Patent
US 10,865,112MODIFIED TRACK-ETCHED SUBSTRATES FOR COMPOSITE GRAPHENE MEMBRANES
Scott E. Heise
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 10,865,112Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 illustrates a traditional process for producing a track-etched membrane contrasted with some embodiments of a process described herein. A substrate is …
FIG. 2 illustrates some embodiments of a process described herein. Substrates lacking track-etching and containing patterns or wells may be formed by casting …
FIG. 3 illustrates some of the physical modifications or treatments of
FIG. 4 illustrates bimodal pore distribution obtainable by a process disclosed herein. [0013]
FIG. 5 illustrates some of the surface modifications of FIG. I in accordance with some embodiments, for example, coating, plasma treatment, lamination, use of …
FIG. 6 illustrates well arrangements described herein.
FIG. 7 is a scanning electron microscope (SEM) image of a modified substrate of some embodiments. The image is an aerial view of the first face of a modified …
FIG. 9 is a SEM image of the bottom surface of a well described herein. Track- etched pores (dark spots) are seen on the bottom surface. [0018]
FIG. 10 is a SEM image of a close-up cross section showing the bottom of a well and the second face of a modified substrate described herein. [0019]
FIG. 11 is a SEM image of a cross section of a modified substrate described herein. [0020]
FIG. 12 is a close up SEM image of the cross section of
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A modified substrate comprising: a first face and an opposite facing second face 3 to 30 p m from each other defining a thickness; a first plurality of track-etched pores through the substrate; and a well in the first face of the substrate, wherein the well is from 100 [[1]] to 1,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate, and wherein the pores have an average diameter between 10-2,000 nm. Currently amended
The modified substrate of claim 1, wherein the first plurality of pores comprises about 1x 10 to 1x 10 11 pores per cm 2 of substrate,. Currently amended
The modified substrate of claim 1, wherein the second face comprises a coating of a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), carbon nanotubes (CNT), graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, amorphous carbon and hydrocarbons, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Original
The modified substrate of claim 1, wherein the substrate comprises polysulfones, polyurethane, polymethylmethacrylate (PMMA), polyglycolid acid (PGA), polylactic acid (PLA), polyethylene glycol (PEG), polylactic-co-glycolic acid (PLGA), polyamides, polyimides, polypropylene, polyethersulfones (PES), polyvinylidine fluoride (PVDF), cellulose acetate, polyethylene, polyethylene terephthalate (PET), polypropylene, polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polyether ether ketone (PEEK), polycaprolactone, polydimethylsiloxane (PDMS), block co-polymers of any thereof, or mixtures of any two or more thereof. Original
The modified substrate of claim 1, further comprising nanowires or a support mesh embedded therein. Original
The modified substrate of claim 1, wherein the modified substrate is comprised of two or more materials anisotropically arranged or present in a gradient. Original
The modified substrate of claim 1, wherein the first plurality of pores comprises pores having a diameter at the first face that is between 5 -20 % greater than their diameter at the second face. Original
The modified substrate of claim 1, further comprising a second plurality of pores therethrough, wherein the second plurality of pores comprises pores having an average diameter of up to 50 % the average diameter of the pores of the first plurality of pores and wherein the second plurality of pores is comprised of 1 x10 7 to 1 x 10 13 pores per cm 2 of substrate. Previously presented
The modified substrate of claim 1, wherein the first face further comprises functionalization, texturing, additional etching, plasma treatment, or a coating. Currently amended
The modified substrate of claim 1, wherein all of the bottom surface is 1 to 10 p m from the second face of the substrate Original
A modified substrate comprising: a first face and an opposite facing second face 6 to 30 p m from each other defining a thickness; a first plurality of pores through the substrate, comprising about 1x 1 0 5 to 1x 1011 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm; and a second plurality of pores through the substrate, comprising pores having an average diameter of [[up]] 1 % to 50 % the average diameter of the pores of the first plurality of pores, wherein the second plurality of pores is comprised of 1x 1 0 7 to 1x 10 13 pores per cm 2 of substrate g wherein the second face comprises a coating of a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graph y ne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Currently amended
The modified substrate of claim 20, wherein the pores of the first and/or second pluralities of pores have a diameter at the first face that is between 5 -20% greater than their diameter at the second face. Original
The modified substrate of claim 20, wherein the porosity is between 35 % to 50 %. Original
The modified substrate of claim 20 [[23]], further comprising an intermediate layer comprising electrospun nanofibers between the second face and the two dimensional material. Currently amended
The modified substrate of claim 20, wherein the substrate comprises polysulfones, polyurethane, polymethylmethacrylate (PMMA), polyglycolid acid (PGA), polylactic acid (PLA), polyethylene glycol (PEG), polylactic-co-glycolic acid (PLGA), polyamides, polyimides, polypropylene, polyethersulfones (PES), polyvinylidine fluoride (PVDF), cellulose acetate, polyethylene, polyethylene terephthalate (PET), polypropylene, polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polyether ether ketone (PEEK), polycaprolactone, polydimethylsiloxane (PDMS), block co-polymers of any thereof, or mixtures of any two or more thereof. Original
The modified substrate of claim 20, further comprising nanowires or a support mesh embedded therein. Original
Canceled
A process for modifying a track-etched substrate comprising: providing a track-etched substrate comprising a first face and an opposite facing second face 6 to 30 p m from each other defining a thickness, wherein the track-etched substrate comprises a first plurality of pores through the substrate; and treating the substrate to produce a well in the first face of the substrate, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate. Withdrawn
The process of claim 29, wherein the first plurality of pores comprises about 1x 10 5 to 1x 11 pores per cm 2 of substrate and the pores have an average diameter between 10-10,000 nm. Withdrawn
The process of claim 29, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
The process of claim 29, wherein all of the bottom surface is 1 to 10 p m from the second face of the substrate. Withdrawn
A process for modifying a track-etched substrate comprising: providing a track-etched substrate comprising a first face and an opposite facing second face 3 to 30 p m from each other defining a thickness, wherein the track-etched substrate comprises a first plurality of pores through the substrate; ion-bombarding the substrate to produce a plurality of damage tracks; and track-etching the substrate to produce a second plurality of pores, wherein the first plurality of pores comprises about 1 x 10 5 to 1 x10" 1 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm, and the second plurality of pores comprises pores having an average diameter of up to 50 % the average diameter of the pores of the first plurality of pores, and wherein the second plurality of pores is comprised of 1x 1 0 7 to 1x 10 13 pores per cm 2 of substrate. Withdrawn
The process of claim 42, wherein the track-etching is done with an etch stop protecting the second face, and wherein after the track-etching, the pores of the first and second pluralities of pores have a diameter at the first face that is between 5 -50% greater than their diameter at the second face. Withdrawn
The process of claim 42, wherein the modified substrate has a porosity between 20 % to %. Withdrawn
The process of claim 42, further comprising laser milling, photolithographing, or etching the substrate to produce a well in the first face of the substrate, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate. Withdrawn
The process of claim 42, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, amorphous carbon or hydrocarbons, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
A process for modifying a substrate comprising: casting, laser milling, photolithographing, etching, or a combination thereof, a substrate to produce a substrate having a first face and an opposite facing second face 3 to 30 pm from each other defining a thickness, and having a well in the first face, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 pm from the second face of the substrate; ion-bombarding the substrate to produce a plurality of damage tracks through the substrate; and etching the substrate to produce a first plurality of pores through the substrate. Withdrawn
The process of claim 52, wherein the substrate produced comprises two or more materials, wherein the two or more materials comprise a heterogeneous substrate, anisotropic substrate, embedded nanowires, an embedded support mesh, or the two or more materials comprise two or more layers of the substrate; or any combination thereof. Withdrawn
The process of claim 52, wherein the first plurality of pores comprises about 1x 10 5 to 1x 12 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm. Withdrawn
The process of claim 52, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
The process of claim 52, further comprising functionalization, texturing, plasma treating or coating of the first face of the substrate, wherein the coating is selected from a hydrogel, nonporous graphene, graphene oxide, carbon nanotubes, electrospun nanofibers, or a combination thereof. Withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
modified track-etched substrate with well
modified substrate with dual pore pluralities and 2D material coating
Materials described outside the worked examples.
track-etched substrate
graphene
graphene platelets
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 7 is a scanning electron microscope (SEM) image of a modified substrate of some embodiments. The image is an aerial view of the first face of a modified …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 40–50 nm | — |
Thickness | 50–70 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,865,112Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 illustrates a traditional process for producing a track-etched membrane contrasted with some embodiments of a process described herein. A substrate is …
FIG. 2 illustrates some embodiments of a process described herein. Substrates lacking track-etching and containing patterns or wells may be formed by casting …
FIG. 3 illustrates some of the physical modifications or treatments of
FIG. 4 illustrates bimodal pore distribution obtainable by a process disclosed herein. [0013]
FIG. 5 illustrates some of the surface modifications of FIG. I in accordance with some embodiments, for example, coating, plasma treatment, lamination, use of …
FIG. 6 illustrates well arrangements described herein.
FIG. 7 is a scanning electron microscope (SEM) image of a modified substrate of some embodiments. The image is an aerial view of the first face of a modified …
FIG. 9 is a SEM image of the bottom surface of a well described herein. Track- etched pores (dark spots) are seen on the bottom surface. [0018]
FIG. 10 is a SEM image of a close-up cross section showing the bottom of a well and the second face of a modified substrate described herein. [0019]
FIG. 11 is a SEM image of a cross section of a modified substrate described herein. [0020]
FIG. 12 is a close up SEM image of the cross section of
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A modified substrate comprising: a first face and an opposite facing second face 3 to 30 p m from each other defining a thickness; a first plurality of track-etched pores through the substrate; and a well in the first face of the substrate, wherein the well is from 100 [[1]] to 1,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate, and wherein the pores have an average diameter between 10-2,000 nm. Currently amended
The modified substrate of claim 1, wherein the first plurality of pores comprises about 1x 10 to 1x 10 11 pores per cm 2 of substrate,. Currently amended
The modified substrate of claim 1, wherein the second face comprises a coating of a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), carbon nanotubes (CNT), graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, amorphous carbon and hydrocarbons, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Original
The modified substrate of claim 1, wherein the substrate comprises polysulfones, polyurethane, polymethylmethacrylate (PMMA), polyglycolid acid (PGA), polylactic acid (PLA), polyethylene glycol (PEG), polylactic-co-glycolic acid (PLGA), polyamides, polyimides, polypropylene, polyethersulfones (PES), polyvinylidine fluoride (PVDF), cellulose acetate, polyethylene, polyethylene terephthalate (PET), polypropylene, polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polyether ether ketone (PEEK), polycaprolactone, polydimethylsiloxane (PDMS), block co-polymers of any thereof, or mixtures of any two or more thereof. Original
The modified substrate of claim 1, further comprising nanowires or a support mesh embedded therein. Original
The modified substrate of claim 1, wherein the modified substrate is comprised of two or more materials anisotropically arranged or present in a gradient. Original
The modified substrate of claim 1, wherein the first plurality of pores comprises pores having a diameter at the first face that is between 5 -20 % greater than their diameter at the second face. Original
The modified substrate of claim 1, further comprising a second plurality of pores therethrough, wherein the second plurality of pores comprises pores having an average diameter of up to 50 % the average diameter of the pores of the first plurality of pores and wherein the second plurality of pores is comprised of 1 x10 7 to 1 x 10 13 pores per cm 2 of substrate. Previously presented
The modified substrate of claim 1, wherein the first face further comprises functionalization, texturing, additional etching, plasma treatment, or a coating. Currently amended
The modified substrate of claim 1, wherein all of the bottom surface is 1 to 10 p m from the second face of the substrate Original
A modified substrate comprising: a first face and an opposite facing second face 6 to 30 p m from each other defining a thickness; a first plurality of pores through the substrate, comprising about 1x 1 0 5 to 1x 1011 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm; and a second plurality of pores through the substrate, comprising pores having an average diameter of [[up]] 1 % to 50 % the average diameter of the pores of the first plurality of pores, wherein the second plurality of pores is comprised of 1x 1 0 7 to 1x 10 13 pores per cm 2 of substrate g wherein the second face comprises a coating of a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graph y ne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Currently amended
The modified substrate of claim 20, wherein the pores of the first and/or second pluralities of pores have a diameter at the first face that is between 5 -20% greater than their diameter at the second face. Original
The modified substrate of claim 20, wherein the porosity is between 35 % to 50 %. Original
The modified substrate of claim 20 [[23]], further comprising an intermediate layer comprising electrospun nanofibers between the second face and the two dimensional material. Currently amended
The modified substrate of claim 20, wherein the substrate comprises polysulfones, polyurethane, polymethylmethacrylate (PMMA), polyglycolid acid (PGA), polylactic acid (PLA), polyethylene glycol (PEG), polylactic-co-glycolic acid (PLGA), polyamides, polyimides, polypropylene, polyethersulfones (PES), polyvinylidine fluoride (PVDF), cellulose acetate, polyethylene, polyethylene terephthalate (PET), polypropylene, polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polyether ether ketone (PEEK), polycaprolactone, polydimethylsiloxane (PDMS), block co-polymers of any thereof, or mixtures of any two or more thereof. Original
The modified substrate of claim 20, further comprising nanowires or a support mesh embedded therein. Original
Canceled
A process for modifying a track-etched substrate comprising: providing a track-etched substrate comprising a first face and an opposite facing second face 6 to 30 p m from each other defining a thickness, wherein the track-etched substrate comprises a first plurality of pores through the substrate; and treating the substrate to produce a well in the first face of the substrate, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate. Withdrawn
The process of claim 29, wherein the first plurality of pores comprises about 1x 10 5 to 1x 11 pores per cm 2 of substrate and the pores have an average diameter between 10-10,000 nm. Withdrawn
The process of claim 29, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
The process of claim 29, wherein all of the bottom surface is 1 to 10 p m from the second face of the substrate. Withdrawn
A process for modifying a track-etched substrate comprising: providing a track-etched substrate comprising a first face and an opposite facing second face 3 to 30 p m from each other defining a thickness, wherein the track-etched substrate comprises a first plurality of pores through the substrate; ion-bombarding the substrate to produce a plurality of damage tracks; and track-etching the substrate to produce a second plurality of pores, wherein the first plurality of pores comprises about 1 x 10 5 to 1 x10" 1 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm, and the second plurality of pores comprises pores having an average diameter of up to 50 % the average diameter of the pores of the first plurality of pores, and wherein the second plurality of pores is comprised of 1x 1 0 7 to 1x 10 13 pores per cm 2 of substrate. Withdrawn
The process of claim 42, wherein the track-etching is done with an etch stop protecting the second face, and wherein after the track-etching, the pores of the first and second pluralities of pores have a diameter at the first face that is between 5 -50% greater than their diameter at the second face. Withdrawn
The process of claim 42, wherein the modified substrate has a porosity between 20 % to %. Withdrawn
The process of claim 42, further comprising laser milling, photolithographing, or etching the substrate to produce a well in the first face of the substrate, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate. Withdrawn
The process of claim 42, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, amorphous carbon or hydrocarbons, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
A process for modifying a substrate comprising: casting, laser milling, photolithographing, etching, or a combination thereof, a substrate to produce a substrate having a first face and an opposite facing second face 3 to 30 pm from each other defining a thickness, and having a well in the first face, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 pm from the second face of the substrate; ion-bombarding the substrate to produce a plurality of damage tracks through the substrate; and etching the substrate to produce a first plurality of pores through the substrate. Withdrawn
The process of claim 52, wherein the substrate produced comprises two or more materials, wherein the two or more materials comprise a heterogeneous substrate, anisotropic substrate, embedded nanowires, an embedded support mesh, or the two or more materials comprise two or more layers of the substrate; or any combination thereof. Withdrawn
The process of claim 52, wherein the first plurality of pores comprises about 1x 10 5 to 1x 12 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm. Withdrawn
The process of claim 52, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
The process of claim 52, further comprising functionalization, texturing, plasma treating or coating of the first face of the substrate, wherein the coating is selected from a hydrogel, nonporous graphene, graphene oxide, carbon nanotubes, electrospun nanofibers, or a combination thereof. Withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
modified track-etched substrate with well
modified substrate with dual pore pluralities and 2D material coating
Materials described outside the worked examples.
track-etched substrate
graphene
graphene platelets
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 7 is a scanning electron microscope (SEM) image of a modified substrate of some embodiments. The image is an aerial view of the first face of a modified …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 40–50 nm | — |
Thickness | 50–70 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,865,112Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 illustrates a traditional process for producing a track-etched membrane contrasted with some embodiments of a process described herein. A substrate is …
FIG. 2 illustrates some embodiments of a process described herein. Substrates lacking track-etching and containing patterns or wells may be formed by casting …
FIG. 3 illustrates some of the physical modifications or treatments of
FIG. 4 illustrates bimodal pore distribution obtainable by a process disclosed herein. [0013]
FIG. 5 illustrates some of the surface modifications of FIG. I in accordance with some embodiments, for example, coating, plasma treatment, lamination, use of …
FIG. 6 illustrates well arrangements described herein.
FIG. 7 is a scanning electron microscope (SEM) image of a modified substrate of some embodiments. The image is an aerial view of the first face of a modified …
FIG. 9 is a SEM image of the bottom surface of a well described herein. Track- etched pores (dark spots) are seen on the bottom surface. [0018]
FIG. 10 is a SEM image of a close-up cross section showing the bottom of a well and the second face of a modified substrate described herein. [0019]
FIG. 11 is a SEM image of a cross section of a modified substrate described herein. [0020]
FIG. 12 is a close up SEM image of the cross section of
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A modified substrate comprising: a first face and an opposite facing second face 3 to 30 p m from each other defining a thickness; a first plurality of track-etched pores through the substrate; and a well in the first face of the substrate, wherein the well is from 100 [[1]] to 1,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate, and wherein the pores have an average diameter between 10-2,000 nm. Currently amended
The modified substrate of claim 1, wherein the first plurality of pores comprises about 1x 10 to 1x 10 11 pores per cm 2 of substrate,. Currently amended
The modified substrate of claim 1, wherein the second face comprises a coating of a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), carbon nanotubes (CNT), graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, amorphous carbon and hydrocarbons, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Original
The modified substrate of claim 1, wherein the substrate comprises polysulfones, polyurethane, polymethylmethacrylate (PMMA), polyglycolid acid (PGA), polylactic acid (PLA), polyethylene glycol (PEG), polylactic-co-glycolic acid (PLGA), polyamides, polyimides, polypropylene, polyethersulfones (PES), polyvinylidine fluoride (PVDF), cellulose acetate, polyethylene, polyethylene terephthalate (PET), polypropylene, polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polyether ether ketone (PEEK), polycaprolactone, polydimethylsiloxane (PDMS), block co-polymers of any thereof, or mixtures of any two or more thereof. Original
The modified substrate of claim 1, further comprising nanowires or a support mesh embedded therein. Original
The modified substrate of claim 1, wherein the modified substrate is comprised of two or more materials anisotropically arranged or present in a gradient. Original
The modified substrate of claim 1, wherein the first plurality of pores comprises pores having a diameter at the first face that is between 5 -20 % greater than their diameter at the second face. Original
The modified substrate of claim 1, further comprising a second plurality of pores therethrough, wherein the second plurality of pores comprises pores having an average diameter of up to 50 % the average diameter of the pores of the first plurality of pores and wherein the second plurality of pores is comprised of 1 x10 7 to 1 x 10 13 pores per cm 2 of substrate. Previously presented
The modified substrate of claim 1, wherein the first face further comprises functionalization, texturing, additional etching, plasma treatment, or a coating. Currently amended
The modified substrate of claim 1, wherein all of the bottom surface is 1 to 10 p m from the second face of the substrate Original
A modified substrate comprising: a first face and an opposite facing second face 6 to 30 p m from each other defining a thickness; a first plurality of pores through the substrate, comprising about 1x 1 0 5 to 1x 1011 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm; and a second plurality of pores through the substrate, comprising pores having an average diameter of [[up]] 1 % to 50 % the average diameter of the pores of the first plurality of pores, wherein the second plurality of pores is comprised of 1x 1 0 7 to 1x 10 13 pores per cm 2 of substrate g wherein the second face comprises a coating of a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graph y ne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Currently amended
The modified substrate of claim 20, wherein the pores of the first and/or second pluralities of pores have a diameter at the first face that is between 5 -20% greater than their diameter at the second face. Original
The modified substrate of claim 20, wherein the porosity is between 35 % to 50 %. Original
The modified substrate of claim 20 [[23]], further comprising an intermediate layer comprising electrospun nanofibers between the second face and the two dimensional material. Currently amended
The modified substrate of claim 20, wherein the substrate comprises polysulfones, polyurethane, polymethylmethacrylate (PMMA), polyglycolid acid (PGA), polylactic acid (PLA), polyethylene glycol (PEG), polylactic-co-glycolic acid (PLGA), polyamides, polyimides, polypropylene, polyethersulfones (PES), polyvinylidine fluoride (PVDF), cellulose acetate, polyethylene, polyethylene terephthalate (PET), polypropylene, polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polyether ether ketone (PEEK), polycaprolactone, polydimethylsiloxane (PDMS), block co-polymers of any thereof, or mixtures of any two or more thereof. Original
The modified substrate of claim 20, further comprising nanowires or a support mesh embedded therein. Original
Canceled
A process for modifying a track-etched substrate comprising: providing a track-etched substrate comprising a first face and an opposite facing second face 6 to 30 p m from each other defining a thickness, wherein the track-etched substrate comprises a first plurality of pores through the substrate; and treating the substrate to produce a well in the first face of the substrate, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate. Withdrawn
The process of claim 29, wherein the first plurality of pores comprises about 1x 10 5 to 1x 11 pores per cm 2 of substrate and the pores have an average diameter between 10-10,000 nm. Withdrawn
The process of claim 29, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
The process of claim 29, wherein all of the bottom surface is 1 to 10 p m from the second face of the substrate. Withdrawn
A process for modifying a track-etched substrate comprising: providing a track-etched substrate comprising a first face and an opposite facing second face 3 to 30 p m from each other defining a thickness, wherein the track-etched substrate comprises a first plurality of pores through the substrate; ion-bombarding the substrate to produce a plurality of damage tracks; and track-etching the substrate to produce a second plurality of pores, wherein the first plurality of pores comprises about 1 x 10 5 to 1 x10" 1 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm, and the second plurality of pores comprises pores having an average diameter of up to 50 % the average diameter of the pores of the first plurality of pores, and wherein the second plurality of pores is comprised of 1x 1 0 7 to 1x 10 13 pores per cm 2 of substrate. Withdrawn
The process of claim 42, wherein the track-etching is done with an etch stop protecting the second face, and wherein after the track-etching, the pores of the first and second pluralities of pores have a diameter at the first face that is between 5 -50% greater than their diameter at the second face. Withdrawn
The process of claim 42, wherein the modified substrate has a porosity between 20 % to %. Withdrawn
The process of claim 42, further comprising laser milling, photolithographing, or etching the substrate to produce a well in the first face of the substrate, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate. Withdrawn
The process of claim 42, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, amorphous carbon or hydrocarbons, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
A process for modifying a substrate comprising: casting, laser milling, photolithographing, etching, or a combination thereof, a substrate to produce a substrate having a first face and an opposite facing second face 3 to 30 pm from each other defining a thickness, and having a well in the first face, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 pm from the second face of the substrate; ion-bombarding the substrate to produce a plurality of damage tracks through the substrate; and etching the substrate to produce a first plurality of pores through the substrate. Withdrawn
The process of claim 52, wherein the substrate produced comprises two or more materials, wherein the two or more materials comprise a heterogeneous substrate, anisotropic substrate, embedded nanowires, an embedded support mesh, or the two or more materials comprise two or more layers of the substrate; or any combination thereof. Withdrawn
The process of claim 52, wherein the first plurality of pores comprises about 1x 10 5 to 1x 12 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm. Withdrawn
The process of claim 52, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
The process of claim 52, further comprising functionalization, texturing, plasma treating or coating of the first face of the substrate, wherein the coating is selected from a hydrogel, nonporous graphene, graphene oxide, carbon nanotubes, electrospun nanofibers, or a combination thereof. Withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
modified track-etched substrate with well
modified substrate with dual pore pluralities and 2D material coating
Materials described outside the worked examples.
track-etched substrate
graphene
graphene platelets
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 7 is a scanning electron microscope (SEM) image of a modified substrate of some embodiments. The image is an aerial view of the first face of a modified …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 40–50 nm | — |
Thickness | 50–70 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,865,112Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 illustrates a traditional process for producing a track-etched membrane contrasted with some embodiments of a process described herein. A substrate is …
FIG. 2 illustrates some embodiments of a process described herein. Substrates lacking track-etching and containing patterns or wells may be formed by casting …
FIG. 3 illustrates some of the physical modifications or treatments of
FIG. 4 illustrates bimodal pore distribution obtainable by a process disclosed herein. [0013]
FIG. 5 illustrates some of the surface modifications of FIG. I in accordance with some embodiments, for example, coating, plasma treatment, lamination, use of …
FIG. 6 illustrates well arrangements described herein.
FIG. 7 is a scanning electron microscope (SEM) image of a modified substrate of some embodiments. The image is an aerial view of the first face of a modified …
FIG. 9 is a SEM image of the bottom surface of a well described herein. Track- etched pores (dark spots) are seen on the bottom surface. [0018]
FIG. 10 is a SEM image of a close-up cross section showing the bottom of a well and the second face of a modified substrate described herein. [0019]
FIG. 11 is a SEM image of a cross section of a modified substrate described herein. [0020]
FIG. 12 is a close up SEM image of the cross section of
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A modified substrate comprising: a first face and an opposite facing second face 3 to 30 p m from each other defining a thickness; a first plurality of track-etched pores through the substrate; and a well in the first face of the substrate, wherein the well is from 100 [[1]] to 1,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate, and wherein the pores have an average diameter between 10-2,000 nm. Currently amended
The modified substrate of claim 1, wherein the first plurality of pores comprises about 1x 10 to 1x 10 11 pores per cm 2 of substrate,. Currently amended
The modified substrate of claim 1, wherein the second face comprises a coating of a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), carbon nanotubes (CNT), graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, amorphous carbon and hydrocarbons, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Original
The modified substrate of claim 1, wherein the substrate comprises polysulfones, polyurethane, polymethylmethacrylate (PMMA), polyglycolid acid (PGA), polylactic acid (PLA), polyethylene glycol (PEG), polylactic-co-glycolic acid (PLGA), polyamides, polyimides, polypropylene, polyethersulfones (PES), polyvinylidine fluoride (PVDF), cellulose acetate, polyethylene, polyethylene terephthalate (PET), polypropylene, polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polyether ether ketone (PEEK), polycaprolactone, polydimethylsiloxane (PDMS), block co-polymers of any thereof, or mixtures of any two or more thereof. Original
The modified substrate of claim 1, further comprising nanowires or a support mesh embedded therein. Original
The modified substrate of claim 1, wherein the modified substrate is comprised of two or more materials anisotropically arranged or present in a gradient. Original
The modified substrate of claim 1, wherein the first plurality of pores comprises pores having a diameter at the first face that is between 5 -20 % greater than their diameter at the second face. Original
The modified substrate of claim 1, further comprising a second plurality of pores therethrough, wherein the second plurality of pores comprises pores having an average diameter of up to 50 % the average diameter of the pores of the first plurality of pores and wherein the second plurality of pores is comprised of 1 x10 7 to 1 x 10 13 pores per cm 2 of substrate. Previously presented
The modified substrate of claim 1, wherein the first face further comprises functionalization, texturing, additional etching, plasma treatment, or a coating. Currently amended
The modified substrate of claim 1, wherein all of the bottom surface is 1 to 10 p m from the second face of the substrate Original
A modified substrate comprising: a first face and an opposite facing second face 6 to 30 p m from each other defining a thickness; a first plurality of pores through the substrate, comprising about 1x 1 0 5 to 1x 1011 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm; and a second plurality of pores through the substrate, comprising pores having an average diameter of [[up]] 1 % to 50 % the average diameter of the pores of the first plurality of pores, wherein the second plurality of pores is comprised of 1x 1 0 7 to 1x 10 13 pores per cm 2 of substrate g wherein the second face comprises a coating of a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graph y ne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Currently amended
The modified substrate of claim 20, wherein the pores of the first and/or second pluralities of pores have a diameter at the first face that is between 5 -20% greater than their diameter at the second face. Original
The modified substrate of claim 20, wherein the porosity is between 35 % to 50 %. Original
The modified substrate of claim 20 [[23]], further comprising an intermediate layer comprising electrospun nanofibers between the second face and the two dimensional material. Currently amended
The modified substrate of claim 20, wherein the substrate comprises polysulfones, polyurethane, polymethylmethacrylate (PMMA), polyglycolid acid (PGA), polylactic acid (PLA), polyethylene glycol (PEG), polylactic-co-glycolic acid (PLGA), polyamides, polyimides, polypropylene, polyethersulfones (PES), polyvinylidine fluoride (PVDF), cellulose acetate, polyethylene, polyethylene terephthalate (PET), polypropylene, polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polyether ether ketone (PEEK), polycaprolactone, polydimethylsiloxane (PDMS), block co-polymers of any thereof, or mixtures of any two or more thereof. Original
The modified substrate of claim 20, further comprising nanowires or a support mesh embedded therein. Original
Canceled
A process for modifying a track-etched substrate comprising: providing a track-etched substrate comprising a first face and an opposite facing second face 6 to 30 p m from each other defining a thickness, wherein the track-etched substrate comprises a first plurality of pores through the substrate; and treating the substrate to produce a well in the first face of the substrate, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate. Withdrawn
The process of claim 29, wherein the first plurality of pores comprises about 1x 10 5 to 1x 11 pores per cm 2 of substrate and the pores have an average diameter between 10-10,000 nm. Withdrawn
The process of claim 29, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
The process of claim 29, wherein all of the bottom surface is 1 to 10 p m from the second face of the substrate. Withdrawn
A process for modifying a track-etched substrate comprising: providing a track-etched substrate comprising a first face and an opposite facing second face 3 to 30 p m from each other defining a thickness, wherein the track-etched substrate comprises a first plurality of pores through the substrate; ion-bombarding the substrate to produce a plurality of damage tracks; and track-etching the substrate to produce a second plurality of pores, wherein the first plurality of pores comprises about 1 x 10 5 to 1 x10" 1 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm, and the second plurality of pores comprises pores having an average diameter of up to 50 % the average diameter of the pores of the first plurality of pores, and wherein the second plurality of pores is comprised of 1x 1 0 7 to 1x 10 13 pores per cm 2 of substrate. Withdrawn
The process of claim 42, wherein the track-etching is done with an etch stop protecting the second face, and wherein after the track-etching, the pores of the first and second pluralities of pores have a diameter at the first face that is between 5 -50% greater than their diameter at the second face. Withdrawn
The process of claim 42, wherein the modified substrate has a porosity between 20 % to %. Withdrawn
The process of claim 42, further comprising laser milling, photolithographing, or etching the substrate to produce a well in the first face of the substrate, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 p m from the second face of the substrate. Withdrawn
The process of claim 42, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, amorphous carbon or hydrocarbons, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
A process for modifying a substrate comprising: casting, laser milling, photolithographing, etching, or a combination thereof, a substrate to produce a substrate having a first face and an opposite facing second face 3 to 30 pm from each other defining a thickness, and having a well in the first face, wherein the well is from 1 to 10,000 p m in diameter, and wherein the well comprises a bottom surface that is 1 to 10 pm from the second face of the substrate; ion-bombarding the substrate to produce a plurality of damage tracks through the substrate; and etching the substrate to produce a first plurality of pores through the substrate. Withdrawn
The process of claim 52, wherein the substrate produced comprises two or more materials, wherein the two or more materials comprise a heterogeneous substrate, anisotropic substrate, embedded nanowires, an embedded support mesh, or the two or more materials comprise two or more layers of the substrate; or any combination thereof. Withdrawn
The process of claim 52, wherein the first plurality of pores comprises about 1x 10 5 to 1x 12 pores per cm 2 of substrate and pores having an average diameter between 10-10,000 nm. Withdrawn
The process of claim 52, further comprising coating the second face of the substrate with a two dimensional material or multiple layers thereof, wherein the two dimensional material is selected from graphene, graphene platelets, black phosphorous, hafnium dioxide, molybdenum disulfide, molybdenum diselenide, carbide, a carbon nanomembrane (CNM), a carbon nanotube (CNT), amorphous carbon and hydrocarbons, graphyne, borophene, germanene, silicone, Si₂BN, stanine, phosphorene, bismuthene, molybdenite, palladium, rhodium, Pb/Sn alloy, Pb/Bi alloy, aerographite, aerogel, nanogel, carbon nanofoam, hexagonal boron nitride, borocarbonitride, germanane, transition metal dichalcogenide, or any combination thereof. Withdrawn
The process of claim 52, further comprising functionalization, texturing, plasma treating or coating of the first face of the substrate, wherein the coating is selected from a hydrogel, nonporous graphene, graphene oxide, carbon nanotubes, electrospun nanofibers, or a combination thereof. Withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
modified track-etched substrate with well
modified substrate with dual pore pluralities and 2D material coating
Materials described outside the worked examples.
track-etched substrate
graphene
graphene platelets
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 7 is a scanning electron microscope (SEM) image of a modified substrate of some embodiments. The image is an aerial view of the first face of a modified …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 40–50 nm | — |
Thickness | 50–70 nm |
Related documents with shared materials, methods, properties, or citations.
black phosphorous
hafnium dioxide
HfO₂
molybdenum disulfide
MoS₂
molybdenum diselenide
MoSe₂
carbide
carbon nanomembrane (CNM)
carbon nanotubes (CNT)
graphyne
borophene
germanene
silicene
Si₂BN
stanene
phosphorene
bismuthene
molybdenite
palladium
Pd
rhodium
Rh
Pb/Sn alloy
Pb/Bi alloy
aerographite
aerogel
nanogel
carbon nanofoam
hexagonal boron nitride
h-BN
electrospun nanofibers
carbon nanotubes
polymeric substrate materials
hydrogel
nonporous graphene
graphene oxide
FIG. 9 is a SEM image of the bottom surface of a well described herein. Track- etched pores (dark spots) are seen on the bottom surface. [0018]
FIG. 10 is a SEM image of a close-up cross section showing the bottom of a well and the second face of a modified substrate described herein. [0019]
FIG. 11 is a SEM image of a cross section of a modified substrate described herein. [0020]
FIG. 12 is a close up SEM image of the cross section of
| — |
Thickness | 70–100 nm | — |
Thickness | 10–50 nm | — |
Thickness | 1–10 nm | — |
Thickness | 500–1000 nm | — |
Thickness | 6000–8000 nm | — |
Thickness | 8000–10000 nm | — |
Thickness | 1–100 nm | — |
Thickness | 1–20 nm | — |
Thickness | 1–5 nm | — |
Thickness | 100–1000000 nm | — |
Thickness | 150–300 nm | — |
Thickness | 5–100 nm | — |
Thickness | 5–50 nm | — |
Thickness | 5–35 nm | — |
Thickness | 5–20 nm | — |
Thickness | 5–15 nm | — |
Thickness | 5–10 nm | — |
Thickness | 0.34–10 nm | — |
Thickness | 0.34–5 nm | — |
Thickness | 0.34–3 nm | — |
Temperature | 0–20 °C | — |
Temperature | 20–40 °C | — |
Temperature | 40–60 °C | — |
Temperature | 60–80 °C | — |
Temperature | 80–100 °C | — |
Temperature | 100–120 °C | — |
Temperature | 120–140 °C | — |
Temperature | 140–160 °C | — |
Temperature | 160–180 °C | — |
Duration | 1–20 minutes | — |
Duration | 1–3 minutes | — |
Duration | 3–9 minutes | — |
Duration | 9–12 minutes | — |
Duration | 12–15 minutes | — |
Duration | 15–18 minutes | — |
Thickness | 0.3–10 nm | — |
Thickness | 5–25 nm | — |
Thickness | 7–25 nm | — |
Thickness | 7–20 nm | — |
Thickness | 10–25 nm | — |
Thickness | 15–25 nm | — |
Thickness | 50–100 nm | — |
Thickness | 50–150 nm | — |
Thickness | 100–500 nm | — |
Thickness | 10–10000 nm | — |
Thickness | 100–2000 nm | — |
Thickness | 2000–10000 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 10 nm | — |
Duration | ≤ 1 second | — |
Duration | ≤ 0.75 seconds | — |
Duration | ≤ 0.5 seconds | — |
Duration | ≤ 0.25 seconds | — |
Duration | ≤ 0.1 seconds | — |
Thickness | ≤ 300 nm | — |
Duration | ≤ 1 minute | — |
Temperature | ≥ 180 °C | — |
Duration | ≥ 18 minutes | — |
Duration | ≥ 40 minutes | — |
Thickness | 10–2000 nm | — |
black phosphorous
hafnium dioxide
HfO₂
molybdenum disulfide
MoS₂
molybdenum diselenide
MoSe₂
carbide
carbon nanomembrane (CNM)
carbon nanotubes (CNT)
graphyne
borophene
germanene
silicene
Si₂BN
stanene
phosphorene
bismuthene
molybdenite
palladium
Pd
rhodium
Rh
Pb/Sn alloy
Pb/Bi alloy
aerographite
aerogel
nanogel
carbon nanofoam
hexagonal boron nitride
h-BN
electrospun nanofibers
carbon nanotubes
polymeric substrate materials
hydrogel
nonporous graphene
graphene oxide
FIG. 9 is a SEM image of the bottom surface of a well described herein. Track- etched pores (dark spots) are seen on the bottom surface. [0018]
FIG. 10 is a SEM image of a close-up cross section showing the bottom of a well and the second face of a modified substrate described herein. [0019]
FIG. 11 is a SEM image of a cross section of a modified substrate described herein. [0020]
FIG. 12 is a close up SEM image of the cross section of
| — |
Thickness | 70–100 nm | — |
Thickness | 10–50 nm | — |
Thickness | 1–10 nm | — |
Thickness | 500–1000 nm | — |
Thickness | 6000–8000 nm | — |
Thickness | 8000–10000 nm | — |
Thickness | 1–100 nm | — |
Thickness | 1–20 nm | — |
Thickness | 1–5 nm | — |
Thickness | 100–1000000 nm | — |
Thickness | 150–300 nm | — |
Thickness | 5–100 nm | — |
Thickness | 5–50 nm | — |
Thickness | 5–35 nm | — |
Thickness | 5–20 nm | — |
Thickness | 5–15 nm | — |
Thickness | 5–10 nm | — |
Thickness | 0.34–10 nm | — |
Thickness | 0.34–5 nm | — |
Thickness | 0.34–3 nm | — |
Temperature | 0–20 °C | — |
Temperature | 20–40 °C | — |
Temperature | 40–60 °C | — |
Temperature | 60–80 °C | — |
Temperature | 80–100 °C | — |
Temperature | 100–120 °C | — |
Temperature | 120–140 °C | — |
Temperature | 140–160 °C | — |
Temperature | 160–180 °C | — |
Duration | 1–20 minutes | — |
Duration | 1–3 minutes | — |
Duration | 3–9 minutes | — |
Duration | 9–12 minutes | — |
Duration | 12–15 minutes | — |
Duration | 15–18 minutes | — |
Thickness | 0.3–10 nm | — |
Thickness | 5–25 nm | — |
Thickness | 7–25 nm | — |
Thickness | 7–20 nm | — |
Thickness | 10–25 nm | — |
Thickness | 15–25 nm | — |
Thickness | 50–100 nm | — |
Thickness | 50–150 nm | — |
Thickness | 100–500 nm | — |
Thickness | 10–10000 nm | — |
Thickness | 100–2000 nm | — |
Thickness | 2000–10000 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 10 nm | — |
Duration | ≤ 1 second | — |
Duration | ≤ 0.75 seconds | — |
Duration | ≤ 0.5 seconds | — |
Duration | ≤ 0.25 seconds | — |
Duration | ≤ 0.1 seconds | — |
Thickness | ≤ 300 nm | — |
Duration | ≤ 1 minute | — |
Temperature | ≥ 180 °C | — |
Duration | ≥ 18 minutes | — |
Duration | ≥ 40 minutes | — |
Thickness | 10–2000 nm | — |
black phosphorous
hafnium dioxide
HfO₂
molybdenum disulfide
MoS₂
molybdenum diselenide
MoSe₂
carbide
carbon nanomembrane (CNM)
carbon nanotubes (CNT)
graphyne
borophene
germanene
silicene
Si₂BN
stanene
phosphorene
bismuthene
molybdenite
palladium
Pd
rhodium
Rh
Pb/Sn alloy
Pb/Bi alloy
aerographite
aerogel
nanogel
carbon nanofoam
hexagonal boron nitride
h-BN
electrospun nanofibers
carbon nanotubes
polymeric substrate materials
hydrogel
nonporous graphene
graphene oxide
FIG. 9 is a SEM image of the bottom surface of a well described herein. Track- etched pores (dark spots) are seen on the bottom surface. [0018]
FIG. 10 is a SEM image of a close-up cross section showing the bottom of a well and the second face of a modified substrate described herein. [0019]
FIG. 11 is a SEM image of a cross section of a modified substrate described herein. [0020]
FIG. 12 is a close up SEM image of the cross section of
| — |
Thickness | 70–100 nm | — |
Thickness | 10–50 nm | — |
Thickness | 1–10 nm | — |
Thickness | 500–1000 nm | — |
Thickness | 6000–8000 nm | — |
Thickness | 8000–10000 nm | — |
Thickness | 1–100 nm | — |
Thickness | 1–20 nm | — |
Thickness | 1–5 nm | — |
Thickness | 100–1000000 nm | — |
Thickness | 150–300 nm | — |
Thickness | 5–100 nm | — |
Thickness | 5–50 nm | — |
Thickness | 5–35 nm | — |
Thickness | 5–20 nm | — |
Thickness | 5–15 nm | — |
Thickness | 5–10 nm | — |
Thickness | 0.34–10 nm | — |
Thickness | 0.34–5 nm | — |
Thickness | 0.34–3 nm | — |
Temperature | 0–20 °C | — |
Temperature | 20–40 °C | — |
Temperature | 40–60 °C | — |
Temperature | 60–80 °C | — |
Temperature | 80–100 °C | — |
Temperature | 100–120 °C | — |
Temperature | 120–140 °C | — |
Temperature | 140–160 °C | — |
Temperature | 160–180 °C | — |
Duration | 1–20 minutes | — |
Duration | 1–3 minutes | — |
Duration | 3–9 minutes | — |
Duration | 9–12 minutes | — |
Duration | 12–15 minutes | — |
Duration | 15–18 minutes | — |
Thickness | 0.3–10 nm | — |
Thickness | 5–25 nm | — |
Thickness | 7–25 nm | — |
Thickness | 7–20 nm | — |
Thickness | 10–25 nm | — |
Thickness | 15–25 nm | — |
Thickness | 50–100 nm | — |
Thickness | 50–150 nm | — |
Thickness | 100–500 nm | — |
Thickness | 10–10000 nm | — |
Thickness | 100–2000 nm | — |
Thickness | 2000–10000 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 10 nm | — |
Duration | ≤ 1 second | — |
Duration | ≤ 0.75 seconds | — |
Duration | ≤ 0.5 seconds | — |
Duration | ≤ 0.25 seconds | — |
Duration | ≤ 0.1 seconds | — |
Thickness | ≤ 300 nm | — |
Duration | ≤ 1 minute | — |
Temperature | ≥ 180 °C | — |
Duration | ≥ 18 minutes | — |
Duration | ≥ 40 minutes | — |
Thickness | 10–2000 nm | — |
black phosphorous
hafnium dioxide
HfO₂
molybdenum disulfide
MoS₂
molybdenum diselenide
MoSe₂
carbide
carbon nanomembrane (CNM)
carbon nanotubes (CNT)
graphyne
borophene
germanene
silicene
Si₂BN
stanene
phosphorene
bismuthene
molybdenite
palladium
Pd
rhodium
Rh
Pb/Sn alloy
Pb/Bi alloy
aerographite
aerogel
nanogel
carbon nanofoam
hexagonal boron nitride
h-BN
electrospun nanofibers
carbon nanotubes
polymeric substrate materials
hydrogel
nonporous graphene
graphene oxide
FIG. 9 is a SEM image of the bottom surface of a well described herein. Track- etched pores (dark spots) are seen on the bottom surface. [0018]
FIG. 10 is a SEM image of a close-up cross section showing the bottom of a well and the second face of a modified substrate described herein. [0019]
FIG. 11 is a SEM image of a cross section of a modified substrate described herein. [0020]
FIG. 12 is a close up SEM image of the cross section of
| — |
Thickness | 70–100 nm | — |
Thickness | 10–50 nm | — |
Thickness | 1–10 nm | — |
Thickness | 500–1000 nm | — |
Thickness | 6000–8000 nm | — |
Thickness | 8000–10000 nm | — |
Thickness | 1–100 nm | — |
Thickness | 1–20 nm | — |
Thickness | 1–5 nm | — |
Thickness | 100–1000000 nm | — |
Thickness | 150–300 nm | — |
Thickness | 5–100 nm | — |
Thickness | 5–50 nm | — |
Thickness | 5–35 nm | — |
Thickness | 5–20 nm | — |
Thickness | 5–15 nm | — |
Thickness | 5–10 nm | — |
Thickness | 0.34–10 nm | — |
Thickness | 0.34–5 nm | — |
Thickness | 0.34–3 nm | — |
Temperature | 0–20 °C | — |
Temperature | 20–40 °C | — |
Temperature | 40–60 °C | — |
Temperature | 60–80 °C | — |
Temperature | 80–100 °C | — |
Temperature | 100–120 °C | — |
Temperature | 120–140 °C | — |
Temperature | 140–160 °C | — |
Temperature | 160–180 °C | — |
Duration | 1–20 minutes | — |
Duration | 1–3 minutes | — |
Duration | 3–9 minutes | — |
Duration | 9–12 minutes | — |
Duration | 12–15 minutes | — |
Duration | 15–18 minutes | — |
Thickness | 0.3–10 nm | — |
Thickness | 5–25 nm | — |
Thickness | 7–25 nm | — |
Thickness | 7–20 nm | — |
Thickness | 10–25 nm | — |
Thickness | 15–25 nm | — |
Thickness | 50–100 nm | — |
Thickness | 50–150 nm | — |
Thickness | 100–500 nm | — |
Thickness | 10–10000 nm | — |
Thickness | 100–2000 nm | — |
Thickness | 2000–10000 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 10 nm | — |
Duration | ≤ 1 second | — |
Duration | ≤ 0.75 seconds | — |
Duration | ≤ 0.5 seconds | — |
Duration | ≤ 0.25 seconds | — |
Duration | ≤ 0.1 seconds | — |
Thickness | ≤ 300 nm | — |
Duration | ≤ 1 minute | — |
Temperature | ≥ 180 °C | — |
Duration | ≥ 18 minutes | — |
Duration | ≥ 40 minutes | — |
Thickness | 10–2000 nm | — |