-converter efficiency and density” Texas Instruments Tech. Rep. SLYY124, Nov. 2017; pp. 1-8.
Direct-Drive Configuration for GaN devices. P.L. Brohlin et al., “Direct-Drive Configuration for GaN devices”, Texas Instruments Tech. Rep. LSPY008A, Oct. 2016; pp. 1-7.
Gallium Nitride—delivering its promise in Automotive Applications. G. Patterson et al., “Gallium Nitride—delivering its promise in Automotive Applications”,6th Hybrid and Electric Vehicles Con- ference (HEVC 2016), 2016, pp. 1-6, doi: 10.1049/cp.2016.0982. R. Allan, “SiC and GaN vs. IGBTs: The Imminent Tug of War for Supremacy” in Power Electronics, Jul. 27, 2017; pp. 1-6.10.1049/cp.2016.0982
A Performance Comparison of GaN E-HEMTs Versus SiC MOSFETS in Power Switching Applications. J. Xu et al., entitled “A Performance Comparison of GaN E-HEMTs Versus SiC MOSFETS in Power Switching Applications” Bodo’’s Power Systems Jun. 2017; pp. 36-39.
Loss Distribution among Paralleled GaN HEMTs. J. Lu et al., “Loss Distribution among Paralleled GaN HEMTs”, 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 2018, pp. 1914-1919, doi: 10.1109/ECCE.2018.8557988. T. Yoshida et al., “Gate Drive Circuit for Normally on Type GaN FET” 2013; 2nd International Conference on Electric Power Equip- ment—Switching Technology (ICEPE-ST) Matsue, 2013, pp. 1-4, doi: 10.1109/ICEPE-ST.2013.6804367. Advanced Propulsion Centre UK, “Power Electronics Roadmap 2020” Narrative Report; Version 1.0 Feb. 2021; 19 pages.10.1109/ECCE.2018.8557988
The 2018 GaN power electronics roadmap. H. Amano et al., “The 2018 GaN power electronics roadmap” J. Phys D: Appl. Phys. 51 163001; pp. 0-48 2018 IOP Publishing Ltd. (https://doi.org/10.1088/1361-6463/aaaf9d).10.1088/1361-6463/aaaf9d
High-Side And Low-Side Switch Active Material (GaN HEMT Variant)
—
Voltage
≥ 10 V
—
US 2014/0070786 A12014/0070786 A1 * 3/2014 Guerra.................... G05F 1/618examiner
US 2014/0225162 A12014/0225162 A1 * 8/2014 Briere................. H01L 27/0688examiner
US 2015/0014698 A12015/0014698 A1 * 1/2015 Briere.................. H03K 17/223examiner
US 2020/0153427 A12020/0153427 A1 5/2020 Bagheri et al.
US 2020/0287536 A12020/0287536 A1 9/2020 Udrea et al.
Cited non-patent literature · 6
Design Considerations of GaN devices for improv- ing power-converter efficiency and density. S. Chellappan, “Design Considerations of GaN devices for improv- ing power-converter efficiency and density” Texas Instruments Tech. Rep. SLYY124, Nov. 2017; pp. 1-8.
Direct-Drive Configuration for GaN devices. P.L. Brohlin et al., “Direct-Drive Configuration for GaN devices”, Texas Instruments Tech. Rep. LSPY008A, Oct. 2016; pp. 1-7.
Gallium Nitride—delivering its promise in Automotive Applications. G. Patterson et al., “Gallium Nitride—delivering its promise in Automotive Applications”,6th Hybrid and Electric Vehicles Con- ference (HEVC 2016), 2016, pp. 1-6, doi: 10.1049/cp.2016.0982. R. Allan, “SiC and GaN vs. IGBTs: The Imminent Tug of War for Supremacy” in Power Electronics, Jul. 27, 2017; pp. 1-6.10.1049/cp.2016.0982
A Performance Comparison of GaN E-HEMTs Versus SiC MOSFETS in Power Switching Applications. J. Xu et al., entitled “A Performance Comparison of GaN E-HEMTs Versus SiC MOSFETS in Power Switching Applications” Bodo’’s Power Systems Jun. 2017; pp. 36-39.
Loss Distribution among Paralleled GaN HEMTs. J. Lu et al., “Loss Distribution among Paralleled GaN HEMTs”, 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 2018, pp. 1914-1919, doi: 10.1109/ECCE.2018.8557988. T. Yoshida et al., “Gate Drive Circuit for Normally on Type GaN FET” 2013; 2nd International Conference on Electric Power Equip- ment—Switching Technology (ICEPE-ST) Matsue, 2013, pp. 1-4, doi: 10.1109/ICEPE-ST.2013.6804367. Advanced Propulsion Centre UK, “Power Electronics Roadmap 2020” Narrative Report; Version 1.0 Feb. 2021; 19 pages.10.1109/ECCE.2018.8557988
The 2018 GaN power electronics roadmap. H. Amano et al., “The 2018 GaN power electronics roadmap” J. Phys D: Appl. Phys. 51 163001; pp. 0-48 2018 IOP Publishing Ltd. (https://doi.org/10.1088/1361-6463/aaaf9d).10.1088/1361-6463/aaaf9d