Patent
US 8,592,291FABRICATION OF LARGE-AREA HEXAGONAL BORON NITRIDE THIN FILMS
Yumeng Shi
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 8,592,291Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is an illustration of a growth substrate.
FIG. 2 is an illustration of a h-BN film grown on the growth substrate.
FIG. 3 is an illustration of a protective support layer coated on the h-BN film. 5
FIG. 4 is an illustration showing the release of the protective support layer and h-BN film from the growth substrate.
FIG. 5 is an illustration showing the protective support layer and h-BN film being deposited on a target substrate.
FIG. 6 is an illustration showing the h-BN film on the target substrate with the protective 10 support layer removed.
FIGS. 7-10 are optical images and AFM characterizations of fabricated h-BN thin films on nickel and on a Si/SiO 2 substrate.
FIGS. 9 and 10, respectively, show AFM images of the as-grown h-BN film on 20 the nickel surface and of the h-BN film transferred to a Si/SiO 2 substrate. The …
FIGS. 11-14 are TEM images and an electron beam diffraction pattern illustrating the fabricated h- BN films. 15
FIG. 12. The electron beam size was 50 nm, and the in-plane lattice constant can be estimated to be around 0.250 ± 0.03 nm from the electron diffraction …
FIG. 14, which is a close- up TEM image taken on the surface of the h-BN film. This TEM image also shows a paralleled line shape feature of the film that may be …
FIGS. 15-17 present XPS spectra characterization of a fabricated h-BN film on a nickel substrate.
FIG. 18 presents the FTIR spectra of a fabricated h-BN film on a Si/SiO 2 substrate.
FIG. 19 presents the Raman spectra of the fabricated h-BN film on the Si/SiO 2 substrate.
FIGS. 20 presents the photo-absorption spectra of a fabricated h-BN film on a quartz 20 substrate.
FIG. 21 presents the result of an optical-band-gap analysis on the fabricated h-BN film on a quartz substrate. In the accompanying drawings, like reference …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for fabricating a hexagonal boron nitride film, comprising: providing a growth substrate including a metal surface; growing a hexagonal boron nitride film on the metal surface; annealing the hexagonal boron nitride film; coating the hexagonal boron nitride film with a protective support layer; and releasing the hexagonal boron nitride film together with the protective support layer from the metal surface.
The method of claim 1, wherein the hexagonal boron nitride film is deposited on the metal surface via chemical vapor deposition at a temperature less than 400 °C
The method of claim 1, wherein the hexagonal boron nitride film is annealed at a temperature in a range from about 900 ° C to about 1100 0C. -2-
The method of claim 1, further comprising applying the hexagonal boron nitride film and the protective support layer coating to a target substrate.
The method of claim 1, wherein the metal surface comprises at least one of nickel, platinum, copper, ruthenium, iron, cobalt, and molybdenum.
The method of claim 1, wherein the hexagonal boron nitride film is deposited on the metal surface via chemical vapor deposition using a precursor selected from at least one of borazine and B -trichloroborazine ((C l BNH) s).
The method of claim 1, wherein the protective support layer comprises at least one of polymethylmethacrylate, polydimethylsiloxane, polyethylene terephthalate, and polyethylene naphthalate.
The method of claim 1, wherein the metal surface is etched to release the hexagonal boron nitride film and the protective support layer. 20-22.
canceled
canceled
canceled
Materials described outside the worked examples.
hexagonal boron nitride film
h-BN
protective support layer
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIGS. 7-10 are optical images and AFM characterizations of fabricated h-BN thin films on nickel and on a Si/SiO 2 substrate.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Film Thickness Range | 1–50 nm | h-BN |
Pressure | 50–101 kPa |
Related documents with shared materials, methods, properties, or citations.
Encapsulation of the Graphene Nanoribbon Precursor 1,2,4-trichlorobenzene in Boron Nitride Nanotubes at Room Temperature
Unravelling the room temperature growth of two-dimensional h-BN nanosheets for multifunctional applications
Patent
Atlas literature
Patent
US 8,592,291Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is an illustration of a growth substrate.
FIG. 2 is an illustration of a h-BN film grown on the growth substrate.
FIG. 3 is an illustration of a protective support layer coated on the h-BN film. 5
FIG. 4 is an illustration showing the release of the protective support layer and h-BN film from the growth substrate.
FIG. 5 is an illustration showing the protective support layer and h-BN film being deposited on a target substrate.
FIG. 6 is an illustration showing the h-BN film on the target substrate with the protective 10 support layer removed.
FIGS. 7-10 are optical images and AFM characterizations of fabricated h-BN thin films on nickel and on a Si/SiO 2 substrate.
FIGS. 9 and 10, respectively, show AFM images of the as-grown h-BN film on 20 the nickel surface and of the h-BN film transferred to a Si/SiO 2 substrate. The …
FIGS. 11-14 are TEM images and an electron beam diffraction pattern illustrating the fabricated h- BN films. 15
FIG. 12. The electron beam size was 50 nm, and the in-plane lattice constant can be estimated to be around 0.250 ± 0.03 nm from the electron diffraction …
FIG. 14, which is a close- up TEM image taken on the surface of the h-BN film. This TEM image also shows a paralleled line shape feature of the film that may be …
FIGS. 15-17 present XPS spectra characterization of a fabricated h-BN film on a nickel substrate.
FIG. 18 presents the FTIR spectra of a fabricated h-BN film on a Si/SiO 2 substrate.
FIG. 19 presents the Raman spectra of the fabricated h-BN film on the Si/SiO 2 substrate.
FIGS. 20 presents the photo-absorption spectra of a fabricated h-BN film on a quartz 20 substrate.
FIG. 21 presents the result of an optical-band-gap analysis on the fabricated h-BN film on a quartz substrate. In the accompanying drawings, like reference …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for fabricating a hexagonal boron nitride film, comprising: providing a growth substrate including a metal surface; growing a hexagonal boron nitride film on the metal surface; annealing the hexagonal boron nitride film; coating the hexagonal boron nitride film with a protective support layer; and releasing the hexagonal boron nitride film together with the protective support layer from the metal surface.
The method of claim 1, wherein the hexagonal boron nitride film is deposited on the metal surface via chemical vapor deposition at a temperature less than 400 °C
The method of claim 1, wherein the hexagonal boron nitride film is annealed at a temperature in a range from about 900 ° C to about 1100 0C. -2-
The method of claim 1, further comprising applying the hexagonal boron nitride film and the protective support layer coating to a target substrate.
The method of claim 1, wherein the metal surface comprises at least one of nickel, platinum, copper, ruthenium, iron, cobalt, and molybdenum.
The method of claim 1, wherein the hexagonal boron nitride film is deposited on the metal surface via chemical vapor deposition using a precursor selected from at least one of borazine and B -trichloroborazine ((C l BNH) s).
The method of claim 1, wherein the protective support layer comprises at least one of polymethylmethacrylate, polydimethylsiloxane, polyethylene terephthalate, and polyethylene naphthalate.
The method of claim 1, wherein the metal surface is etched to release the hexagonal boron nitride film and the protective support layer. 20-22.
canceled
canceled
canceled
Materials described outside the worked examples.
hexagonal boron nitride film
h-BN
protective support layer
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIGS. 7-10 are optical images and AFM characterizations of fabricated h-BN thin films on nickel and on a Si/SiO 2 substrate.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Film Thickness Range | 1–50 nm | h-BN |
Pressure | 50–101 kPa |
Related documents with shared materials, methods, properties, or citations.
Encapsulation of the Graphene Nanoribbon Precursor 1,2,4-trichlorobenzene in Boron Nitride Nanotubes at Room Temperature
Unravelling the room temperature growth of two-dimensional h-BN nanosheets for multifunctional applications
Patent
Atlas literature
Patent
US 8,592,291Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is an illustration of a growth substrate.
FIG. 2 is an illustration of a h-BN film grown on the growth substrate.
FIG. 3 is an illustration of a protective support layer coated on the h-BN film. 5
FIG. 4 is an illustration showing the release of the protective support layer and h-BN film from the growth substrate.
FIG. 5 is an illustration showing the protective support layer and h-BN film being deposited on a target substrate.
FIG. 6 is an illustration showing the h-BN film on the target substrate with the protective 10 support layer removed.
FIGS. 7-10 are optical images and AFM characterizations of fabricated h-BN thin films on nickel and on a Si/SiO 2 substrate.
FIGS. 9 and 10, respectively, show AFM images of the as-grown h-BN film on 20 the nickel surface and of the h-BN film transferred to a Si/SiO 2 substrate. The …
FIGS. 11-14 are TEM images and an electron beam diffraction pattern illustrating the fabricated h- BN films. 15
FIG. 12. The electron beam size was 50 nm, and the in-plane lattice constant can be estimated to be around 0.250 ± 0.03 nm from the electron diffraction …
FIG. 14, which is a close- up TEM image taken on the surface of the h-BN film. This TEM image also shows a paralleled line shape feature of the film that may be …
FIGS. 15-17 present XPS spectra characterization of a fabricated h-BN film on a nickel substrate.
FIG. 18 presents the FTIR spectra of a fabricated h-BN film on a Si/SiO 2 substrate.
FIG. 19 presents the Raman spectra of the fabricated h-BN film on the Si/SiO 2 substrate.
FIGS. 20 presents the photo-absorption spectra of a fabricated h-BN film on a quartz 20 substrate.
FIG. 21 presents the result of an optical-band-gap analysis on the fabricated h-BN film on a quartz substrate. In the accompanying drawings, like reference …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for fabricating a hexagonal boron nitride film, comprising: providing a growth substrate including a metal surface; growing a hexagonal boron nitride film on the metal surface; annealing the hexagonal boron nitride film; coating the hexagonal boron nitride film with a protective support layer; and releasing the hexagonal boron nitride film together with the protective support layer from the metal surface.
The method of claim 1, wherein the hexagonal boron nitride film is deposited on the metal surface via chemical vapor deposition at a temperature less than 400 °C
The method of claim 1, wherein the hexagonal boron nitride film is annealed at a temperature in a range from about 900 ° C to about 1100 0C. -2-
The method of claim 1, further comprising applying the hexagonal boron nitride film and the protective support layer coating to a target substrate.
The method of claim 1, wherein the metal surface comprises at least one of nickel, platinum, copper, ruthenium, iron, cobalt, and molybdenum.
The method of claim 1, wherein the hexagonal boron nitride film is deposited on the metal surface via chemical vapor deposition using a precursor selected from at least one of borazine and B -trichloroborazine ((C l BNH) s).
The method of claim 1, wherein the protective support layer comprises at least one of polymethylmethacrylate, polydimethylsiloxane, polyethylene terephthalate, and polyethylene naphthalate.
The method of claim 1, wherein the metal surface is etched to release the hexagonal boron nitride film and the protective support layer. 20-22.
canceled
canceled
canceled
Materials described outside the worked examples.
hexagonal boron nitride film
h-BN
protective support layer
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIGS. 7-10 are optical images and AFM characterizations of fabricated h-BN thin films on nickel and on a Si/SiO 2 substrate.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Film Thickness Range | 1–50 nm | h-BN |
Pressure | 50–101 kPa |
Related documents with shared materials, methods, properties, or citations.
Encapsulation of the Graphene Nanoribbon Precursor 1,2,4-trichlorobenzene in Boron Nitride Nanotubes at Room Temperature
Unravelling the room temperature growth of two-dimensional h-BN nanosheets for multifunctional applications
Patent
Atlas literature
Patent
US 8,592,291Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is an illustration of a growth substrate.
FIG. 2 is an illustration of a h-BN film grown on the growth substrate.
FIG. 3 is an illustration of a protective support layer coated on the h-BN film. 5
FIG. 4 is an illustration showing the release of the protective support layer and h-BN film from the growth substrate.
FIG. 5 is an illustration showing the protective support layer and h-BN film being deposited on a target substrate.
FIG. 6 is an illustration showing the h-BN film on the target substrate with the protective 10 support layer removed.
FIGS. 7-10 are optical images and AFM characterizations of fabricated h-BN thin films on nickel and on a Si/SiO 2 substrate.
FIGS. 9 and 10, respectively, show AFM images of the as-grown h-BN film on 20 the nickel surface and of the h-BN film transferred to a Si/SiO 2 substrate. The …
FIGS. 11-14 are TEM images and an electron beam diffraction pattern illustrating the fabricated h- BN films. 15
FIG. 12. The electron beam size was 50 nm, and the in-plane lattice constant can be estimated to be around 0.250 ± 0.03 nm from the electron diffraction …
FIG. 14, which is a close- up TEM image taken on the surface of the h-BN film. This TEM image also shows a paralleled line shape feature of the film that may be …
FIGS. 15-17 present XPS spectra characterization of a fabricated h-BN film on a nickel substrate.
FIG. 18 presents the FTIR spectra of a fabricated h-BN film on a Si/SiO 2 substrate.
FIG. 19 presents the Raman spectra of the fabricated h-BN film on the Si/SiO 2 substrate.
FIGS. 20 presents the photo-absorption spectra of a fabricated h-BN film on a quartz 20 substrate.
FIG. 21 presents the result of an optical-band-gap analysis on the fabricated h-BN film on a quartz substrate. In the accompanying drawings, like reference …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for fabricating a hexagonal boron nitride film, comprising: providing a growth substrate including a metal surface; growing a hexagonal boron nitride film on the metal surface; annealing the hexagonal boron nitride film; coating the hexagonal boron nitride film with a protective support layer; and releasing the hexagonal boron nitride film together with the protective support layer from the metal surface.
The method of claim 1, wherein the hexagonal boron nitride film is deposited on the metal surface via chemical vapor deposition at a temperature less than 400 °C
The method of claim 1, wherein the hexagonal boron nitride film is annealed at a temperature in a range from about 900 ° C to about 1100 0C. -2-
The method of claim 1, further comprising applying the hexagonal boron nitride film and the protective support layer coating to a target substrate.
The method of claim 1, wherein the metal surface comprises at least one of nickel, platinum, copper, ruthenium, iron, cobalt, and molybdenum.
The method of claim 1, wherein the hexagonal boron nitride film is deposited on the metal surface via chemical vapor deposition using a precursor selected from at least one of borazine and B -trichloroborazine ((C l BNH) s).
The method of claim 1, wherein the protective support layer comprises at least one of polymethylmethacrylate, polydimethylsiloxane, polyethylene terephthalate, and polyethylene naphthalate.
The method of claim 1, wherein the metal surface is etched to release the hexagonal boron nitride film and the protective support layer. 20-22.
canceled
canceled
canceled
Materials described outside the worked examples.
hexagonal boron nitride film
h-BN
protective support layer
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIGS. 7-10 are optical images and AFM characterizations of fabricated h-BN thin films on nickel and on a Si/SiO 2 substrate.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Film Thickness Range | 1–50 nm | h-BN |
Pressure | 50–101 kPa |
Related documents with shared materials, methods, properties, or citations.
Encapsulation of the Graphene Nanoribbon Precursor 1,2,4-trichlorobenzene in Boron Nitride Nanotubes at Room Temperature
Unravelling the room temperature growth of two-dimensional h-BN nanosheets for multifunctional applications
metal surface
nickel
Ni
silicon
Si
silica surface coating
SiO₂
borazine
B₃N₃H₆
B-trichloroborazine
(ClBNH)3
polymethylmethacrylate
polydimethylsiloxane
polyethylene terephthalate
polyethylene naphthalate
chromium adhesion layer
Cr
FIGS. 9 and 10, respectively, show AFM images of the as-grown h-BN film on 20 the nickel surface and of the h-BN film transferred to a Si/SiO 2 substrate. The …
FIGS. 11-14 are TEM images and an electron beam diffraction pattern illustrating the fabricated h- BN films. 15
FIG. 14, which is a close- up TEM image taken on the surface of the h-BN film. This TEM image also shows a paralleled line shape feature of the film that may be …
FIGS. 15-17 present XPS spectra characterization of a fabricated h-BN film on a nickel substrate.
FIG. 18 presents the FTIR spectra of a fabricated h-BN film on a Si/SiO 2 substrate.
FIG. 19 presents the Raman spectra of the fabricated h-BN film on the Si/SiO 2 substrate.
FIGS. 20 presents the photo-absorption spectra of a fabricated h-BN film on a quartz 20 substrate.
FIG. 21 presents the result of an optical-band-gap analysis on the fabricated h-BN film on a quartz substrate. In the accompanying drawings, like reference …
| — |
Thickness | 5–50 nm | — |
Thickness | 200–1500 nm | — |
Duration | 1800–3600 s | — |
Thickness | 100–500 nm | — |
Thickness | 1–2 cm | — |
Flow Rate | 1–10 sccm | — |
Temperature | ≤ 400 °C | — |
Pressure | ≥ 50 kPa | — |
Thickness | ≥ 1 cm | — |
metal surface
nickel
Ni
silicon
Si
silica surface coating
SiO₂
borazine
B₃N₃H₆
B-trichloroborazine
(ClBNH)3
polymethylmethacrylate
polydimethylsiloxane
polyethylene terephthalate
polyethylene naphthalate
chromium adhesion layer
Cr
FIGS. 9 and 10, respectively, show AFM images of the as-grown h-BN film on 20 the nickel surface and of the h-BN film transferred to a Si/SiO 2 substrate. The …
FIGS. 11-14 are TEM images and an electron beam diffraction pattern illustrating the fabricated h- BN films. 15
FIG. 14, which is a close- up TEM image taken on the surface of the h-BN film. This TEM image also shows a paralleled line shape feature of the film that may be …
FIGS. 15-17 present XPS spectra characterization of a fabricated h-BN film on a nickel substrate.
FIG. 18 presents the FTIR spectra of a fabricated h-BN film on a Si/SiO 2 substrate.
FIG. 19 presents the Raman spectra of the fabricated h-BN film on the Si/SiO 2 substrate.
FIGS. 20 presents the photo-absorption spectra of a fabricated h-BN film on a quartz 20 substrate.
FIG. 21 presents the result of an optical-band-gap analysis on the fabricated h-BN film on a quartz substrate. In the accompanying drawings, like reference …
| — |
Thickness | 5–50 nm | — |
Thickness | 200–1500 nm | — |
Duration | 1800–3600 s | — |
Thickness | 100–500 nm | — |
Thickness | 1–2 cm | — |
Flow Rate | 1–10 sccm | — |
Temperature | ≤ 400 °C | — |
Pressure | ≥ 50 kPa | — |
Thickness | ≥ 1 cm | — |
metal surface
nickel
Ni
silicon
Si
silica surface coating
SiO₂
borazine
B₃N₃H₆
B-trichloroborazine
(ClBNH)3
polymethylmethacrylate
polydimethylsiloxane
polyethylene terephthalate
polyethylene naphthalate
chromium adhesion layer
Cr
FIGS. 9 and 10, respectively, show AFM images of the as-grown h-BN film on 20 the nickel surface and of the h-BN film transferred to a Si/SiO 2 substrate. The …
FIGS. 11-14 are TEM images and an electron beam diffraction pattern illustrating the fabricated h- BN films. 15
FIG. 14, which is a close- up TEM image taken on the surface of the h-BN film. This TEM image also shows a paralleled line shape feature of the film that may be …
FIGS. 15-17 present XPS spectra characterization of a fabricated h-BN film on a nickel substrate.
FIG. 18 presents the FTIR spectra of a fabricated h-BN film on a Si/SiO 2 substrate.
FIG. 19 presents the Raman spectra of the fabricated h-BN film on the Si/SiO 2 substrate.
FIGS. 20 presents the photo-absorption spectra of a fabricated h-BN film on a quartz 20 substrate.
FIG. 21 presents the result of an optical-band-gap analysis on the fabricated h-BN film on a quartz substrate. In the accompanying drawings, like reference …
| — |
Thickness | 5–50 nm | — |
Thickness | 200–1500 nm | — |
Duration | 1800–3600 s | — |
Thickness | 100–500 nm | — |
Thickness | 1–2 cm | — |
Flow Rate | 1–10 sccm | — |
Temperature | ≤ 400 °C | — |
Pressure | ≥ 50 kPa | — |
Thickness | ≥ 1 cm | — |
metal surface
nickel
Ni
silicon
Si
silica surface coating
SiO₂
borazine
B₃N₃H₆
B-trichloroborazine
(ClBNH)3
polymethylmethacrylate
polydimethylsiloxane
polyethylene terephthalate
polyethylene naphthalate
chromium adhesion layer
Cr
FIGS. 9 and 10, respectively, show AFM images of the as-grown h-BN film on 20 the nickel surface and of the h-BN film transferred to a Si/SiO 2 substrate. The …
FIGS. 11-14 are TEM images and an electron beam diffraction pattern illustrating the fabricated h- BN films. 15
FIG. 14, which is a close- up TEM image taken on the surface of the h-BN film. This TEM image also shows a paralleled line shape feature of the film that may be …
FIGS. 15-17 present XPS spectra characterization of a fabricated h-BN film on a nickel substrate.
FIG. 18 presents the FTIR spectra of a fabricated h-BN film on a Si/SiO 2 substrate.
FIG. 19 presents the Raman spectra of the fabricated h-BN film on the Si/SiO 2 substrate.
FIGS. 20 presents the photo-absorption spectra of a fabricated h-BN film on a quartz 20 substrate.
FIG. 21 presents the result of an optical-band-gap analysis on the fabricated h-BN film on a quartz substrate. In the accompanying drawings, like reference …
| — |
Thickness | 5–50 nm | — |
Thickness | 200–1500 nm | — |
Duration | 1800–3600 s | — |
Thickness | 100–500 nm | — |
Thickness | 1–2 cm | — |
Flow Rate | 1–10 sccm | — |
Temperature | ≤ 400 °C | — |
Pressure | ≥ 50 kPa | — |
Thickness | ≥ 1 cm | — |