Patent
US 9,930,808GRAPHENE-BASED THERMAL MANAGEMENT SYSTEMS
Angela W. Li
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 9,930,808Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0008]
FIG. 2 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0009]
FIG. 3 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0010]
FIG. 4 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of [[the]] a n electronic component, wherein the thermal management coating consists essentially of: an electrically insulatin q material la v er disposed on the surface of the electronic component; and a graphene coating layer disposed on the electrically insulatin g material layer, the graphene coatin g layer having a thickness of 10 nm to 500 nm, wherein the g raphene coatin q la v er consists; essentially of aligned carbon nanoparticles. Currently amended
The thermally managed electronic component of claim 1, wherein the carbon nanoparticles comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerenes, heterofullerenes, or a combination thereof. Original
The thermally managed electronic component of claim 1, wherein the aligned carbon nanoparticles have a symmetric structure. Currently amended
The thermally managed electronic component of claim 1, wherein the aligned carbon nanoparticles have an anti-symmetric structure. Currently amended
The thermally managed electronic component of claim 1, wherein the thermal management coating forms no more than about 0.2 weight percent of the thermally managed electronic component, based on a total weight of the thermally managed electronic component. Previously presented
The thermally managed electronic component of claim 1, wherein the thermal management coating exhibits a thermal conductance of greater than about 25 MW/m 2 K. Original
The thermally managed electronic component of claim 1, further comprising a catalyst film disposed on the graphene coating layer, wherein the catalyst film comprises particles of nickel, cobalt, iron, or a combination thereof. New
The thermally managed electronic component of claim 1, wherein the electronic component is selected from the group consisting of: a transformer, a resistor, a capacitor, and an inductor. New
Canceled
Canceled
Canceled
(Withdrawn-Currently Amended) A method of applying a thermal management coating [[to]] on a surface of an electronic component, the method o f comprising: disposing an electrically insulatin g material layer on the surface of the electronic component; and disposing a graphene coating layer having a thickness of 10 nm to 500 nm on [[a]] the electrically insulatin g material layer, wherein the graphene coatin g layer consists; essentially of aligned carbon nanoparticles. Currently amended
(Withdrawn-Original) The method of claim 11, wherein the carbon nanoparticles comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerenes, heterofullerenes, or a combination thereof. Original
(Withdrawn-Currently Amended) The method of claim 11, wherein disposing the aligned carbon nanoparticles is carried out using chemical vapor deposition. Currently amended
(Withdrawn-Currently Amended) The method of claim 11, further comprising disposing a catalyst film on the graphene coating layer. Currently amended
Canceled
Canceled
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of [[the]] a n electronic component, wherein the thermal management coating comprises: a graphene coating layer disposed on the surface of [[an]] the electronic component; and at least two layers of aligned carbon nanoparticles, both disposed on a surface of the graphene coating layer opposite to the electronic component, wherein the thermal mana g ement coatin g forms no more than about 0.2 wei g ht percent of the thermally mana g ed electronic component, based on a total wei q ht of the thermally mana q ed electronic component. Currently amended
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of the electronic component, wherein the thermal management coating comprises: a graphene coating layer disposed on the surface of an electronic component; and a layer of aligned carbon nanoparticles, wherein at least 70 percent of the carbon nanoparticles of the layer of aligned carbon nanoparticles [[has]] have a dextral structure or at least 70 percent of the carbon nanoparticles of the layer of aligned carbon nanoparticles [[has]] have a sinistral structure. Currently amended
Layer stacks claimed or described, ordered top of device to substrate.
thermally managed electronic component with insulating layer and graphene coating
thermally managed electronic component with graphene layer and at least two layers of aligned carbon nanoparticles
Materials described outside the worked examples.
thermal management coating
graphene coating layer
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductance of thermal management coating | ≥ 25 | thermal management coating |
Thickness | 1–200 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,930,808Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0008]
FIG. 2 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0009]
FIG. 3 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0010]
FIG. 4 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of [[the]] a n electronic component, wherein the thermal management coating consists essentially of: an electrically insulatin q material la v er disposed on the surface of the electronic component; and a graphene coating layer disposed on the electrically insulatin g material layer, the graphene coatin g layer having a thickness of 10 nm to 500 nm, wherein the g raphene coatin q la v er consists; essentially of aligned carbon nanoparticles. Currently amended
The thermally managed electronic component of claim 1, wherein the carbon nanoparticles comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerenes, heterofullerenes, or a combination thereof. Original
The thermally managed electronic component of claim 1, wherein the aligned carbon nanoparticles have a symmetric structure. Currently amended
The thermally managed electronic component of claim 1, wherein the aligned carbon nanoparticles have an anti-symmetric structure. Currently amended
The thermally managed electronic component of claim 1, wherein the thermal management coating forms no more than about 0.2 weight percent of the thermally managed electronic component, based on a total weight of the thermally managed electronic component. Previously presented
The thermally managed electronic component of claim 1, wherein the thermal management coating exhibits a thermal conductance of greater than about 25 MW/m 2 K. Original
The thermally managed electronic component of claim 1, further comprising a catalyst film disposed on the graphene coating layer, wherein the catalyst film comprises particles of nickel, cobalt, iron, or a combination thereof. New
The thermally managed electronic component of claim 1, wherein the electronic component is selected from the group consisting of: a transformer, a resistor, a capacitor, and an inductor. New
Canceled
Canceled
Canceled
(Withdrawn-Currently Amended) A method of applying a thermal management coating [[to]] on a surface of an electronic component, the method o f comprising: disposing an electrically insulatin g material layer on the surface of the electronic component; and disposing a graphene coating layer having a thickness of 10 nm to 500 nm on [[a]] the electrically insulatin g material layer, wherein the graphene coatin g layer consists; essentially of aligned carbon nanoparticles. Currently amended
(Withdrawn-Original) The method of claim 11, wherein the carbon nanoparticles comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerenes, heterofullerenes, or a combination thereof. Original
(Withdrawn-Currently Amended) The method of claim 11, wherein disposing the aligned carbon nanoparticles is carried out using chemical vapor deposition. Currently amended
(Withdrawn-Currently Amended) The method of claim 11, further comprising disposing a catalyst film on the graphene coating layer. Currently amended
Canceled
Canceled
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of [[the]] a n electronic component, wherein the thermal management coating comprises: a graphene coating layer disposed on the surface of [[an]] the electronic component; and at least two layers of aligned carbon nanoparticles, both disposed on a surface of the graphene coating layer opposite to the electronic component, wherein the thermal mana g ement coatin g forms no more than about 0.2 wei g ht percent of the thermally mana g ed electronic component, based on a total wei q ht of the thermally mana q ed electronic component. Currently amended
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of the electronic component, wherein the thermal management coating comprises: a graphene coating layer disposed on the surface of an electronic component; and a layer of aligned carbon nanoparticles, wherein at least 70 percent of the carbon nanoparticles of the layer of aligned carbon nanoparticles [[has]] have a dextral structure or at least 70 percent of the carbon nanoparticles of the layer of aligned carbon nanoparticles [[has]] have a sinistral structure. Currently amended
Layer stacks claimed or described, ordered top of device to substrate.
thermally managed electronic component with insulating layer and graphene coating
thermally managed electronic component with graphene layer and at least two layers of aligned carbon nanoparticles
Materials described outside the worked examples.
thermal management coating
graphene coating layer
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductance of thermal management coating | ≥ 25 | thermal management coating |
Thickness | 1–200 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,930,808Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0008]
FIG. 2 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0009]
FIG. 3 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0010]
FIG. 4 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of [[the]] a n electronic component, wherein the thermal management coating consists essentially of: an electrically insulatin q material la v er disposed on the surface of the electronic component; and a graphene coating layer disposed on the electrically insulatin g material layer, the graphene coatin g layer having a thickness of 10 nm to 500 nm, wherein the g raphene coatin q la v er consists; essentially of aligned carbon nanoparticles. Currently amended
The thermally managed electronic component of claim 1, wherein the carbon nanoparticles comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerenes, heterofullerenes, or a combination thereof. Original
The thermally managed electronic component of claim 1, wherein the aligned carbon nanoparticles have a symmetric structure. Currently amended
The thermally managed electronic component of claim 1, wherein the aligned carbon nanoparticles have an anti-symmetric structure. Currently amended
The thermally managed electronic component of claim 1, wherein the thermal management coating forms no more than about 0.2 weight percent of the thermally managed electronic component, based on a total weight of the thermally managed electronic component. Previously presented
The thermally managed electronic component of claim 1, wherein the thermal management coating exhibits a thermal conductance of greater than about 25 MW/m 2 K. Original
The thermally managed electronic component of claim 1, further comprising a catalyst film disposed on the graphene coating layer, wherein the catalyst film comprises particles of nickel, cobalt, iron, or a combination thereof. New
The thermally managed electronic component of claim 1, wherein the electronic component is selected from the group consisting of: a transformer, a resistor, a capacitor, and an inductor. New
Canceled
Canceled
Canceled
(Withdrawn-Currently Amended) A method of applying a thermal management coating [[to]] on a surface of an electronic component, the method o f comprising: disposing an electrically insulatin g material layer on the surface of the electronic component; and disposing a graphene coating layer having a thickness of 10 nm to 500 nm on [[a]] the electrically insulatin g material layer, wherein the graphene coatin g layer consists; essentially of aligned carbon nanoparticles. Currently amended
(Withdrawn-Original) The method of claim 11, wherein the carbon nanoparticles comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerenes, heterofullerenes, or a combination thereof. Original
(Withdrawn-Currently Amended) The method of claim 11, wherein disposing the aligned carbon nanoparticles is carried out using chemical vapor deposition. Currently amended
(Withdrawn-Currently Amended) The method of claim 11, further comprising disposing a catalyst film on the graphene coating layer. Currently amended
Canceled
Canceled
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of [[the]] a n electronic component, wherein the thermal management coating comprises: a graphene coating layer disposed on the surface of [[an]] the electronic component; and at least two layers of aligned carbon nanoparticles, both disposed on a surface of the graphene coating layer opposite to the electronic component, wherein the thermal mana g ement coatin g forms no more than about 0.2 wei g ht percent of the thermally mana g ed electronic component, based on a total wei q ht of the thermally mana q ed electronic component. Currently amended
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of the electronic component, wherein the thermal management coating comprises: a graphene coating layer disposed on the surface of an electronic component; and a layer of aligned carbon nanoparticles, wherein at least 70 percent of the carbon nanoparticles of the layer of aligned carbon nanoparticles [[has]] have a dextral structure or at least 70 percent of the carbon nanoparticles of the layer of aligned carbon nanoparticles [[has]] have a sinistral structure. Currently amended
Layer stacks claimed or described, ordered top of device to substrate.
thermally managed electronic component with insulating layer and graphene coating
thermally managed electronic component with graphene layer and at least two layers of aligned carbon nanoparticles
Materials described outside the worked examples.
thermal management coating
graphene coating layer
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductance of thermal management coating | ≥ 25 | thermal management coating |
Thickness | 1–200 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,930,808Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0008]
FIG. 2 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0009]
FIG. 3 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein. [0010]
FIG. 4 illustrates schematically a side view of a thermally managed electronic component according to one implementation described herein.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of [[the]] a n electronic component, wherein the thermal management coating consists essentially of: an electrically insulatin q material la v er disposed on the surface of the electronic component; and a graphene coating layer disposed on the electrically insulatin g material layer, the graphene coatin g layer having a thickness of 10 nm to 500 nm, wherein the g raphene coatin q la v er consists; essentially of aligned carbon nanoparticles. Currently amended
The thermally managed electronic component of claim 1, wherein the carbon nanoparticles comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerenes, heterofullerenes, or a combination thereof. Original
The thermally managed electronic component of claim 1, wherein the aligned carbon nanoparticles have a symmetric structure. Currently amended
The thermally managed electronic component of claim 1, wherein the aligned carbon nanoparticles have an anti-symmetric structure. Currently amended
The thermally managed electronic component of claim 1, wherein the thermal management coating forms no more than about 0.2 weight percent of the thermally managed electronic component, based on a total weight of the thermally managed electronic component. Previously presented
The thermally managed electronic component of claim 1, wherein the thermal management coating exhibits a thermal conductance of greater than about 25 MW/m 2 K. Original
The thermally managed electronic component of claim 1, further comprising a catalyst film disposed on the graphene coating layer, wherein the catalyst film comprises particles of nickel, cobalt, iron, or a combination thereof. New
The thermally managed electronic component of claim 1, wherein the electronic component is selected from the group consisting of: a transformer, a resistor, a capacitor, and an inductor. New
Canceled
Canceled
Canceled
(Withdrawn-Currently Amended) A method of applying a thermal management coating [[to]] on a surface of an electronic component, the method o f comprising: disposing an electrically insulatin g material layer on the surface of the electronic component; and disposing a graphene coating layer having a thickness of 10 nm to 500 nm on [[a]] the electrically insulatin g material layer, wherein the graphene coatin g layer consists; essentially of aligned carbon nanoparticles. Currently amended
(Withdrawn-Original) The method of claim 11, wherein the carbon nanoparticles comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, fullerenes, heterofullerenes, or a combination thereof. Original
(Withdrawn-Currently Amended) The method of claim 11, wherein disposing the aligned carbon nanoparticles is carried out using chemical vapor deposition. Currently amended
(Withdrawn-Currently Amended) The method of claim 11, further comprising disposing a catalyst film on the graphene coating layer. Currently amended
Canceled
Canceled
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of [[the]] a n electronic component, wherein the thermal management coating comprises: a graphene coating layer disposed on the surface of [[an]] the electronic component; and at least two layers of aligned carbon nanoparticles, both disposed on a surface of the graphene coating layer opposite to the electronic component, wherein the thermal mana g ement coatin g forms no more than about 0.2 wei g ht percent of the thermally mana g ed electronic component, based on a total wei q ht of the thermally mana q ed electronic component. Currently amended
A thermally managed electronic component comprising: a thermal management coating disposed on a surface of the electronic component, wherein the thermal management coating comprises: a graphene coating layer disposed on the surface of an electronic component; and a layer of aligned carbon nanoparticles, wherein at least 70 percent of the carbon nanoparticles of the layer of aligned carbon nanoparticles [[has]] have a dextral structure or at least 70 percent of the carbon nanoparticles of the layer of aligned carbon nanoparticles [[has]] have a sinistral structure. Currently amended
Layer stacks claimed or described, ordered top of device to substrate.
thermally managed electronic component with insulating layer and graphene coating
thermally managed electronic component with graphene layer and at least two layers of aligned carbon nanoparticles
Materials described outside the worked examples.
thermal management coating
graphene coating layer
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductance of thermal management coating | ≥ 25 | thermal management coating |
Thickness | 1–200 nm |
Related documents with shared materials, methods, properties, or citations.
thermally managed electronic component with graphene layer and chirality-controlled aligned carbon nanoparticles
aligned carbon nanoparticles
single-walled carbon nanotubes
multi-walled carbon nanotubes
fullerenes
heterofullerenes
catalyst film
electrically insulating material layer
| — |
Thickness | 1–150 nm | — |
Thickness | 5–100 nm | — |
Thickness | 5–75 nm | — |
Thickness | 15–60 nm | — |
Thickness | 20–30 nm | — |
Thickness | 45–55 nm | — |
Thickness | 1–300 nm | — |
Thickness | 1–100 nm | — |
Thickness | 10–300 nm | — |
Thickness | 10–200 nm | — |
Thickness | 10–100 nm | — |
Thickness | 50–300 nm | — |
Thickness | 50–200 nm | — |
Thickness | 50–100 nm | — |
Thickness | 100–300 nm | — |
Thickness | 10–40 nm | — |
Thickness | 15–50 nm | — |
Thickness | 1–30 nm | — |
Thickness | 15–30 nm | — |
Thickness | 15–100 nm | — |
Thickness | 15–50000000 nm | — |
Thickness | 100–50000000 nm | — |
Thickness | 500–50000000 nm | — |
Thickness | 1000000–50000000 nm | — |
Thickness | 15–10000000 nm | — |
Thickness | 500–10000000 nm | — |
Thickness | 1–5 cm | — |
Thickness | 1000000–10000000 nm | — |
Thickness | 5000000–30000000 nm | — |
Temperature | 600–800 °C | — |
Thickness | 1–10 cm | — |
Voltage | 1–100 V | — |
Thickness | 1–100 cm | — |
Thickness | 5–200 nm | — |
Thickness | 1–20 nm | — |
Thickness | 1–10 nm | — |
Voltage | 50–250 V | — |
Thickness | ≤ 500 nm | — |
Thickness | ≤ 300 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 300 nm | — |
Thickness | ≥ 1 cm | — |
Temperature | ≥ 1 °C | — |
Temperature | ≥ 800 °C | — |
Temperature | ≥ 900 °C | — |
Thickness | 10–500 nm | — |
GRAPHENE BASED CORROSION-RESISTANT COATING
thermally managed electronic component with graphene layer and chirality-controlled aligned carbon nanoparticles
aligned carbon nanoparticles
single-walled carbon nanotubes
multi-walled carbon nanotubes
fullerenes
heterofullerenes
catalyst film
electrically insulating material layer
| — |
Thickness | 1–150 nm | — |
Thickness | 5–100 nm | — |
Thickness | 5–75 nm | — |
Thickness | 15–60 nm | — |
Thickness | 20–30 nm | — |
Thickness | 45–55 nm | — |
Thickness | 1–300 nm | — |
Thickness | 1–100 nm | — |
Thickness | 10–300 nm | — |
Thickness | 10–200 nm | — |
Thickness | 10–100 nm | — |
Thickness | 50–300 nm | — |
Thickness | 50–200 nm | — |
Thickness | 50–100 nm | — |
Thickness | 100–300 nm | — |
Thickness | 10–40 nm | — |
Thickness | 15–50 nm | — |
Thickness | 1–30 nm | — |
Thickness | 15–30 nm | — |
Thickness | 15–100 nm | — |
Thickness | 15–50000000 nm | — |
Thickness | 100–50000000 nm | — |
Thickness | 500–50000000 nm | — |
Thickness | 1000000–50000000 nm | — |
Thickness | 15–10000000 nm | — |
Thickness | 500–10000000 nm | — |
Thickness | 1–5 cm | — |
Thickness | 1000000–10000000 nm | — |
Thickness | 5000000–30000000 nm | — |
Temperature | 600–800 °C | — |
Thickness | 1–10 cm | — |
Voltage | 1–100 V | — |
Thickness | 1–100 cm | — |
Thickness | 5–200 nm | — |
Thickness | 1–20 nm | — |
Thickness | 1–10 nm | — |
Voltage | 50–250 V | — |
Thickness | ≤ 500 nm | — |
Thickness | ≤ 300 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 300 nm | — |
Thickness | ≥ 1 cm | — |
Temperature | ≥ 1 °C | — |
Temperature | ≥ 800 °C | — |
Temperature | ≥ 900 °C | — |
Thickness | 10–500 nm | — |
GRAPHENE BASED CORROSION-RESISTANT COATING
thermally managed electronic component with graphene layer and chirality-controlled aligned carbon nanoparticles
aligned carbon nanoparticles
single-walled carbon nanotubes
multi-walled carbon nanotubes
fullerenes
heterofullerenes
catalyst film
electrically insulating material layer
| — |
Thickness | 1–150 nm | — |
Thickness | 5–100 nm | — |
Thickness | 5–75 nm | — |
Thickness | 15–60 nm | — |
Thickness | 20–30 nm | — |
Thickness | 45–55 nm | — |
Thickness | 1–300 nm | — |
Thickness | 1–100 nm | — |
Thickness | 10–300 nm | — |
Thickness | 10–200 nm | — |
Thickness | 10–100 nm | — |
Thickness | 50–300 nm | — |
Thickness | 50–200 nm | — |
Thickness | 50–100 nm | — |
Thickness | 100–300 nm | — |
Thickness | 10–40 nm | — |
Thickness | 15–50 nm | — |
Thickness | 1–30 nm | — |
Thickness | 15–30 nm | — |
Thickness | 15–100 nm | — |
Thickness | 15–50000000 nm | — |
Thickness | 100–50000000 nm | — |
Thickness | 500–50000000 nm | — |
Thickness | 1000000–50000000 nm | — |
Thickness | 15–10000000 nm | — |
Thickness | 500–10000000 nm | — |
Thickness | 1–5 cm | — |
Thickness | 1000000–10000000 nm | — |
Thickness | 5000000–30000000 nm | — |
Temperature | 600–800 °C | — |
Thickness | 1–10 cm | — |
Voltage | 1–100 V | — |
Thickness | 1–100 cm | — |
Thickness | 5–200 nm | — |
Thickness | 1–20 nm | — |
Thickness | 1–10 nm | — |
Voltage | 50–250 V | — |
Thickness | ≤ 500 nm | — |
Thickness | ≤ 300 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 300 nm | — |
Thickness | ≥ 1 cm | — |
Temperature | ≥ 1 °C | — |
Temperature | ≥ 800 °C | — |
Temperature | ≥ 900 °C | — |
Thickness | 10–500 nm | — |
GRAPHENE BASED CORROSION-RESISTANT COATING
thermally managed electronic component with graphene layer and chirality-controlled aligned carbon nanoparticles
aligned carbon nanoparticles
single-walled carbon nanotubes
multi-walled carbon nanotubes
fullerenes
heterofullerenes
catalyst film
electrically insulating material layer
| — |
Thickness | 1–150 nm | — |
Thickness | 5–100 nm | — |
Thickness | 5–75 nm | — |
Thickness | 15–60 nm | — |
Thickness | 20–30 nm | — |
Thickness | 45–55 nm | — |
Thickness | 1–300 nm | — |
Thickness | 1–100 nm | — |
Thickness | 10–300 nm | — |
Thickness | 10–200 nm | — |
Thickness | 10–100 nm | — |
Thickness | 50–300 nm | — |
Thickness | 50–200 nm | — |
Thickness | 50–100 nm | — |
Thickness | 100–300 nm | — |
Thickness | 10–40 nm | — |
Thickness | 15–50 nm | — |
Thickness | 1–30 nm | — |
Thickness | 15–30 nm | — |
Thickness | 15–100 nm | — |
Thickness | 15–50000000 nm | — |
Thickness | 100–50000000 nm | — |
Thickness | 500–50000000 nm | — |
Thickness | 1000000–50000000 nm | — |
Thickness | 15–10000000 nm | — |
Thickness | 500–10000000 nm | — |
Thickness | 1–5 cm | — |
Thickness | 1000000–10000000 nm | — |
Thickness | 5000000–30000000 nm | — |
Temperature | 600–800 °C | — |
Thickness | 1–10 cm | — |
Voltage | 1–100 V | — |
Thickness | 1–100 cm | — |
Thickness | 5–200 nm | — |
Thickness | 1–20 nm | — |
Thickness | 1–10 nm | — |
Voltage | 50–250 V | — |
Thickness | ≤ 500 nm | — |
Thickness | ≤ 300 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 300 nm | — |
Thickness | ≥ 1 cm | — |
Temperature | ≥ 1 °C | — |
Temperature | ≥ 800 °C | — |
Temperature | ≥ 900 °C | — |
Thickness | 10–500 nm | — |
GRAPHENE BASED CORROSION-RESISTANT COATING