Patent
US 10,192,736METHOD FOR TRANSFERRING GRAPHENE
M. Amaia ZURUTUZA ELORZA
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 10,192,736Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of transferring graphene onto a target substrate, said target substrate being either a substrate having cavities and/or holes or a substrate having at least one water soluble layer, characterized in that it comprises the steps of: applying a protective layer (4) onto a sample comprising a stack (20) formed by a graphene monolayer (2) grown on a metal foil or on a metal thin film on a silicon substrate (1); attaching to said protective layer (4) a frame (5) comprising at least one outer border and at least one inner border, said frame (5) comprising a substrate and a thermal release adhesive polymer layer, the thermal release adhesive polymer layer being made of a material different from the material of the substrate, the frame (5) having a Young's modulus equal or higher than 10 MPa providing integrity and allowing the handling of said sample, the frame (5) being thermally released at a temperature up to 150 0 C; removing or detaching said metal foil or metal thin film from the silicon substrate (1); once the metal foil or metal thin film on the silicon substrate (1) has been removed or detached, drying the sample; depositing the sample onto the target substrate (7); and removing said frame (5) by cutting through said protective layer (4) at said at least one inner border of the frame (5), or by thermal release at a temperature up to 150 0 C. Currently amended
The method of claim 1, wherein said target substrate (7) is a substrate having cavities or holes or it is a substrate comprising a water-soluble layer. Previously presented
The method of claim 1, wherein said protective layer (4) is selected from the following group: poly (methyl metha c rylate) (PMMA), cellulose nitrate (N C), cellulose acetate butyrate (CAB), po ly(l actic acid) (PLA), po l y(phthalaldehyde) (PPA), poly(bisphenol A carbonate) (PC), as well as any combustion or derivative of any of the former compounds. Previously presented
The method of claim 1, wherein said frame (5) has a Young's modulus higher than lO MPa. Previously presented
The method of claim 1, wherein when said frame (5) is removed by cutting through said protective layer (4) at said at least one inner border of the frame (5), the dimensions of the outer border of said frame (5) being equal to or larger than the outer dimensions of the sample. Previously presented
The method of claim 1, wherein after removing said metal foil or metal thin film from said silicon substrate (1) by an etchant solution (6), the sample is cleaned with distilled water. Previously presented
The method of claim 1, wherein the sample (22) is dried using N 2. Previously presented
The method of claim 1, wherein the target substrate (7) is heated prior to receiving the sample (22). Previously presented
The method of claim 1, wherein after removing or detaching said frame (5), the sample is baked to improve adhesion. Previously presented
The method of claim 1, further comprising removing said protective layer (4) by means of a thermal treatment or by means of acetone vapor. Previously presented
The method of claim 1, wherein said graphene monolayer (2) is grown on said metal foil or on said metal thin film on a silicon substrate (1) following a process of Chemical Vapor Deposition (CVD). Previously presented
Suspended graphene or deposited graphene obtained by the method of claim 1. Withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
NEMs or MEMs sensor comprising suspended or deposited graphene
Materials described outside the worked examples.
graphene monolayer
metal foil or metal thin film
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
frame Young's modulus (claimed minimum) | 10 MPa | frame comprising substrate and thermal release adhesive polymer layer |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,192,736Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of transferring graphene onto a target substrate, said target substrate being either a substrate having cavities and/or holes or a substrate having at least one water soluble layer, characterized in that it comprises the steps of: applying a protective layer (4) onto a sample comprising a stack (20) formed by a graphene monolayer (2) grown on a metal foil or on a metal thin film on a silicon substrate (1); attaching to said protective layer (4) a frame (5) comprising at least one outer border and at least one inner border, said frame (5) comprising a substrate and a thermal release adhesive polymer layer, the thermal release adhesive polymer layer being made of a material different from the material of the substrate, the frame (5) having a Young's modulus equal or higher than 10 MPa providing integrity and allowing the handling of said sample, the frame (5) being thermally released at a temperature up to 150 0 C; removing or detaching said metal foil or metal thin film from the silicon substrate (1); once the metal foil or metal thin film on the silicon substrate (1) has been removed or detached, drying the sample; depositing the sample onto the target substrate (7); and removing said frame (5) by cutting through said protective layer (4) at said at least one inner border of the frame (5), or by thermal release at a temperature up to 150 0 C. Currently amended
The method of claim 1, wherein said target substrate (7) is a substrate having cavities or holes or it is a substrate comprising a water-soluble layer. Previously presented
The method of claim 1, wherein said protective layer (4) is selected from the following group: poly (methyl metha c rylate) (PMMA), cellulose nitrate (N C), cellulose acetate butyrate (CAB), po ly(l actic acid) (PLA), po l y(phthalaldehyde) (PPA), poly(bisphenol A carbonate) (PC), as well as any combustion or derivative of any of the former compounds. Previously presented
The method of claim 1, wherein said frame (5) has a Young's modulus higher than lO MPa. Previously presented
The method of claim 1, wherein when said frame (5) is removed by cutting through said protective layer (4) at said at least one inner border of the frame (5), the dimensions of the outer border of said frame (5) being equal to or larger than the outer dimensions of the sample. Previously presented
The method of claim 1, wherein after removing said metal foil or metal thin film from said silicon substrate (1) by an etchant solution (6), the sample is cleaned with distilled water. Previously presented
The method of claim 1, wherein the sample (22) is dried using N 2. Previously presented
The method of claim 1, wherein the target substrate (7) is heated prior to receiving the sample (22). Previously presented
The method of claim 1, wherein after removing or detaching said frame (5), the sample is baked to improve adhesion. Previously presented
The method of claim 1, further comprising removing said protective layer (4) by means of a thermal treatment or by means of acetone vapor. Previously presented
The method of claim 1, wherein said graphene monolayer (2) is grown on said metal foil or on said metal thin film on a silicon substrate (1) following a process of Chemical Vapor Deposition (CVD). Previously presented
Suspended graphene or deposited graphene obtained by the method of claim 1. Withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
NEMs or MEMs sensor comprising suspended or deposited graphene
Materials described outside the worked examples.
graphene monolayer
metal foil or metal thin film
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
frame Young's modulus (claimed minimum) | 10 MPa | frame comprising substrate and thermal release adhesive polymer layer |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,192,736Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of transferring graphene onto a target substrate, said target substrate being either a substrate having cavities and/or holes or a substrate having at least one water soluble layer, characterized in that it comprises the steps of: applying a protective layer (4) onto a sample comprising a stack (20) formed by a graphene monolayer (2) grown on a metal foil or on a metal thin film on a silicon substrate (1); attaching to said protective layer (4) a frame (5) comprising at least one outer border and at least one inner border, said frame (5) comprising a substrate and a thermal release adhesive polymer layer, the thermal release adhesive polymer layer being made of a material different from the material of the substrate, the frame (5) having a Young's modulus equal or higher than 10 MPa providing integrity and allowing the handling of said sample, the frame (5) being thermally released at a temperature up to 150 0 C; removing or detaching said metal foil or metal thin film from the silicon substrate (1); once the metal foil or metal thin film on the silicon substrate (1) has been removed or detached, drying the sample; depositing the sample onto the target substrate (7); and removing said frame (5) by cutting through said protective layer (4) at said at least one inner border of the frame (5), or by thermal release at a temperature up to 150 0 C. Currently amended
The method of claim 1, wherein said target substrate (7) is a substrate having cavities or holes or it is a substrate comprising a water-soluble layer. Previously presented
The method of claim 1, wherein said protective layer (4) is selected from the following group: poly (methyl metha c rylate) (PMMA), cellulose nitrate (N C), cellulose acetate butyrate (CAB), po ly(l actic acid) (PLA), po l y(phthalaldehyde) (PPA), poly(bisphenol A carbonate) (PC), as well as any combustion or derivative of any of the former compounds. Previously presented
The method of claim 1, wherein said frame (5) has a Young's modulus higher than lO MPa. Previously presented
The method of claim 1, wherein when said frame (5) is removed by cutting through said protective layer (4) at said at least one inner border of the frame (5), the dimensions of the outer border of said frame (5) being equal to or larger than the outer dimensions of the sample. Previously presented
The method of claim 1, wherein after removing said metal foil or metal thin film from said silicon substrate (1) by an etchant solution (6), the sample is cleaned with distilled water. Previously presented
The method of claim 1, wherein the sample (22) is dried using N 2. Previously presented
The method of claim 1, wherein the target substrate (7) is heated prior to receiving the sample (22). Previously presented
The method of claim 1, wherein after removing or detaching said frame (5), the sample is baked to improve adhesion. Previously presented
The method of claim 1, further comprising removing said protective layer (4) by means of a thermal treatment or by means of acetone vapor. Previously presented
The method of claim 1, wherein said graphene monolayer (2) is grown on said metal foil or on said metal thin film on a silicon substrate (1) following a process of Chemical Vapor Deposition (CVD). Previously presented
Suspended graphene or deposited graphene obtained by the method of claim 1. Withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
NEMs or MEMs sensor comprising suspended or deposited graphene
Materials described outside the worked examples.
graphene monolayer
metal foil or metal thin film
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
frame Young's modulus (claimed minimum) | 10 MPa | frame comprising substrate and thermal release adhesive polymer layer |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,192,736Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of transferring graphene onto a target substrate, said target substrate being either a substrate having cavities and/or holes or a substrate having at least one water soluble layer, characterized in that it comprises the steps of: applying a protective layer (4) onto a sample comprising a stack (20) formed by a graphene monolayer (2) grown on a metal foil or on a metal thin film on a silicon substrate (1); attaching to said protective layer (4) a frame (5) comprising at least one outer border and at least one inner border, said frame (5) comprising a substrate and a thermal release adhesive polymer layer, the thermal release adhesive polymer layer being made of a material different from the material of the substrate, the frame (5) having a Young's modulus equal or higher than 10 MPa providing integrity and allowing the handling of said sample, the frame (5) being thermally released at a temperature up to 150 0 C; removing or detaching said metal foil or metal thin film from the silicon substrate (1); once the metal foil or metal thin film on the silicon substrate (1) has been removed or detached, drying the sample; depositing the sample onto the target substrate (7); and removing said frame (5) by cutting through said protective layer (4) at said at least one inner border of the frame (5), or by thermal release at a temperature up to 150 0 C. Currently amended
The method of claim 1, wherein said target substrate (7) is a substrate having cavities or holes or it is a substrate comprising a water-soluble layer. Previously presented
The method of claim 1, wherein said protective layer (4) is selected from the following group: poly (methyl metha c rylate) (PMMA), cellulose nitrate (N C), cellulose acetate butyrate (CAB), po ly(l actic acid) (PLA), po l y(phthalaldehyde) (PPA), poly(bisphenol A carbonate) (PC), as well as any combustion or derivative of any of the former compounds. Previously presented
The method of claim 1, wherein said frame (5) has a Young's modulus higher than lO MPa. Previously presented
The method of claim 1, wherein when said frame (5) is removed by cutting through said protective layer (4) at said at least one inner border of the frame (5), the dimensions of the outer border of said frame (5) being equal to or larger than the outer dimensions of the sample. Previously presented
The method of claim 1, wherein after removing said metal foil or metal thin film from said silicon substrate (1) by an etchant solution (6), the sample is cleaned with distilled water. Previously presented
The method of claim 1, wherein the sample (22) is dried using N 2. Previously presented
The method of claim 1, wherein the target substrate (7) is heated prior to receiving the sample (22). Previously presented
The method of claim 1, wherein after removing or detaching said frame (5), the sample is baked to improve adhesion. Previously presented
The method of claim 1, further comprising removing said protective layer (4) by means of a thermal treatment or by means of acetone vapor. Previously presented
The method of claim 1, wherein said graphene monolayer (2) is grown on said metal foil or on said metal thin film on a silicon substrate (1) following a process of Chemical Vapor Deposition (CVD). Previously presented
Suspended graphene or deposited graphene obtained by the method of claim 1. Withdrawn
Layer stacks claimed or described, ordered top of device to substrate.
NEMs or MEMs sensor comprising suspended or deposited graphene
Materials described outside the worked examples.
graphene monolayer
metal foil or metal thin film
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
frame Young's modulus (claimed minimum) | 10 MPa | frame comprising substrate and thermal release adhesive polymer layer |
Related documents with shared materials, methods, properties, or citations.
copper foil
Cu
frame comprising substrate and thermal release adhesive polymer layer
REVALPHA
protective layer
poly(methyl methacrylate)
cellulose nitrate
cellulose acetate butyrate
poly(lactic acid)
poly(phthalaldehyde)
poly(bisphenol A carbonate)
frame Young's modulus (preferred range) | 500–6000 MPa | frame comprising substrate and thermal release adhesive polymer layer |
frame thermal release temperature (maximum) | 150 °C | frame comprising substrate and thermal release adhesive polymer layer |
Thickness | 0.01–1 mm | — |
Thickness | 0.01–0.25 mm | — |
Thickness | 100–1000 nm | — |
Pressure | 0.01–0.8 MPa | — |
Duration | 1–240 seconds | — |
Duration | 2–3 seconds | — |
Pressure | 0.36–0.87 MPa | — |
Pressure | ≤ 1 MPa | — |
copper foil
Cu
frame comprising substrate and thermal release adhesive polymer layer
REVALPHA
protective layer
poly(methyl methacrylate)
cellulose nitrate
cellulose acetate butyrate
poly(lactic acid)
poly(phthalaldehyde)
poly(bisphenol A carbonate)
frame Young's modulus (preferred range) | 500–6000 MPa | frame comprising substrate and thermal release adhesive polymer layer |
frame thermal release temperature (maximum) | 150 °C | frame comprising substrate and thermal release adhesive polymer layer |
Thickness | 0.01–1 mm | — |
Thickness | 0.01–0.25 mm | — |
Thickness | 100–1000 nm | — |
Pressure | 0.01–0.8 MPa | — |
Duration | 1–240 seconds | — |
Duration | 2–3 seconds | — |
Pressure | 0.36–0.87 MPa | — |
Pressure | ≤ 1 MPa | — |
copper foil
Cu
frame comprising substrate and thermal release adhesive polymer layer
REVALPHA
protective layer
poly(methyl methacrylate)
cellulose nitrate
cellulose acetate butyrate
poly(lactic acid)
poly(phthalaldehyde)
poly(bisphenol A carbonate)
frame Young's modulus (preferred range) | 500–6000 MPa | frame comprising substrate and thermal release adhesive polymer layer |
frame thermal release temperature (maximum) | 150 °C | frame comprising substrate and thermal release adhesive polymer layer |
Thickness | 0.01–1 mm | — |
Thickness | 0.01–0.25 mm | — |
Thickness | 100–1000 nm | — |
Pressure | 0.01–0.8 MPa | — |
Duration | 1–240 seconds | — |
Duration | 2–3 seconds | — |
Pressure | 0.36–0.87 MPa | — |
Pressure | ≤ 1 MPa | — |
copper foil
Cu
frame comprising substrate and thermal release adhesive polymer layer
REVALPHA
protective layer
poly(methyl methacrylate)
cellulose nitrate
cellulose acetate butyrate
poly(lactic acid)
poly(phthalaldehyde)
poly(bisphenol A carbonate)
frame Young's modulus (preferred range) | 500–6000 MPa | frame comprising substrate and thermal release adhesive polymer layer |
frame thermal release temperature (maximum) | 150 °C | frame comprising substrate and thermal release adhesive polymer layer |
Thickness | 0.01–1 mm | — |
Thickness | 0.01–0.25 mm | — |
Thickness | 100–1000 nm | — |
Pressure | 0.01–0.8 MPa | — |
Duration | 1–240 seconds | — |
Duration | 2–3 seconds | — |
Pressure | 0.36–0.87 MPa | — |
Pressure | ≤ 1 MPa | — |