Patent
US 9,437,686semiconductor structure with substrate, intermediate AlN layer over at least one layer, transition layer, and GaN layer
semiconductor material with compositionally-graded transition layer on silicon substrate
InGaN transition layer alloy
InyGa(1-y)N
AlGaN transition layer alloy
AlxGa(1-x)N
silicon-on-insulator substrate
silicon-on-sapphire substrate
SIMOX substrate
| — |
Thickness | 0.001–0.02 µm | — |
Thickness | 0.01–2 µm | — |
Temperature | 1000–1050 °C | — |
Pressure | 30–200 Torr | — |
Thickness | ≤ 500 µm | — |
Thickness | ≥ 5 µm | — |
Thickness | ≥ 0.75 µm | — |
Thickness | ≥ 1 µm | — |
Thickness | ≥ 1 mm | — |
Thickness | ≥ 0.5 µm | — |
HIGH-VOLTAGE GALLIUM NITRIDE SCHOTTKY DIODE
semiconductor structure with substrate, intermediate AlN layer over at least one layer, transition layer, and GaN layer
semiconductor material with compositionally-graded transition layer on silicon substrate
InGaN transition layer alloy
InyGa(1-y)N
AlGaN transition layer alloy
AlxGa(1-x)N
silicon-on-insulator substrate
silicon-on-sapphire substrate
SIMOX substrate
| — |
Thickness | 0.001–0.02 µm | — |
Thickness | 0.01–2 µm | — |
Temperature | 1000–1050 °C | — |
Pressure | 30–200 Torr | — |
Thickness | ≤ 500 µm | — |
Thickness | ≥ 5 µm | — |
Thickness | ≥ 0.75 µm | — |
Thickness | ≥ 1 µm | — |
Thickness | ≥ 1 mm | — |
Thickness | ≥ 0.5 µm | — |
HIGH-VOLTAGE GALLIUM NITRIDE SCHOTTKY DIODE
semiconductor structure with substrate, intermediate AlN layer over at least one layer, transition layer, and GaN layer
semiconductor material with compositionally-graded transition layer on silicon substrate
InGaN transition layer alloy
InyGa(1-y)N
AlGaN transition layer alloy
AlxGa(1-x)N
silicon-on-insulator substrate
silicon-on-sapphire substrate
SIMOX substrate
| — |
Thickness | 0.001–0.02 µm | — |
Thickness | 0.01–2 µm | — |
Temperature | 1000–1050 °C | — |
Pressure | 30–200 Torr | — |
Thickness | ≤ 500 µm | — |
Thickness | ≥ 5 µm | — |
Thickness | ≥ 0.75 µm | — |
Thickness | ≥ 1 µm | — |
Thickness | ≥ 1 mm | — |
Thickness | ≥ 0.5 µm | — |
HIGH-VOLTAGE GALLIUM NITRIDE SCHOTTKY DIODE
semiconductor structure with substrate, intermediate AlN layer over at least one layer, transition layer, and GaN layer
semiconductor material with compositionally-graded transition layer on silicon substrate
InGaN transition layer alloy
InyGa(1-y)N
AlGaN transition layer alloy
AlxGa(1-x)N
silicon-on-insulator substrate
silicon-on-sapphire substrate
SIMOX substrate
| — |
Thickness | 0.001–0.02 µm | — |
Thickness | 0.01–2 µm | — |
Temperature | 1000–1050 °C | — |
Pressure | 30–200 Torr | — |
Thickness | ≤ 500 µm | — |
Thickness | ≥ 5 µm | — |
Thickness | ≥ 0.75 µm | — |
Thickness | ≥ 1 µm | — |
Thickness | ≥ 1 mm | — |
Thickness | ≥ 0.5 µm | — |