Patent
US 8,617,669substrate
silicon substrate
Si
silicon carbide substrate
SiC
wide bandgap substrate
FIG. 2 is an enlarged isometric view of the layer of the wide bandgap material formed in the non-wide bandgap material; [00019]
FIG. 3 is an enlarged sectional view of a first embodiment of the invention illustrating a wide bandgap material 10 A formed in the substrate 20A. In this …
FIG. 4 is an enlarged sectional view of a second embodiment of the invention illustrating a wide bandgap material 10 B formed in the substrate 2 0 B. In this …
FIG. 5 is an enlarged sectional view of a third embodiment of the invention illustrating a wide bandgap material 1O C formed in the substrate 20C. In this …
FIG. 6 is an enlarged sectional view of a fourth embodiment of the invention illustrating a component 50 D defined in a wide bandgap material 1O D formed in the …
FIG. 7 is an enlarged isometric view of a fifth embodiment of the invention illustrating a semiconductor device 50E defined in the wide bandgap material 10 E …
FIG. 10 is an enlarged isometric view of a sixth embodiment of the invention illustrating a first semiconductor device 51F defined in the wide bandgap material …
FIG. 13. The non-wide bandgap material 15G is indicated as NON-WBG. The substrate 20G defines a first and a second surface 21G and 22G and a peripheral edge 23G. …
FIG. 14 illustrates a first step in the process of increasing the thermal conductivity in the non-wide bandgap substrate 20G. A doping gas is applied to the …
FIGS. 15 illustrate the forming of thermal conducting material 50G within the wide bandgap material 1O G of the substrate 20G. The thermal conducting material …
FIG. 19 is a side sectional view of a convention die 60H of the prior art incorporated into a conventional heat spreader 80H and a conventional heat sink 90H …
FIGS. 20-23 increases the thickness of the assembly as the layers of silicon carbide material 10 1 and the thermal conducting material 50 1 are added onto the …
FIG. 25 with a portion of the silicon carbide material 1O J being converted into a layer of thermal conducting carbon material 50J. A second thermal energy …
FIGS. 30-32 illustrate a process of the present invention for increasing the thermal conductivity of a substrate 20K formed from a silicon carbide material 10 …
FIG. 33 is a graph of the thermal conductivity of different carbon materials. The thermal conductivity of diamond or diamond like carbon material is compared to …
substrate
silicon substrate
Si
silicon carbide substrate
SiC
wide bandgap substrate
FIG. 2 is an enlarged isometric view of the layer of the wide bandgap material formed in the non-wide bandgap material; [00019]
FIG. 3 is an enlarged sectional view of a first embodiment of the invention illustrating a wide bandgap material 10 A formed in the substrate 20A. In this …
FIG. 4 is an enlarged sectional view of a second embodiment of the invention illustrating a wide bandgap material 10 B formed in the substrate 2 0 B. In this …
FIG. 5 is an enlarged sectional view of a third embodiment of the invention illustrating a wide bandgap material 1O C formed in the substrate 20C. In this …
FIG. 6 is an enlarged sectional view of a fourth embodiment of the invention illustrating a component 50 D defined in a wide bandgap material 1O D formed in the …
FIG. 7 is an enlarged isometric view of a fifth embodiment of the invention illustrating a semiconductor device 50E defined in the wide bandgap material 10 E …
FIG. 10 is an enlarged isometric view of a sixth embodiment of the invention illustrating a first semiconductor device 51F defined in the wide bandgap material …
FIG. 13. The non-wide bandgap material 15G is indicated as NON-WBG. The substrate 20G defines a first and a second surface 21G and 22G and a peripheral edge 23G. …
FIG. 14 illustrates a first step in the process of increasing the thermal conductivity in the non-wide bandgap substrate 20G. A doping gas is applied to the …
FIGS. 15 illustrate the forming of thermal conducting material 50G within the wide bandgap material 1O G of the substrate 20G. The thermal conducting material …
FIG. 19 is a side sectional view of a convention die 60H of the prior art incorporated into a conventional heat spreader 80H and a conventional heat sink 90H …
FIGS. 20-23 increases the thickness of the assembly as the layers of silicon carbide material 10 1 and the thermal conducting material 50 1 are added onto the …
FIG. 25 with a portion of the silicon carbide material 1O J being converted into a layer of thermal conducting carbon material 50J. A second thermal energy …
FIGS. 30-32 illustrate a process of the present invention for increasing the thermal conductivity of a substrate 20K formed from a silicon carbide material 10 …
FIG. 33 is a graph of the thermal conductivity of different carbon materials. The thermal conductivity of diamond or diamond like carbon material is compared to …
substrate
silicon substrate
Si
silicon carbide substrate
SiC
wide bandgap substrate
FIG. 2 is an enlarged isometric view of the layer of the wide bandgap material formed in the non-wide bandgap material; [00019]
FIG. 3 is an enlarged sectional view of a first embodiment of the invention illustrating a wide bandgap material 10 A formed in the substrate 20A. In this …
FIG. 4 is an enlarged sectional view of a second embodiment of the invention illustrating a wide bandgap material 10 B formed in the substrate 2 0 B. In this …
FIG. 5 is an enlarged sectional view of a third embodiment of the invention illustrating a wide bandgap material 1O C formed in the substrate 20C. In this …
FIG. 6 is an enlarged sectional view of a fourth embodiment of the invention illustrating a component 50 D defined in a wide bandgap material 1O D formed in the …
FIG. 7 is an enlarged isometric view of a fifth embodiment of the invention illustrating a semiconductor device 50E defined in the wide bandgap material 10 E …
FIG. 10 is an enlarged isometric view of a sixth embodiment of the invention illustrating a first semiconductor device 51F defined in the wide bandgap material …
FIG. 13. The non-wide bandgap material 15G is indicated as NON-WBG. The substrate 20G defines a first and a second surface 21G and 22G and a peripheral edge 23G. …
FIG. 14 illustrates a first step in the process of increasing the thermal conductivity in the non-wide bandgap substrate 20G. A doping gas is applied to the …
FIGS. 15 illustrate the forming of thermal conducting material 50G within the wide bandgap material 1O G of the substrate 20G. The thermal conducting material …
FIG. 19 is a side sectional view of a convention die 60H of the prior art incorporated into a conventional heat spreader 80H and a conventional heat sink 90H …
FIGS. 20-23 increases the thickness of the assembly as the layers of silicon carbide material 10 1 and the thermal conducting material 50 1 are added onto the …
FIG. 25 with a portion of the silicon carbide material 1O J being converted into a layer of thermal conducting carbon material 50J. A second thermal energy …
FIGS. 30-32 illustrate a process of the present invention for increasing the thermal conductivity of a substrate 20K formed from a silicon carbide material 10 …
FIG. 33 is a graph of the thermal conductivity of different carbon materials. The thermal conductivity of diamond or diamond like carbon material is compared to …
substrate
silicon substrate
Si
silicon carbide substrate
SiC
wide bandgap substrate
FIG. 2 is an enlarged isometric view of the layer of the wide bandgap material formed in the non-wide bandgap material; [00019]
FIG. 3 is an enlarged sectional view of a first embodiment of the invention illustrating a wide bandgap material 10 A formed in the substrate 20A. In this …
FIG. 4 is an enlarged sectional view of a second embodiment of the invention illustrating a wide bandgap material 10 B formed in the substrate 2 0 B. In this …
FIG. 5 is an enlarged sectional view of a third embodiment of the invention illustrating a wide bandgap material 1O C formed in the substrate 20C. In this …
FIG. 6 is an enlarged sectional view of a fourth embodiment of the invention illustrating a component 50 D defined in a wide bandgap material 1O D formed in the …
FIG. 7 is an enlarged isometric view of a fifth embodiment of the invention illustrating a semiconductor device 50E defined in the wide bandgap material 10 E …
FIG. 10 is an enlarged isometric view of a sixth embodiment of the invention illustrating a first semiconductor device 51F defined in the wide bandgap material …
FIG. 13. The non-wide bandgap material 15G is indicated as NON-WBG. The substrate 20G defines a first and a second surface 21G and 22G and a peripheral edge 23G. …
FIG. 14 illustrates a first step in the process of increasing the thermal conductivity in the non-wide bandgap substrate 20G. A doping gas is applied to the …
FIGS. 15 illustrate the forming of thermal conducting material 50G within the wide bandgap material 1O G of the substrate 20G. The thermal conducting material …
FIG. 19 is a side sectional view of a convention die 60H of the prior art incorporated into a conventional heat spreader 80H and a conventional heat sink 90H …
FIGS. 20-23 increases the thickness of the assembly as the layers of silicon carbide material 10 1 and the thermal conducting material 50 1 are added onto the …
FIG. 25 with a portion of the silicon carbide material 1O J being converted into a layer of thermal conducting carbon material 50J. A second thermal energy …
FIGS. 30-32 illustrate a process of the present invention for increasing the thermal conductivity of a substrate 20K formed from a silicon carbide material 10 …
FIG. 33 is a graph of the thermal conductivity of different carbon materials. The thermal conductivity of diamond or diamond like carbon material is compared to …