Patent
US 9,169,575Electrowetting Methods for Releasing Graphene from a Metal substrate
Peter V. BEDWORTH
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 9,169,575Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method comprising: SVG 14195802.08-04-2015.ICY₅WV₈₂PXXIFW3.CLM.1.svg 0.73 4.6 Black and white establishing an electrical potential between the metal substrate and an electrode disposed at a distance of about 10 mm or less from at least a portion of the dielectric layer; wherein the electrical potential induces infiltration of the liquid medium between at least a portion of the metal substrate and the graphene; and wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; and releasing the graphene from the metal substrate in the presence of the infiltrated liquid medium, the electrical potential being maintained until the graphene is released.
The method of claim 1, wherein the dielectric layer comprises a polymer.
The method of claim 1, wherein the metal substrate comprises a copper substrate.
The method of claim 1, wherein the electrical potential is below a breakdown voltage of at least the dielectric layer.
The method of claim 1, wherein the liquid medium comprises an aqueous solution.
The method of claim 1, wherein the liquid medium comprises an aprotic organic solvent.
The method of claim 1, wherein the electrode is in contact with the dielectric layer while establishing the electrical potential.
The method of claim 1, wherein the electrode is disposed at a distance o f about 10 mm or less from only a portion of the dielectric layer at a particular time, the graphene being released from the metal substrate only at a first location.
The method of claim 1, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the dielectric layer.
The method of claim 1, wherein the graphene is adhered to the dielectric layer after being released from the metal substrate.
canceled
A method comprising: providing a coated structure comprising a metal substrate having graphene adhered thereto and a polymer layer coated on the graphene; forming an electrical connection to the metal substrate and an electrode disposed at a distance of about 10 mm or less from at least a portion of the polymer layer; placing the coated structure in a liquid medium; establishing an electrical potential between the metal substrate and the electrode; wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; infiltrating the liquid medium between at least a portion of the metal substrate and the graphene in the presence of the electrical potential; and releasing the graphene from the metal substrate in the presence of the infiltrated liquid medium, the electrical potential being maintained until the graphene is released.
The method of claim 13, wherein the electrical potential is below a breakdown voltage of at least the polymer layer.
The method of claim 13, wherein the liquid medium comprises an aqueous solution.
The method of claim 13, wherein the liquid medium comprises an aprotic organic solvent.
The method of claim 13, wherein the electrode is in contact with the polymer layer while establishing the electrical potential.
The method of claim 13, wherein the electrode is disposed at a distance of about 10 mm or less from only a portion of the polymer layer at a particular time, the graphene being released from the metal substrate only at a first location.
The method of claim 13, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the polymer layer.
The method of claim 13, wherein the graphene is adhered to the polymer layer after being released from the metal substrate.
DM US 62937196-1.090424. 0129 3 Application No.: 14/195,802 Docket No.: SS-00787 (090424-0129) canceled
A method comprising: providing a coated structure comprising a metal substrate having graphene adhered thereto and a dielectric layer coated on the graphene; placing the coated structure in a liquid medium; DM US 62937196-1.090424. 0129 4 Application No.: 14/195,802 Docket No.: SS-00787 (090424-0129) disposing an electrode at a distance of about 10 mm or less from the dielectric layer and establishing an electrical potential between the metal substrate and the electrode; wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; moving the electrode laterally with respect to the dielectric layer and the graphene; and infiltrating the liquid medium between the metal substrate and the graphene as the electrode is moved laterally; wherein infiltration of the liquid medium releases the graphene from the metal substrate as the electrode is moved.
The method of claim 23, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the dielectric layer. DM US 62937196-1.090424. 0129
Materials described outside the worked examples.
graphene
metal substrate
copper substrate
Cu
Additional fabrication and treatment steps described in the patent.
Patent
Atlas literature
Patent
US 9,169,575Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method comprising: SVG 14195802.08-04-2015.ICY₅WV₈₂PXXIFW3.CLM.1.svg 0.73 4.6 Black and white establishing an electrical potential between the metal substrate and an electrode disposed at a distance of about 10 mm or less from at least a portion of the dielectric layer; wherein the electrical potential induces infiltration of the liquid medium between at least a portion of the metal substrate and the graphene; and wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; and releasing the graphene from the metal substrate in the presence of the infiltrated liquid medium, the electrical potential being maintained until the graphene is released.
The method of claim 1, wherein the dielectric layer comprises a polymer.
The method of claim 1, wherein the metal substrate comprises a copper substrate.
The method of claim 1, wherein the electrical potential is below a breakdown voltage of at least the dielectric layer.
The method of claim 1, wherein the liquid medium comprises an aqueous solution.
The method of claim 1, wherein the liquid medium comprises an aprotic organic solvent.
The method of claim 1, wherein the electrode is in contact with the dielectric layer while establishing the electrical potential.
The method of claim 1, wherein the electrode is disposed at a distance o f about 10 mm or less from only a portion of the dielectric layer at a particular time, the graphene being released from the metal substrate only at a first location.
The method of claim 1, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the dielectric layer.
The method of claim 1, wherein the graphene is adhered to the dielectric layer after being released from the metal substrate.
canceled
A method comprising: providing a coated structure comprising a metal substrate having graphene adhered thereto and a polymer layer coated on the graphene; forming an electrical connection to the metal substrate and an electrode disposed at a distance of about 10 mm or less from at least a portion of the polymer layer; placing the coated structure in a liquid medium; establishing an electrical potential between the metal substrate and the electrode; wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; infiltrating the liquid medium between at least a portion of the metal substrate and the graphene in the presence of the electrical potential; and releasing the graphene from the metal substrate in the presence of the infiltrated liquid medium, the electrical potential being maintained until the graphene is released.
The method of claim 13, wherein the electrical potential is below a breakdown voltage of at least the polymer layer.
The method of claim 13, wherein the liquid medium comprises an aqueous solution.
The method of claim 13, wherein the liquid medium comprises an aprotic organic solvent.
The method of claim 13, wherein the electrode is in contact with the polymer layer while establishing the electrical potential.
The method of claim 13, wherein the electrode is disposed at a distance of about 10 mm or less from only a portion of the polymer layer at a particular time, the graphene being released from the metal substrate only at a first location.
The method of claim 13, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the polymer layer.
The method of claim 13, wherein the graphene is adhered to the polymer layer after being released from the metal substrate.
DM US 62937196-1.090424. 0129 3 Application No.: 14/195,802 Docket No.: SS-00787 (090424-0129) canceled
A method comprising: providing a coated structure comprising a metal substrate having graphene adhered thereto and a dielectric layer coated on the graphene; placing the coated structure in a liquid medium; DM US 62937196-1.090424. 0129 4 Application No.: 14/195,802 Docket No.: SS-00787 (090424-0129) disposing an electrode at a distance of about 10 mm or less from the dielectric layer and establishing an electrical potential between the metal substrate and the electrode; wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; moving the electrode laterally with respect to the dielectric layer and the graphene; and infiltrating the liquid medium between the metal substrate and the graphene as the electrode is moved laterally; wherein infiltration of the liquid medium releases the graphene from the metal substrate as the electrode is moved.
The method of claim 23, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the dielectric layer. DM US 62937196-1.090424. 0129
Materials described outside the worked examples.
graphene
metal substrate
copper substrate
Cu
Additional fabrication and treatment steps described in the patent.
Patent
Atlas literature
Patent
US 9,169,575Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method comprising: SVG 14195802.08-04-2015.ICY₅WV₈₂PXXIFW3.CLM.1.svg 0.73 4.6 Black and white establishing an electrical potential between the metal substrate and an electrode disposed at a distance of about 10 mm or less from at least a portion of the dielectric layer; wherein the electrical potential induces infiltration of the liquid medium between at least a portion of the metal substrate and the graphene; and wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; and releasing the graphene from the metal substrate in the presence of the infiltrated liquid medium, the electrical potential being maintained until the graphene is released.
The method of claim 1, wherein the dielectric layer comprises a polymer.
The method of claim 1, wherein the metal substrate comprises a copper substrate.
The method of claim 1, wherein the electrical potential is below a breakdown voltage of at least the dielectric layer.
The method of claim 1, wherein the liquid medium comprises an aqueous solution.
The method of claim 1, wherein the liquid medium comprises an aprotic organic solvent.
The method of claim 1, wherein the electrode is in contact with the dielectric layer while establishing the electrical potential.
The method of claim 1, wherein the electrode is disposed at a distance o f about 10 mm or less from only a portion of the dielectric layer at a particular time, the graphene being released from the metal substrate only at a first location.
The method of claim 1, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the dielectric layer.
The method of claim 1, wherein the graphene is adhered to the dielectric layer after being released from the metal substrate.
canceled
A method comprising: providing a coated structure comprising a metal substrate having graphene adhered thereto and a polymer layer coated on the graphene; forming an electrical connection to the metal substrate and an electrode disposed at a distance of about 10 mm or less from at least a portion of the polymer layer; placing the coated structure in a liquid medium; establishing an electrical potential between the metal substrate and the electrode; wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; infiltrating the liquid medium between at least a portion of the metal substrate and the graphene in the presence of the electrical potential; and releasing the graphene from the metal substrate in the presence of the infiltrated liquid medium, the electrical potential being maintained until the graphene is released.
The method of claim 13, wherein the electrical potential is below a breakdown voltage of at least the polymer layer.
The method of claim 13, wherein the liquid medium comprises an aqueous solution.
The method of claim 13, wherein the liquid medium comprises an aprotic organic solvent.
The method of claim 13, wherein the electrode is in contact with the polymer layer while establishing the electrical potential.
The method of claim 13, wherein the electrode is disposed at a distance of about 10 mm or less from only a portion of the polymer layer at a particular time, the graphene being released from the metal substrate only at a first location.
The method of claim 13, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the polymer layer.
The method of claim 13, wherein the graphene is adhered to the polymer layer after being released from the metal substrate.
DM US 62937196-1.090424. 0129 3 Application No.: 14/195,802 Docket No.: SS-00787 (090424-0129) canceled
A method comprising: providing a coated structure comprising a metal substrate having graphene adhered thereto and a dielectric layer coated on the graphene; placing the coated structure in a liquid medium; DM US 62937196-1.090424. 0129 4 Application No.: 14/195,802 Docket No.: SS-00787 (090424-0129) disposing an electrode at a distance of about 10 mm or less from the dielectric layer and establishing an electrical potential between the metal substrate and the electrode; wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; moving the electrode laterally with respect to the dielectric layer and the graphene; and infiltrating the liquid medium between the metal substrate and the graphene as the electrode is moved laterally; wherein infiltration of the liquid medium releases the graphene from the metal substrate as the electrode is moved.
The method of claim 23, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the dielectric layer. DM US 62937196-1.090424. 0129
Materials described outside the worked examples.
graphene
metal substrate
copper substrate
Cu
Additional fabrication and treatment steps described in the patent.
Patent
Atlas literature
Patent
US 9,169,575Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method comprising: SVG 14195802.08-04-2015.ICY₅WV₈₂PXXIFW3.CLM.1.svg 0.73 4.6 Black and white establishing an electrical potential between the metal substrate and an electrode disposed at a distance of about 10 mm or less from at least a portion of the dielectric layer; wherein the electrical potential induces infiltration of the liquid medium between at least a portion of the metal substrate and the graphene; and wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; and releasing the graphene from the metal substrate in the presence of the infiltrated liquid medium, the electrical potential being maintained until the graphene is released.
The method of claim 1, wherein the dielectric layer comprises a polymer.
The method of claim 1, wherein the metal substrate comprises a copper substrate.
The method of claim 1, wherein the electrical potential is below a breakdown voltage of at least the dielectric layer.
The method of claim 1, wherein the liquid medium comprises an aqueous solution.
The method of claim 1, wherein the liquid medium comprises an aprotic organic solvent.
The method of claim 1, wherein the electrode is in contact with the dielectric layer while establishing the electrical potential.
The method of claim 1, wherein the electrode is disposed at a distance o f about 10 mm or less from only a portion of the dielectric layer at a particular time, the graphene being released from the metal substrate only at a first location.
The method of claim 1, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the dielectric layer.
The method of claim 1, wherein the graphene is adhered to the dielectric layer after being released from the metal substrate.
canceled
A method comprising: providing a coated structure comprising a metal substrate having graphene adhered thereto and a polymer layer coated on the graphene; forming an electrical connection to the metal substrate and an electrode disposed at a distance of about 10 mm or less from at least a portion of the polymer layer; placing the coated structure in a liquid medium; establishing an electrical potential between the metal substrate and the electrode; wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; infiltrating the liquid medium between at least a portion of the metal substrate and the graphene in the presence of the electrical potential; and releasing the graphene from the metal substrate in the presence of the infiltrated liquid medium, the electrical potential being maintained until the graphene is released.
The method of claim 13, wherein the electrical potential is below a breakdown voltage of at least the polymer layer.
The method of claim 13, wherein the liquid medium comprises an aqueous solution.
The method of claim 13, wherein the liquid medium comprises an aprotic organic solvent.
The method of claim 13, wherein the electrode is in contact with the polymer layer while establishing the electrical potential.
The method of claim 13, wherein the electrode is disposed at a distance of about 10 mm or less from only a portion of the polymer layer at a particular time, the graphene being released from the metal substrate only at a first location.
The method of claim 13, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the polymer layer.
The method of claim 13, wherein the graphene is adhered to the polymer layer after being released from the metal substrate.
DM US 62937196-1.090424. 0129 3 Application No.: 14/195,802 Docket No.: SS-00787 (090424-0129) canceled
A method comprising: providing a coated structure comprising a metal substrate having graphene adhered thereto and a dielectric layer coated on the graphene; placing the coated structure in a liquid medium; DM US 62937196-1.090424. 0129 4 Application No.: 14/195,802 Docket No.: SS-00787 (090424-0129) disposing an electrode at a distance of about 10 mm or less from the dielectric layer and establishing an electrical potential between the metal substrate and the electrode; wherein establishing the electrical potential does not form hydrogen gas from the liquid medium; moving the electrode laterally with respect to the dielectric layer and the graphene; and infiltrating the liquid medium between the metal substrate and the graphene as the electrode is moved laterally; wherein infiltration of the liquid medium releases the graphene from the metal substrate as the electrode is moved.
The method of claim 23, wherein the electrode tapers to an edge or point at a location of closest approach adjacent to the dielectric layer. DM US 62937196-1.090424. 0129
Materials described outside the worked examples.
graphene
metal substrate
copper substrate
Cu
Additional fabrication and treatment steps described in the patent.
dielectric layer
aqueous solution
aprotic organic solvent
polymer layer
dielectric layer
aqueous solution
aprotic organic solvent
polymer layer
dielectric layer
aqueous solution
aprotic organic solvent
polymer layer
dielectric layer
aqueous solution
aprotic organic solvent
polymer layer