Patent
US 10,106,412tetraethyl orthosilicate
Si(OC₂H₅)4
ethanol
C₂H₅OH
ammonia water
NH3·H₂O
high-density hexagonal boron nitride ceramic material
hBN-SiO₂
| — |
Temperature | 700–900 °C | — |
Temperature | 1600–1900 °C | — |
tetraethyl orthosilicate
Si(OC₂H₅)4
ethanol
C₂H₅OH
ammonia water
NH3·H₂O
high-density hexagonal boron nitride ceramic material
hBN-SiO₂
| — |
Temperature | 700–900 °C | — |
Temperature | 1600–1900 °C | — |
tetraethyl orthosilicate
Si(OC₂H₅)4
ethanol
C₂H₅OH
ammonia water
NH3·H₂O
high-density hexagonal boron nitride ceramic material
hBN-SiO₂
| — |
Temperature | 700–900 °C | — |
Temperature | 1600–1900 °C | — |
tetraethyl orthosilicate
Si(OC₂H₅)4
ethanol
C₂H₅OH
ammonia water
NH3·H₂O
high-density hexagonal boron nitride ceramic material
hBN-SiO₂
| — |
Temperature | 700–900 °C | — |
Temperature | 1600–1900 °C | — |