Patent
US 11,963,450 B2precious metal layer
metal bonding layer
gold layer
Au
potassium persulfate
K₂S₂O₈
potassium hydroxide
KOH
insulating resin
thermosetting adhesive
insulating material
| — |
Thickness | 70–120 nm | — |
precious metal layer
metal bonding layer
gold layer
Au
potassium persulfate
K₂S₂O₈
potassium hydroxide
KOH
insulating resin
thermosetting adhesive
insulating material
| — |
Thickness | 70–120 nm | — |
precious metal layer
metal bonding layer
gold layer
Au
potassium persulfate
K₂S₂O₈
potassium hydroxide
KOH
insulating resin
thermosetting adhesive
insulating material
| — |
Thickness | 70–120 nm | — |
precious metal layer
metal bonding layer
gold layer
Au
potassium persulfate
K₂S₂O₈
potassium hydroxide
KOH
insulating resin
thermosetting adhesive
insulating material
| — |
Thickness | 70–120 nm | — |