A polymer composition comprising: a polymer matrix; a graphene that is covalently bonded to the polymer matrix; and metal particles having an additive covalently bonded thereto; wherein the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof; and wherein a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

11.

The polymer composition of claim -1-, wherein the additive further comprises a functional group that is reactive with the polymer matrix, the graphene, or both.

A polymer composition comprising: a polymer matrix comprising a thermoplastic material; a graphene that is covalently bonded to the thermoplastic material; wherein 1) the graphene has a carbon:oxygen ratio of at least about 20:1; and metal particles having an additive covalently bonded thereto; 2) the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof and 3) wh ere i n a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

20.

The polymer composition of claim 170, wherein the additive is selected from the group consisting of 1,3,4-thiadiazole, 1-(4-hydroxyphenyl)- 1H- tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1-pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5-triazine, 2,4-dithiohydantoin, 2,5- dimethylbenzothiazole, 2-amino-1,3,4-thiadiazole, 2-mercapto-5-methylbenzimidazole,

A method for making an electrically conductive polymer composition, the method comprising: reacting a graphene having a carbon:oxygen ratio of at least about 20:1 with a thermoplastic material to form covalent bonds therebetween; and after reacting, adding metal particles to the thermoplastic material; 1) wherein the metal particles have an additive covalently bonded thereto; 2) whe r-ein the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof and 3) -wheein a combined concentration of the metal particles and the graphene in the thermoplastic material exceeds an electrical percolation threshold.

31.

The method of claim ₂ 7-3 4-, wherein the additive further comprises a functional group that is reactive with the thermoplastic material, the graphene, or both.

A method for forming a connection, the method comprising: heating a solder material to at least its softening temperature; wherein the solder material comprises an electrically conductive polymer composition that comprises a thermoplastic material, a graphene that is covalently bonded to the thermoplastic material, and metal particles; placing at least one member in the softened solder material; and cooling the softened solder material so as to affect hardening and to affix the at least one member thereto.

A method for reworking a connection, the method comprising: heating a connection comprising at least one member and a solder material to at least a softening temperature of the solder material; wherein the solder material comprises an electrically conductive polymer composition that comprises a thermoplastic material, a graphene that is covalently bonded to the thermoplastic material, and metal particles; and removing the at least one member from the connection.

A polymer composition comprising: a polymer matrix; a graphene that is covalently bonded to the polymer matrix; and metal particles having an additive covalently bonded thereto; wherein the additive is selected from the group consisting of 1,3,4- thiadiazole, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1- pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5- triazine, 2,4-dithiohydantoin, 2,5-dimethylbenzothiazole, 2-amino-1,3,4-thiadiazol e, 2- mercapto-5-methylbenzimidazole, 2-mercapto-5-nitrobenzimidazole, 2- mercaptobenzimidizole, 2-mercaptobenzoxazole, 2-mercaptoethane sulfonic acid, 2- mercaptoimidazole, 2-mercaptothiazoline, 2-thiouracil, 3-amino-5-mercapto-1,2,4- triazole, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)-thione, 5-amino- 1,3,4-thiadiazole, 6- amino-2-mercaptobenzothiazole, 6-ethoxy-2-mercaptobenzothiazole, 6-mercaptopurine, N-cycloalkyl-dithiocarbamates, alkyl- and cycloalkyl mercaptans, benzothiazoles, dimercaptopyridines, dimethyldithiocarbamic acid, dithiocyanuric acid, mercaptobenzothiazoles, mercaptobenzoxazoles, mercaptoethanesulfonic acid, mercaptoimidazoles, mercaptopyridines, mercaptopyrimidines, mercaptoquinolines, mercaptothiazoles, mercaptothiazolines, mercaptotriazoles, 0,0-dialkyl- and 0,0- 9 Application No.: 13/103,016 dicycloalkyldithiophosphates, O -alkyl- or O -cycloalkyldithiocarbonates, o-ethylxanthic acid, quinoxaline-2,3-thiol, thioacetic acid, thiocresol, thiosalicylic acid, trithiocyanuric acid, 6-ethoxy-2-mercaptobenzothiazole, 2-mercaptobenzothiazole, diethyldithiocarbamic acid, 5-amino-1,3,4,-thiadiazole-2-thiol, 1,2,3-benzothiazole, 1- pyrollidinecarbodithioic acid, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 2-mercapto-5-nitrobenzimidazole, 2-mercapto-5-methylbenzimidazole, mercaptobenzothiazoles, mercaptothiazolines, mercaptobenzimidazoles, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)- thione, trithiocyanuric acid, 2,4-dithiohydantoin, 2,4-dimercapto-6-amino-5-triazine, silanes, silanols, derivatives thereof, and mixtures thereof; wherein a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

A method for making an electrically conductive polymer composition, the method comprising: reacting a graphene having a carbon:oxygen ratio of at least about 20:1 with a thermoplastic material to form covalent bonds therebetween; and after reacting, adding metal particles to the thermoplastic material; wherein the metal particles have an additive covalently bonded thereto; wherein the additive is selected from the group consisting of 1,3,4- thiadiazole, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1- pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5- triazine, 2,4-dithiohydantoin, 2,5-dimethylbenzothiazole, 2-amino-1,3,4-thiadiazole, 2- mercapto-5-methylbenzimidazole, 2-mercapto-5-nitrobenzimidazole, 2- mercaptobenzimidizole, 2-mercaptobenzoxazole, 2-mercaptoethane sulfonic acid, 2- mercaptoimidazole, 2-mercaptothiazoline, 2-thiouracil, 3-amino-5-mercapto-1,2,4- triazole, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)-thione, 5-amino- 1,3,4-thiadiazole, 6- amino-2-mercaptobenzothiazole, 6-ethoxy-2-mercaptobenzothiazole, 6-mercaptopurine, N-cycloalkyl-dithiocarbamates, alkyl- and cycloalkyl mercaptans, benzothiazoles, dimercaptopyridines, dimethyldithiocarbamic acid, dithiocyanuric acid, mercaptobenzothiazoles, mercaptobenzoxazoles, mercaptoethanesulfonic acid, mercaptoimidazoles, mercaptopyridines, mercaptopyrimidines, mercaptoquinolines, mercaptothiazoles, mercaptothiazolines, mercaptotriazoles, 0,0-dialkyl- and 0,0- 10 Application No.: 13/103,016 dicycloalkyldithiophosphates, 0 -alkyl- or O -cycloalky l dithiocarbonates, o-ethylxanthic acid, quinoxaline-2,3-thiol, thioacetic acid, thiocresol, thiosalicylic acid, trithiocyanuric acid, 6-ethoxy-2-mercaptobenzothiazole, 2-mercaptobenzothiazole, diethyldithiocarbamic acid, 5-amino-1,3,4,-thiadiazole-2-thiol, 1,2,3-benzothiazole, 1- pyrollidinecarbodithioic acid, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 2-mercapto-5- nitrobenzimidazole, 2-mercapto-5-methylbenzimidazole, mercaptobenzothiazoles, mercaptothiazolines, mercaptobenzimidazoles, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)- thione, trithiocyanuric acid, 2,4-dithiohydantoin, 2,4-dimercapto-6-amino-5-triazine, silanes, silanols, derivatives thereof, and mixtures thereof, and wherein a combined concentration of the metal particles and the graphene in the thermoplastic material exceeds an electrical percolation threshold.

A polymer composition comprising: a polymer matrix; a graphene that is covalently bonded to the polymer matrix; and metal particles having an additive covalently bonded thereto; wherein the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof; and wherein a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

11.

The polymer composition of claim -1-, wherein the additive further comprises a functional group that is reactive with the polymer matrix, the graphene, or both.

A polymer composition comprising: a polymer matrix comprising a thermoplastic material; a graphene that is covalently bonded to the thermoplastic material; wherein 1) the graphene has a carbon:oxygen ratio of at least about 20:1; and metal particles having an additive covalently bonded thereto; 2) the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof and 3) wh ere i n a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

20.

The polymer composition of claim 170, wherein the additive is selected from the group consisting of 1,3,4-thiadiazole, 1-(4-hydroxyphenyl)- 1H- tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1-pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5-triazine, 2,4-dithiohydantoin, 2,5- dimethylbenzothiazole, 2-amino-1,3,4-thiadiazole, 2-mercapto-5-methylbenzimidazole,

A method for making an electrically conductive polymer composition, the method comprising: reacting a graphene having a carbon:oxygen ratio of at least about 20:1 with a thermoplastic material to form covalent bonds therebetween; and after reacting, adding metal particles to the thermoplastic material; 1) wherein the metal particles have an additive covalently bonded thereto; 2) whe r-ein the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof and 3) -wheein a combined concentration of the metal particles and the graphene in the thermoplastic material exceeds an electrical percolation threshold.

31.

The method of claim ₂ 7-3 4-, wherein the additive further comprises a functional group that is reactive with the thermoplastic material, the graphene, or both.

A method for forming a connection, the method comprising: heating a solder material to at least its softening temperature; wherein the solder material comprises an electrically conductive polymer composition that comprises a thermoplastic material, a graphene that is covalently bonded to the thermoplastic material, and metal particles; placing at least one member in the softened solder material; and cooling the softened solder material so as to affect hardening and to affix the at least one member thereto.

A method for reworking a connection, the method comprising: heating a connection comprising at least one member and a solder material to at least a softening temperature of the solder material; wherein the solder material comprises an electrically conductive polymer composition that comprises a thermoplastic material, a graphene that is covalently bonded to the thermoplastic material, and metal particles; and removing the at least one member from the connection.

A polymer composition comprising: a polymer matrix; a graphene that is covalently bonded to the polymer matrix; and metal particles having an additive covalently bonded thereto; wherein the additive is selected from the group consisting of 1,3,4- thiadiazole, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1- pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5- triazine, 2,4-dithiohydantoin, 2,5-dimethylbenzothiazole, 2-amino-1,3,4-thiadiazol e, 2- mercapto-5-methylbenzimidazole, 2-mercapto-5-nitrobenzimidazole, 2- mercaptobenzimidizole, 2-mercaptobenzoxazole, 2-mercaptoethane sulfonic acid, 2- mercaptoimidazole, 2-mercaptothiazoline, 2-thiouracil, 3-amino-5-mercapto-1,2,4- triazole, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)-thione, 5-amino- 1,3,4-thiadiazole, 6- amino-2-mercaptobenzothiazole, 6-ethoxy-2-mercaptobenzothiazole, 6-mercaptopurine, N-cycloalkyl-dithiocarbamates, alkyl- and cycloalkyl mercaptans, benzothiazoles, dimercaptopyridines, dimethyldithiocarbamic acid, dithiocyanuric acid, mercaptobenzothiazoles, mercaptobenzoxazoles, mercaptoethanesulfonic acid, mercaptoimidazoles, mercaptopyridines, mercaptopyrimidines, mercaptoquinolines, mercaptothiazoles, mercaptothiazolines, mercaptotriazoles, 0,0-dialkyl- and 0,0- 9 Application No.: 13/103,016 dicycloalkyldithiophosphates, O -alkyl- or O -cycloalkyldithiocarbonates, o-ethylxanthic acid, quinoxaline-2,3-thiol, thioacetic acid, thiocresol, thiosalicylic acid, trithiocyanuric acid, 6-ethoxy-2-mercaptobenzothiazole, 2-mercaptobenzothiazole, diethyldithiocarbamic acid, 5-amino-1,3,4,-thiadiazole-2-thiol, 1,2,3-benzothiazole, 1- pyrollidinecarbodithioic acid, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 2-mercapto-5-nitrobenzimidazole, 2-mercapto-5-methylbenzimidazole, mercaptobenzothiazoles, mercaptothiazolines, mercaptobenzimidazoles, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)- thione, trithiocyanuric acid, 2,4-dithiohydantoin, 2,4-dimercapto-6-amino-5-triazine, silanes, silanols, derivatives thereof, and mixtures thereof; wherein a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

A method for making an electrically conductive polymer composition, the method comprising: reacting a graphene having a carbon:oxygen ratio of at least about 20:1 with a thermoplastic material to form covalent bonds therebetween; and after reacting, adding metal particles to the thermoplastic material; wherein the metal particles have an additive covalently bonded thereto; wherein the additive is selected from the group consisting of 1,3,4- thiadiazole, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1- pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5- triazine, 2,4-dithiohydantoin, 2,5-dimethylbenzothiazole, 2-amino-1,3,4-thiadiazole, 2- mercapto-5-methylbenzimidazole, 2-mercapto-5-nitrobenzimidazole, 2- mercaptobenzimidizole, 2-mercaptobenzoxazole, 2-mercaptoethane sulfonic acid, 2- mercaptoimidazole, 2-mercaptothiazoline, 2-thiouracil, 3-amino-5-mercapto-1,2,4- triazole, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)-thione, 5-amino- 1,3,4-thiadiazole, 6- amino-2-mercaptobenzothiazole, 6-ethoxy-2-mercaptobenzothiazole, 6-mercaptopurine, N-cycloalkyl-dithiocarbamates, alkyl- and cycloalkyl mercaptans, benzothiazoles, dimercaptopyridines, dimethyldithiocarbamic acid, dithiocyanuric acid, mercaptobenzothiazoles, mercaptobenzoxazoles, mercaptoethanesulfonic acid, mercaptoimidazoles, mercaptopyridines, mercaptopyrimidines, mercaptoquinolines, mercaptothiazoles, mercaptothiazolines, mercaptotriazoles, 0,0-dialkyl- and 0,0- 10 Application No.: 13/103,016 dicycloalkyldithiophosphates, 0 -alkyl- or O -cycloalky l dithiocarbonates, o-ethylxanthic acid, quinoxaline-2,3-thiol, thioacetic acid, thiocresol, thiosalicylic acid, trithiocyanuric acid, 6-ethoxy-2-mercaptobenzothiazole, 2-mercaptobenzothiazole, diethyldithiocarbamic acid, 5-amino-1,3,4,-thiadiazole-2-thiol, 1,2,3-benzothiazole, 1- pyrollidinecarbodithioic acid, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 2-mercapto-5- nitrobenzimidazole, 2-mercapto-5-methylbenzimidazole, mercaptobenzothiazoles, mercaptothiazolines, mercaptobenzimidazoles, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)- thione, trithiocyanuric acid, 2,4-dithiohydantoin, 2,4-dimercapto-6-amino-5-triazine, silanes, silanols, derivatives thereof, and mixtures thereof, and wherein a combined concentration of the metal particles and the graphene in the thermoplastic material exceeds an electrical percolation threshold.

A polymer composition comprising: a polymer matrix; a graphene that is covalently bonded to the polymer matrix; and metal particles having an additive covalently bonded thereto; wherein the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof; and wherein a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

11.

The polymer composition of claim -1-, wherein the additive further comprises a functional group that is reactive with the polymer matrix, the graphene, or both.

A polymer composition comprising: a polymer matrix comprising a thermoplastic material; a graphene that is covalently bonded to the thermoplastic material; wherein 1) the graphene has a carbon:oxygen ratio of at least about 20:1; and metal particles having an additive covalently bonded thereto; 2) the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof and 3) wh ere i n a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

20.

The polymer composition of claim 170, wherein the additive is selected from the group consisting of 1,3,4-thiadiazole, 1-(4-hydroxyphenyl)- 1H- tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1-pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5-triazine, 2,4-dithiohydantoin, 2,5- dimethylbenzothiazole, 2-amino-1,3,4-thiadiazole, 2-mercapto-5-methylbenzimidazole,

A method for making an electrically conductive polymer composition, the method comprising: reacting a graphene having a carbon:oxygen ratio of at least about 20:1 with a thermoplastic material to form covalent bonds therebetween; and after reacting, adding metal particles to the thermoplastic material; 1) wherein the metal particles have an additive covalently bonded thereto; 2) whe r-ein the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof and 3) -wheein a combined concentration of the metal particles and the graphene in the thermoplastic material exceeds an electrical percolation threshold.

31.

The method of claim ₂ 7-3 4-, wherein the additive further comprises a functional group that is reactive with the thermoplastic material, the graphene, or both.

A method for forming a connection, the method comprising: heating a solder material to at least its softening temperature; wherein the solder material comprises an electrically conductive polymer composition that comprises a thermoplastic material, a graphene that is covalently bonded to the thermoplastic material, and metal particles; placing at least one member in the softened solder material; and cooling the softened solder material so as to affect hardening and to affix the at least one member thereto.

A method for reworking a connection, the method comprising: heating a connection comprising at least one member and a solder material to at least a softening temperature of the solder material; wherein the solder material comprises an electrically conductive polymer composition that comprises a thermoplastic material, a graphene that is covalently bonded to the thermoplastic material, and metal particles; and removing the at least one member from the connection.

A polymer composition comprising: a polymer matrix; a graphene that is covalently bonded to the polymer matrix; and metal particles having an additive covalently bonded thereto; wherein the additive is selected from the group consisting of 1,3,4- thiadiazole, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1- pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5- triazine, 2,4-dithiohydantoin, 2,5-dimethylbenzothiazole, 2-amino-1,3,4-thiadiazol e, 2- mercapto-5-methylbenzimidazole, 2-mercapto-5-nitrobenzimidazole, 2- mercaptobenzimidizole, 2-mercaptobenzoxazole, 2-mercaptoethane sulfonic acid, 2- mercaptoimidazole, 2-mercaptothiazoline, 2-thiouracil, 3-amino-5-mercapto-1,2,4- triazole, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)-thione, 5-amino- 1,3,4-thiadiazole, 6- amino-2-mercaptobenzothiazole, 6-ethoxy-2-mercaptobenzothiazole, 6-mercaptopurine, N-cycloalkyl-dithiocarbamates, alkyl- and cycloalkyl mercaptans, benzothiazoles, dimercaptopyridines, dimethyldithiocarbamic acid, dithiocyanuric acid, mercaptobenzothiazoles, mercaptobenzoxazoles, mercaptoethanesulfonic acid, mercaptoimidazoles, mercaptopyridines, mercaptopyrimidines, mercaptoquinolines, mercaptothiazoles, mercaptothiazolines, mercaptotriazoles, 0,0-dialkyl- and 0,0- 9 Application No.: 13/103,016 dicycloalkyldithiophosphates, O -alkyl- or O -cycloalkyldithiocarbonates, o-ethylxanthic acid, quinoxaline-2,3-thiol, thioacetic acid, thiocresol, thiosalicylic acid, trithiocyanuric acid, 6-ethoxy-2-mercaptobenzothiazole, 2-mercaptobenzothiazole, diethyldithiocarbamic acid, 5-amino-1,3,4,-thiadiazole-2-thiol, 1,2,3-benzothiazole, 1- pyrollidinecarbodithioic acid, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 2-mercapto-5-nitrobenzimidazole, 2-mercapto-5-methylbenzimidazole, mercaptobenzothiazoles, mercaptothiazolines, mercaptobenzimidazoles, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)- thione, trithiocyanuric acid, 2,4-dithiohydantoin, 2,4-dimercapto-6-amino-5-triazine, silanes, silanols, derivatives thereof, and mixtures thereof; wherein a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

A method for making an electrically conductive polymer composition, the method comprising: reacting a graphene having a carbon:oxygen ratio of at least about 20:1 with a thermoplastic material to form covalent bonds therebetween; and after reacting, adding metal particles to the thermoplastic material; wherein the metal particles have an additive covalently bonded thereto; wherein the additive is selected from the group consisting of 1,3,4- thiadiazole, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1- pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5- triazine, 2,4-dithiohydantoin, 2,5-dimethylbenzothiazole, 2-amino-1,3,4-thiadiazole, 2- mercapto-5-methylbenzimidazole, 2-mercapto-5-nitrobenzimidazole, 2- mercaptobenzimidizole, 2-mercaptobenzoxazole, 2-mercaptoethane sulfonic acid, 2- mercaptoimidazole, 2-mercaptothiazoline, 2-thiouracil, 3-amino-5-mercapto-1,2,4- triazole, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)-thione, 5-amino- 1,3,4-thiadiazole, 6- amino-2-mercaptobenzothiazole, 6-ethoxy-2-mercaptobenzothiazole, 6-mercaptopurine, N-cycloalkyl-dithiocarbamates, alkyl- and cycloalkyl mercaptans, benzothiazoles, dimercaptopyridines, dimethyldithiocarbamic acid, dithiocyanuric acid, mercaptobenzothiazoles, mercaptobenzoxazoles, mercaptoethanesulfonic acid, mercaptoimidazoles, mercaptopyridines, mercaptopyrimidines, mercaptoquinolines, mercaptothiazoles, mercaptothiazolines, mercaptotriazoles, 0,0-dialkyl- and 0,0- 10 Application No.: 13/103,016 dicycloalkyldithiophosphates, 0 -alkyl- or O -cycloalky l dithiocarbonates, o-ethylxanthic acid, quinoxaline-2,3-thiol, thioacetic acid, thiocresol, thiosalicylic acid, trithiocyanuric acid, 6-ethoxy-2-mercaptobenzothiazole, 2-mercaptobenzothiazole, diethyldithiocarbamic acid, 5-amino-1,3,4,-thiadiazole-2-thiol, 1,2,3-benzothiazole, 1- pyrollidinecarbodithioic acid, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 2-mercapto-5- nitrobenzimidazole, 2-mercapto-5-methylbenzimidazole, mercaptobenzothiazoles, mercaptothiazolines, mercaptobenzimidazoles, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)- thione, trithiocyanuric acid, 2,4-dithiohydantoin, 2,4-dimercapto-6-amino-5-triazine, silanes, silanols, derivatives thereof, and mixtures thereof, and wherein a combined concentration of the metal particles and the graphene in the thermoplastic material exceeds an electrical percolation threshold.

A polymer composition comprising: a polymer matrix; a graphene that is covalently bonded to the polymer matrix; and metal particles having an additive covalently bonded thereto; wherein the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof; and wherein a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

11.

The polymer composition of claim -1-, wherein the additive further comprises a functional group that is reactive with the polymer matrix, the graphene, or both.

A polymer composition comprising: a polymer matrix comprising a thermoplastic material; a graphene that is covalently bonded to the thermoplastic material; wherein 1) the graphene has a carbon:oxygen ratio of at least about 20:1; and metal particles having an additive covalently bonded thereto; 2) the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof and 3) wh ere i n a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

20.

The polymer composition of claim 170, wherein the additive is selected from the group consisting of 1,3,4-thiadiazole, 1-(4-hydroxyphenyl)- 1H- tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1-pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5-triazine, 2,4-dithiohydantoin, 2,5- dimethylbenzothiazole, 2-amino-1,3,4-thiadiazole, 2-mercapto-5-methylbenzimidazole,

A method for making an electrically conductive polymer composition, the method comprising: reacting a graphene having a carbon:oxygen ratio of at least about 20:1 with a thermoplastic material to form covalent bonds therebetween; and after reacting, adding metal particles to the thermoplastic material; 1) wherein the metal particles have an additive covalently bonded thereto; 2) whe r-ein the additive comprises a thiol, a silane, a silanol, a monodentate amine, a bidentate amine, or any combination thereof and 3) -wheein a combined concentration of the metal particles and the graphene in the thermoplastic material exceeds an electrical percolation threshold.

31.

The method of claim ₂ 7-3 4-, wherein the additive further comprises a functional group that is reactive with the thermoplastic material, the graphene, or both.

A method for forming a connection, the method comprising: heating a solder material to at least its softening temperature; wherein the solder material comprises an electrically conductive polymer composition that comprises a thermoplastic material, a graphene that is covalently bonded to the thermoplastic material, and metal particles; placing at least one member in the softened solder material; and cooling the softened solder material so as to affect hardening and to affix the at least one member thereto.

A method for reworking a connection, the method comprising: heating a connection comprising at least one member and a solder material to at least a softening temperature of the solder material; wherein the solder material comprises an electrically conductive polymer composition that comprises a thermoplastic material, a graphene that is covalently bonded to the thermoplastic material, and metal particles; and removing the at least one member from the connection.

A polymer composition comprising: a polymer matrix; a graphene that is covalently bonded to the polymer matrix; and metal particles having an additive covalently bonded thereto; wherein the additive is selected from the group consisting of 1,3,4- thiadiazole, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1- pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5- triazine, 2,4-dithiohydantoin, 2,5-dimethylbenzothiazole, 2-amino-1,3,4-thiadiazol e, 2- mercapto-5-methylbenzimidazole, 2-mercapto-5-nitrobenzimidazole, 2- mercaptobenzimidizole, 2-mercaptobenzoxazole, 2-mercaptoethane sulfonic acid, 2- mercaptoimidazole, 2-mercaptothiazoline, 2-thiouracil, 3-amino-5-mercapto-1,2,4- triazole, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)-thione, 5-amino- 1,3,4-thiadiazole, 6- amino-2-mercaptobenzothiazole, 6-ethoxy-2-mercaptobenzothiazole, 6-mercaptopurine, N-cycloalkyl-dithiocarbamates, alkyl- and cycloalkyl mercaptans, benzothiazoles, dimercaptopyridines, dimethyldithiocarbamic acid, dithiocyanuric acid, mercaptobenzothiazoles, mercaptobenzoxazoles, mercaptoethanesulfonic acid, mercaptoimidazoles, mercaptopyridines, mercaptopyrimidines, mercaptoquinolines, mercaptothiazoles, mercaptothiazolines, mercaptotriazoles, 0,0-dialkyl- and 0,0- 9 Application No.: 13/103,016 dicycloalkyldithiophosphates, O -alkyl- or O -cycloalkyldithiocarbonates, o-ethylxanthic acid, quinoxaline-2,3-thiol, thioacetic acid, thiocresol, thiosalicylic acid, trithiocyanuric acid, 6-ethoxy-2-mercaptobenzothiazole, 2-mercaptobenzothiazole, diethyldithiocarbamic acid, 5-amino-1,3,4,-thiadiazole-2-thiol, 1,2,3-benzothiazole, 1- pyrollidinecarbodithioic acid, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 2-mercapto-5-nitrobenzimidazole, 2-mercapto-5-methylbenzimidazole, mercaptobenzothiazoles, mercaptothiazolines, mercaptobenzimidazoles, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)- thione, trithiocyanuric acid, 2,4-dithiohydantoin, 2,4-dimercapto-6-amino-5-triazine, silanes, silanols, derivatives thereof, and mixtures thereof; wherein a combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold.

A method for making an electrically conductive polymer composition, the method comprising: reacting a graphene having a carbon:oxygen ratio of at least about 20:1 with a thermoplastic material to form covalent bonds therebetween; and after reacting, adding metal particles to the thermoplastic material; wherein the metal particles have an additive covalently bonded thereto; wherein the additive is selected from the group consisting of 1,3,4- thiadiazole, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 1,2,4-triazole-3-thiol, 1- pyrollidinecarbodithioic acid, 2,2'- dithiobis(benzothiazole), 2,4-dimercapto-6-amino-5- triazine, 2,4-dithiohydantoin, 2,5-dimethylbenzothiazole, 2-amino-1,3,4-thiadiazole, 2- mercapto-5-methylbenzimidazole, 2-mercapto-5-nitrobenzimidazole, 2- mercaptobenzimidizole, 2-mercaptobenzoxazole, 2-mercaptoethane sulfonic acid, 2- mercaptoimidazole, 2-mercaptothiazoline, 2-thiouracil, 3-amino-5-mercapto-1,2,4- triazole, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)-thione, 5-amino- 1,3,4-thiadiazole, 6- amino-2-mercaptobenzothiazole, 6-ethoxy-2-mercaptobenzothiazole, 6-mercaptopurine, N-cycloalkyl-dithiocarbamates, alkyl- and cycloalkyl mercaptans, benzothiazoles, dimercaptopyridines, dimethyldithiocarbamic acid, dithiocyanuric acid, mercaptobenzothiazoles, mercaptobenzoxazoles, mercaptoethanesulfonic acid, mercaptoimidazoles, mercaptopyridines, mercaptopyrimidines, mercaptoquinolines, mercaptothiazoles, mercaptothiazolines, mercaptotriazoles, 0,0-dialkyl- and 0,0- 10 Application No.: 13/103,016 dicycloalkyldithiophosphates, 0 -alkyl- or O -cycloalky l dithiocarbonates, o-ethylxanthic acid, quinoxaline-2,3-thiol, thioacetic acid, thiocresol, thiosalicylic acid, trithiocyanuric acid, 6-ethoxy-2-mercaptobenzothiazole, 2-mercaptobenzothiazole, diethyldithiocarbamic acid, 5-amino-1,3,4,-thiadiazole-2-thiol, 1,2,3-benzothiazole, 1- pyrollidinecarbodithioic acid, 1-(4-hydroxyphenyl)- 1 H-tetrazol-5-thiol, 2-mercapto-5- nitrobenzimidazole, 2-mercapto-5-methylbenzimidazole, mercaptobenzothiazoles, mercaptothiazolines, mercaptobenzimidazoles, 5,5-dithio-bis(1,3,4-thiadiazole-2(3H)- thione, trithiocyanuric acid, 2,4-dithiohydantoin, 2,4-dimercapto-6-amino-5-triazine, silanes, silanols, derivatives thereof, and mixtures thereof, and wherein a combined concentration of the metal particles and the graphene in the thermoplastic material exceeds an electrical percolation threshold.