Patent
US 11,127,509A Graphene-Copper Composite Structure and Manufacturing Method
Horst Jakob Adams
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 11,127,509Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 6 shows a flow diagram illustrating a method for forming a multilayer structure according to an example.
FIG. 2 shows the average electrical conductivities of both single foil, and hot-pressed multilayer samples of: pristine Cu, annealed Cu and Gr/Cu according to …
FIG. 3 is a texture analysis by inverse pole figure (IPF) map and grain size statistics according to an example. [0007]
FIG. 4 is a characterization of Cu/graphene layer/Cu interface by atomic force microscopy according to an example. [0008]
FIG. 5 A shows a band structure and Fig. 5 B shows the density states for the dop ed AB- bila y er gra p hene according to an exam p le. [0009]
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 7 shows in-plane XRD patterns and cross-section optical images of single foils of pristine Cu, annealed Cu, and Gr/Cu according to an example. [0011]
FIG. 8 shows in-plane XRD patterns and cross-section optical images of hot- pressed multilayers of: pristine Cu, annealed Cu, and Gr/Cu according to an …
FIG. 9 is a schematic representation of the electrical conductivity measurement with the four-probe conductivity meter according to an example. [0013]
FIG. 10 shows XPS data for the annealed Cu single foil, and Cu single layer foil with chemically deposited graphene according to an example. [0014]
FIG. 11 shows X-ray diffraction pole figures of the (i ii) plane and the (200) plane of the Gr/Cu/Gr single foil, and the (ii i) plane and the (200) plane Gr-Cu …
FIG. 12B shows electrical conductivity values of the samples of I, II and III. The sample II shows an electrical conductivity higher than that calculated from …
FIG. 13 is a schematic representation of the electrical properties measurement on the interface layers using the contact-current mode of a customized scanning …
FIG. 14 shows a fabrication route for graphene-Cu matrix composites with a bioinspired nano-layered structure according to an example. [0018]
FIG. 15 shows a model system for the Cu/Gr bilayer/Cu composite according to an example. [0019]
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Claims 1-6. Canceled
Canceled
A multilayer composite structure, comprising: a first copper layer, a first graphene layer disposed on one side of the first copper layer, wherein the first graphene la y er is deposited on the first copper la y er by a chemical vapor deposition (CVD) process, a second graphene layer disposed adjacent [[on]] the first graphene layer, and a second copper layer disposed on the second graphene layer, wherein the second graphene la y er is deposited on the second copper la y er by the CVD process; wherein the first graphene la y er and the second graphene la y er are bonded using a hot-pressing process; wherein the first and second copper layers have an enlarged grain structure resulting from the hot-pressing process that is larger than a grain structure of annealed copper; and wherein the multilayer composite structure has an enhanced electrical conductivity that is higher than an electrical conductivity of silver (Ag). Currently amended
The multilayer composite structure according to claim 7, wherein the multilayer composite structure has an electric conductivity of at least 116 % of the International Annealed Copper Standard (I ACS). Previously presented
The multilayer composite structure according to claim 7, wherein at least one of the first graphene layer and the second graphene layer is one of a graphene monolayer and a graphene bilayer. Previously presented
The multilayer composite structure according to claim 7, wherein at least part of the first copper layer and/or the second copper layer has a (111) crystallographic orientation. Previously presented
The multilayer composite structure according to claim 7, wherein a lattice constant of at least one crystalline plane of the first copper layer is within 4 % of a lattice constant of the first graphene layer and/or wherein a lattice constant of at least one crystalline plane of the second copper layer is within 4 % of a lattice constant of the second graphene layer. Previously presented
The multilayer composite structure according to claim 7, wherein the multilayer composite structure is a hot-pressed multilayer composite structure. Previously presented
The multilayer composite structure of claim 7, wherein each of the first and second graphene layer has a respective c-atom lattice that forms a template for re- orientating copper atom grain planes in the first or second copper layers respectively, wherein the enlarged grain structure of the first and second copper layers, along with the first and second graphene layers, following the hot-pressing process, form electron transfer tunnels. New
Claims 8-9. Canceled
Canceled
Claims 11-20. Canceled
Canceled
Layer stacks claimed or described, ordered top of device to substrate.
multilayer graphene-copper composite structure
Materials described outside the worked examples.
copper layer
Cu
first graphene layer
C
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 2 shows the average electrical conductivities of both single foil, and hot-pressed multilayer samples of: pristine Cu, annealed Cu and Gr/Cu according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
electrical conductivity vs IACS — claimed minimum | — | CuCC |
bulk electrical conductivity — described embodiment |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 11,127,509Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 6 shows a flow diagram illustrating a method for forming a multilayer structure according to an example.
FIG. 2 shows the average electrical conductivities of both single foil, and hot-pressed multilayer samples of: pristine Cu, annealed Cu and Gr/Cu according to …
FIG. 3 is a texture analysis by inverse pole figure (IPF) map and grain size statistics according to an example. [0007]
FIG. 4 is a characterization of Cu/graphene layer/Cu interface by atomic force microscopy according to an example. [0008]
FIG. 5 A shows a band structure and Fig. 5 B shows the density states for the dop ed AB- bila y er gra p hene according to an exam p le. [0009]
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 7 shows in-plane XRD patterns and cross-section optical images of single foils of pristine Cu, annealed Cu, and Gr/Cu according to an example. [0011]
FIG. 8 shows in-plane XRD patterns and cross-section optical images of hot- pressed multilayers of: pristine Cu, annealed Cu, and Gr/Cu according to an …
FIG. 9 is a schematic representation of the electrical conductivity measurement with the four-probe conductivity meter according to an example. [0013]
FIG. 10 shows XPS data for the annealed Cu single foil, and Cu single layer foil with chemically deposited graphene according to an example. [0014]
FIG. 11 shows X-ray diffraction pole figures of the (i ii) plane and the (200) plane of the Gr/Cu/Gr single foil, and the (ii i) plane and the (200) plane Gr-Cu …
FIG. 12B shows electrical conductivity values of the samples of I, II and III. The sample II shows an electrical conductivity higher than that calculated from …
FIG. 13 is a schematic representation of the electrical properties measurement on the interface layers using the contact-current mode of a customized scanning …
FIG. 14 shows a fabrication route for graphene-Cu matrix composites with a bioinspired nano-layered structure according to an example. [0018]
FIG. 15 shows a model system for the Cu/Gr bilayer/Cu composite according to an example. [0019]
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Claims 1-6. Canceled
Canceled
A multilayer composite structure, comprising: a first copper layer, a first graphene layer disposed on one side of the first copper layer, wherein the first graphene la y er is deposited on the first copper la y er by a chemical vapor deposition (CVD) process, a second graphene layer disposed adjacent [[on]] the first graphene layer, and a second copper layer disposed on the second graphene layer, wherein the second graphene la y er is deposited on the second copper la y er by the CVD process; wherein the first graphene la y er and the second graphene la y er are bonded using a hot-pressing process; wherein the first and second copper layers have an enlarged grain structure resulting from the hot-pressing process that is larger than a grain structure of annealed copper; and wherein the multilayer composite structure has an enhanced electrical conductivity that is higher than an electrical conductivity of silver (Ag). Currently amended
The multilayer composite structure according to claim 7, wherein the multilayer composite structure has an electric conductivity of at least 116 % of the International Annealed Copper Standard (I ACS). Previously presented
The multilayer composite structure according to claim 7, wherein at least one of the first graphene layer and the second graphene layer is one of a graphene monolayer and a graphene bilayer. Previously presented
The multilayer composite structure according to claim 7, wherein at least part of the first copper layer and/or the second copper layer has a (111) crystallographic orientation. Previously presented
The multilayer composite structure according to claim 7, wherein a lattice constant of at least one crystalline plane of the first copper layer is within 4 % of a lattice constant of the first graphene layer and/or wherein a lattice constant of at least one crystalline plane of the second copper layer is within 4 % of a lattice constant of the second graphene layer. Previously presented
The multilayer composite structure according to claim 7, wherein the multilayer composite structure is a hot-pressed multilayer composite structure. Previously presented
The multilayer composite structure of claim 7, wherein each of the first and second graphene layer has a respective c-atom lattice that forms a template for re- orientating copper atom grain planes in the first or second copper layers respectively, wherein the enlarged grain structure of the first and second copper layers, along with the first and second graphene layers, following the hot-pressing process, form electron transfer tunnels. New
Claims 8-9. Canceled
Canceled
Claims 11-20. Canceled
Canceled
Layer stacks claimed or described, ordered top of device to substrate.
multilayer graphene-copper composite structure
Materials described outside the worked examples.
copper layer
Cu
first graphene layer
C
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 2 shows the average electrical conductivities of both single foil, and hot-pressed multilayer samples of: pristine Cu, annealed Cu and Gr/Cu according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
electrical conductivity vs IACS — claimed minimum | — | CuCC |
bulk electrical conductivity — described embodiment |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 11,127,509Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 6 shows a flow diagram illustrating a method for forming a multilayer structure according to an example.
FIG. 2 shows the average electrical conductivities of both single foil, and hot-pressed multilayer samples of: pristine Cu, annealed Cu and Gr/Cu according to …
FIG. 3 is a texture analysis by inverse pole figure (IPF) map and grain size statistics according to an example. [0007]
FIG. 4 is a characterization of Cu/graphene layer/Cu interface by atomic force microscopy according to an example. [0008]
FIG. 5 A shows a band structure and Fig. 5 B shows the density states for the dop ed AB- bila y er gra p hene according to an exam p le. [0009]
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 7 shows in-plane XRD patterns and cross-section optical images of single foils of pristine Cu, annealed Cu, and Gr/Cu according to an example. [0011]
FIG. 8 shows in-plane XRD patterns and cross-section optical images of hot- pressed multilayers of: pristine Cu, annealed Cu, and Gr/Cu according to an …
FIG. 9 is a schematic representation of the electrical conductivity measurement with the four-probe conductivity meter according to an example. [0013]
FIG. 10 shows XPS data for the annealed Cu single foil, and Cu single layer foil with chemically deposited graphene according to an example. [0014]
FIG. 11 shows X-ray diffraction pole figures of the (i ii) plane and the (200) plane of the Gr/Cu/Gr single foil, and the (ii i) plane and the (200) plane Gr-Cu …
FIG. 12B shows electrical conductivity values of the samples of I, II and III. The sample II shows an electrical conductivity higher than that calculated from …
FIG. 13 is a schematic representation of the electrical properties measurement on the interface layers using the contact-current mode of a customized scanning …
FIG. 14 shows a fabrication route for graphene-Cu matrix composites with a bioinspired nano-layered structure according to an example. [0018]
FIG. 15 shows a model system for the Cu/Gr bilayer/Cu composite according to an example. [0019]
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Claims 1-6. Canceled
Canceled
A multilayer composite structure, comprising: a first copper layer, a first graphene layer disposed on one side of the first copper layer, wherein the first graphene la y er is deposited on the first copper la y er by a chemical vapor deposition (CVD) process, a second graphene layer disposed adjacent [[on]] the first graphene layer, and a second copper layer disposed on the second graphene layer, wherein the second graphene la y er is deposited on the second copper la y er by the CVD process; wherein the first graphene la y er and the second graphene la y er are bonded using a hot-pressing process; wherein the first and second copper layers have an enlarged grain structure resulting from the hot-pressing process that is larger than a grain structure of annealed copper; and wherein the multilayer composite structure has an enhanced electrical conductivity that is higher than an electrical conductivity of silver (Ag). Currently amended
The multilayer composite structure according to claim 7, wherein the multilayer composite structure has an electric conductivity of at least 116 % of the International Annealed Copper Standard (I ACS). Previously presented
The multilayer composite structure according to claim 7, wherein at least one of the first graphene layer and the second graphene layer is one of a graphene monolayer and a graphene bilayer. Previously presented
The multilayer composite structure according to claim 7, wherein at least part of the first copper layer and/or the second copper layer has a (111) crystallographic orientation. Previously presented
The multilayer composite structure according to claim 7, wherein a lattice constant of at least one crystalline plane of the first copper layer is within 4 % of a lattice constant of the first graphene layer and/or wherein a lattice constant of at least one crystalline plane of the second copper layer is within 4 % of a lattice constant of the second graphene layer. Previously presented
The multilayer composite structure according to claim 7, wherein the multilayer composite structure is a hot-pressed multilayer composite structure. Previously presented
The multilayer composite structure of claim 7, wherein each of the first and second graphene layer has a respective c-atom lattice that forms a template for re- orientating copper atom grain planes in the first or second copper layers respectively, wherein the enlarged grain structure of the first and second copper layers, along with the first and second graphene layers, following the hot-pressing process, form electron transfer tunnels. New
Claims 8-9. Canceled
Canceled
Claims 11-20. Canceled
Canceled
Layer stacks claimed or described, ordered top of device to substrate.
multilayer graphene-copper composite structure
Materials described outside the worked examples.
copper layer
Cu
first graphene layer
C
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 2 shows the average electrical conductivities of both single foil, and hot-pressed multilayer samples of: pristine Cu, annealed Cu and Gr/Cu according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
electrical conductivity vs IACS — claimed minimum | — | CuCC |
bulk electrical conductivity — described embodiment |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 11,127,509Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 6 shows a flow diagram illustrating a method for forming a multilayer structure according to an example.
FIG. 2 shows the average electrical conductivities of both single foil, and hot-pressed multilayer samples of: pristine Cu, annealed Cu and Gr/Cu according to …
FIG. 3 is a texture analysis by inverse pole figure (IPF) map and grain size statistics according to an example. [0007]
FIG. 4 is a characterization of Cu/graphene layer/Cu interface by atomic force microscopy according to an example. [0008]
FIG. 5 A shows a band structure and Fig. 5 B shows the density states for the dop ed AB- bila y er gra p hene according to an exam p le. [0009]
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 7 shows in-plane XRD patterns and cross-section optical images of single foils of pristine Cu, annealed Cu, and Gr/Cu according to an example. [0011]
FIG. 8 shows in-plane XRD patterns and cross-section optical images of hot- pressed multilayers of: pristine Cu, annealed Cu, and Gr/Cu according to an …
FIG. 9 is a schematic representation of the electrical conductivity measurement with the four-probe conductivity meter according to an example. [0013]
FIG. 10 shows XPS data for the annealed Cu single foil, and Cu single layer foil with chemically deposited graphene according to an example. [0014]
FIG. 11 shows X-ray diffraction pole figures of the (i ii) plane and the (200) plane of the Gr/Cu/Gr single foil, and the (ii i) plane and the (200) plane Gr-Cu …
FIG. 12B shows electrical conductivity values of the samples of I, II and III. The sample II shows an electrical conductivity higher than that calculated from …
FIG. 13 is a schematic representation of the electrical properties measurement on the interface layers using the contact-current mode of a customized scanning …
FIG. 14 shows a fabrication route for graphene-Cu matrix composites with a bioinspired nano-layered structure according to an example. [0018]
FIG. 15 shows a model system for the Cu/Gr bilayer/Cu composite according to an example. [0019]
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Claims 1-6. Canceled
Canceled
A multilayer composite structure, comprising: a first copper layer, a first graphene layer disposed on one side of the first copper layer, wherein the first graphene la y er is deposited on the first copper la y er by a chemical vapor deposition (CVD) process, a second graphene layer disposed adjacent [[on]] the first graphene layer, and a second copper layer disposed on the second graphene layer, wherein the second graphene la y er is deposited on the second copper la y er by the CVD process; wherein the first graphene la y er and the second graphene la y er are bonded using a hot-pressing process; wherein the first and second copper layers have an enlarged grain structure resulting from the hot-pressing process that is larger than a grain structure of annealed copper; and wherein the multilayer composite structure has an enhanced electrical conductivity that is higher than an electrical conductivity of silver (Ag). Currently amended
The multilayer composite structure according to claim 7, wherein the multilayer composite structure has an electric conductivity of at least 116 % of the International Annealed Copper Standard (I ACS). Previously presented
The multilayer composite structure according to claim 7, wherein at least one of the first graphene layer and the second graphene layer is one of a graphene monolayer and a graphene bilayer. Previously presented
The multilayer composite structure according to claim 7, wherein at least part of the first copper layer and/or the second copper layer has a (111) crystallographic orientation. Previously presented
The multilayer composite structure according to claim 7, wherein a lattice constant of at least one crystalline plane of the first copper layer is within 4 % of a lattice constant of the first graphene layer and/or wherein a lattice constant of at least one crystalline plane of the second copper layer is within 4 % of a lattice constant of the second graphene layer. Previously presented
The multilayer composite structure according to claim 7, wherein the multilayer composite structure is a hot-pressed multilayer composite structure. Previously presented
The multilayer composite structure of claim 7, wherein each of the first and second graphene layer has a respective c-atom lattice that forms a template for re- orientating copper atom grain planes in the first or second copper layers respectively, wherein the enlarged grain structure of the first and second copper layers, along with the first and second graphene layers, following the hot-pressing process, form electron transfer tunnels. New
Claims 8-9. Canceled
Canceled
Claims 11-20. Canceled
Canceled
Layer stacks claimed or described, ordered top of device to substrate.
multilayer graphene-copper composite structure
Materials described outside the worked examples.
copper layer
Cu
first graphene layer
C
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 2 shows the average electrical conductivities of both single foil, and hot-pressed multilayer samples of: pristine Cu, annealed Cu and Gr/Cu according to …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
electrical conductivity vs IACS — claimed minimum | — | CuCC |
bulk electrical conductivity — described embodiment |
Related documents with shared materials, methods, properties, or citations.
methane precursor gas
CH₄
FIG. 4 is a characterization of Cu/graphene layer/Cu interface by atomic force microscopy according to an example. [0008]
FIG. 5 A shows a band structure and Fig. 5 B shows the density states for the dop ed AB- bila y er gra p hene according to an exam p le. [0009]
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 7 shows in-plane XRD patterns and cross-section optical images of single foils of pristine Cu, annealed Cu, and Gr/Cu according to an example. [0011]
FIG. 8 shows in-plane XRD patterns and cross-section optical images of hot- pressed multilayers of: pristine Cu, annealed Cu, and Gr/Cu according to an …
FIG. 9 is a schematic representation of the electrical conductivity measurement with the four-probe conductivity meter according to an example. [0013]
FIG. 10 shows XPS data for the annealed Cu single foil, and Cu single layer foil with chemically deposited graphene according to an example. [0014]
FIG. 12B shows electrical conductivity values of the samples of I, II and III. The sample II shows an electrical conductivity higher than that calculated from …
FIG. 13 is a schematic representation of the electrical properties measurement on the interface layers using the contact-current mode of a customized scanning …
| — |
CuCC |
graphene electron mobility in suspended monolayer | — | C |
Thickness | ≥ 200000 cm | — |
methane precursor gas
CH₄
FIG. 4 is a characterization of Cu/graphene layer/Cu interface by atomic force microscopy according to an example. [0008]
FIG. 5 A shows a band structure and Fig. 5 B shows the density states for the dop ed AB- bila y er gra p hene according to an exam p le. [0009]
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 7 shows in-plane XRD patterns and cross-section optical images of single foils of pristine Cu, annealed Cu, and Gr/Cu according to an example. [0011]
FIG. 8 shows in-plane XRD patterns and cross-section optical images of hot- pressed multilayers of: pristine Cu, annealed Cu, and Gr/Cu according to an …
FIG. 9 is a schematic representation of the electrical conductivity measurement with the four-probe conductivity meter according to an example. [0013]
FIG. 10 shows XPS data for the annealed Cu single foil, and Cu single layer foil with chemically deposited graphene according to an example. [0014]
FIG. 12B shows electrical conductivity values of the samples of I, II and III. The sample II shows an electrical conductivity higher than that calculated from …
FIG. 13 is a schematic representation of the electrical properties measurement on the interface layers using the contact-current mode of a customized scanning …
| — |
CuCC |
graphene electron mobility in suspended monolayer | — | C |
Thickness | ≥ 200000 cm | — |
methane precursor gas
CH₄
FIG. 4 is a characterization of Cu/graphene layer/Cu interface by atomic force microscopy according to an example. [0008]
FIG. 5 A shows a band structure and Fig. 5 B shows the density states for the dop ed AB- bila y er gra p hene according to an exam p le. [0009]
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 7 shows in-plane XRD patterns and cross-section optical images of single foils of pristine Cu, annealed Cu, and Gr/Cu according to an example. [0011]
FIG. 8 shows in-plane XRD patterns and cross-section optical images of hot- pressed multilayers of: pristine Cu, annealed Cu, and Gr/Cu according to an …
FIG. 9 is a schematic representation of the electrical conductivity measurement with the four-probe conductivity meter according to an example. [0013]
FIG. 10 shows XPS data for the annealed Cu single foil, and Cu single layer foil with chemically deposited graphene according to an example. [0014]
FIG. 12B shows electrical conductivity values of the samples of I, II and III. The sample II shows an electrical conductivity higher than that calculated from …
FIG. 13 is a schematic representation of the electrical properties measurement on the interface layers using the contact-current mode of a customized scanning …
| — |
CuCC |
graphene electron mobility in suspended monolayer | — | C |
Thickness | ≥ 200000 cm | — |
methane precursor gas
CH₄
FIG. 4 is a characterization of Cu/graphene layer/Cu interface by atomic force microscopy according to an example. [0008]
FIG. 5 A shows a band structure and Fig. 5 B shows the density states for the dop ed AB- bila y er gra p hene according to an exam p le. [0009]
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 6B shows a SEM image of graphene crystals on Cu foil prepared by chemical vapor deposition; and
FIG. 7 shows in-plane XRD patterns and cross-section optical images of single foils of pristine Cu, annealed Cu, and Gr/Cu according to an example. [0011]
FIG. 8 shows in-plane XRD patterns and cross-section optical images of hot- pressed multilayers of: pristine Cu, annealed Cu, and Gr/Cu according to an …
FIG. 9 is a schematic representation of the electrical conductivity measurement with the four-probe conductivity meter according to an example. [0013]
FIG. 10 shows XPS data for the annealed Cu single foil, and Cu single layer foil with chemically deposited graphene according to an example. [0014]
FIG. 12B shows electrical conductivity values of the samples of I, II and III. The sample II shows an electrical conductivity higher than that calculated from …
FIG. 13 is a schematic representation of the electrical properties measurement on the interface layers using the contact-current mode of a customized scanning …
| — |
CuCC |
graphene electron mobility in suspended monolayer | — | C |
Thickness | ≥ 200000 cm | — |