CO atmosphere (generated in situ from C + SiO2 reaction)
Process details
step 1:Add GaAs polycrystals, crystal seed, and boron oxide to PBN crucible; transfer PBN crucible to quartz crucible; add graphite to quartz cap; connect quartz cap to quartz crucible hermetically
step 2:Load hermetically connected quartz cap and quartz crucible into VGF single crystal furnace with quartz cap and quartz crucible in different temperature zones
step 3:Control temperature zone of quartz crucible at temperature of material melting; control temperature zone of quartz cap at 1000±50°C
step 4:After quartz crucible zone reaches melting temperature, preserve temperature for melting; control quartz cap zone at 1200±50°C and preserve for 4 to 50 h
step 5:After melting completed, lower temperature of quartz cap zone to 1000±50°C and preserve for atmosphere doping and crystal growth; cooling rate 0.1 to 10°C/h; temperature gradient 0.1 to 10°C/cm
step 6:Cooling and discharging
key reaction:SiO₂ + C → CO + SiO (at ≥1200°C); reaction produces CO for carbon atmosphere doping
temperature c max:10
temperature c min:0.1
graphite pretreatment:Removal of moisture by placing graphite in quartz container, sealing, evacuating, and baking at 200±30°C for 2 to 4 h at absolute vacuum degree of (1 to 9×10⁻⁴) to (1 to 9×10⁻²) Pa
equipment pretreatment:PBN crucible, quartz crucible, quartz cap and VGF single crystal furnace pre-treated before use
temperature c lower bound:1200
Materials:GaAsCSiO₂B₂O₃GaAsGaAsPBN crucible
Device Performance Measurement
FIG. 4 is an element content test results graph of semi- insulating gallium arsenide crystal of Example 2 of the present application. 45
CO atmosphere (generated in situ from C + SiO2 reaction)
Process details
step 1:Add GaAs polycrystals, crystal seed, and boron oxide to PBN crucible; transfer PBN crucible to quartz crucible; add graphite to quartz cap; connect quartz cap to quartz crucible hermetically
step 2:Load hermetically connected quartz cap and quartz crucible into VGF single crystal furnace with quartz cap and quartz crucible in different temperature zones
step 3:Control temperature zone of quartz crucible at temperature of material melting; control temperature zone of quartz cap at 1000±50°C
step 4:After quartz crucible zone reaches melting temperature, preserve temperature for melting; control quartz cap zone at 1200±50°C and preserve for 4 to 50 h
step 5:After melting completed, lower temperature of quartz cap zone to 1000±50°C and preserve for atmosphere doping and crystal growth; cooling rate 0.1 to 10°C/h; temperature gradient 0.1 to 10°C/cm
step 6:Cooling and discharging
key reaction:SiO₂ + C → CO + SiO (at ≥1200°C); reaction produces CO for carbon atmosphere doping
temperature c max:10
temperature c min:0.1
graphite pretreatment:Removal of moisture by placing graphite in quartz container, sealing, evacuating, and baking at 200±30°C for 2 to 4 h at absolute vacuum degree of (1 to 9×10⁻⁴) to (1 to 9×10⁻²) Pa
equipment pretreatment:PBN crucible, quartz crucible, quartz cap and VGF single crystal furnace pre-treated before use
temperature c lower bound:1200
Materials:GaAsCSiO₂B₂O₃GaAsGaAsPBN crucible
Device Performance Measurement
FIG. 4 is an element content test results graph of semi- insulating gallium arsenide crystal of Example 2 of the present application. 45
CO atmosphere (generated in situ from C + SiO2 reaction)
Process details
step 1:Add GaAs polycrystals, crystal seed, and boron oxide to PBN crucible; transfer PBN crucible to quartz crucible; add graphite to quartz cap; connect quartz cap to quartz crucible hermetically
step 2:Load hermetically connected quartz cap and quartz crucible into VGF single crystal furnace with quartz cap and quartz crucible in different temperature zones
step 3:Control temperature zone of quartz crucible at temperature of material melting; control temperature zone of quartz cap at 1000±50°C
step 4:After quartz crucible zone reaches melting temperature, preserve temperature for melting; control quartz cap zone at 1200±50°C and preserve for 4 to 50 h
step 5:After melting completed, lower temperature of quartz cap zone to 1000±50°C and preserve for atmosphere doping and crystal growth; cooling rate 0.1 to 10°C/h; temperature gradient 0.1 to 10°C/cm
step 6:Cooling and discharging
key reaction:SiO₂ + C → CO + SiO (at ≥1200°C); reaction produces CO for carbon atmosphere doping
temperature c max:10
temperature c min:0.1
graphite pretreatment:Removal of moisture by placing graphite in quartz container, sealing, evacuating, and baking at 200±30°C for 2 to 4 h at absolute vacuum degree of (1 to 9×10⁻⁴) to (1 to 9×10⁻²) Pa
equipment pretreatment:PBN crucible, quartz crucible, quartz cap and VGF single crystal furnace pre-treated before use
temperature c lower bound:1200
Materials:GaAsCSiO₂B₂O₃GaAsGaAsPBN crucible
Device Performance Measurement
FIG. 4 is an element content test results graph of semi- insulating gallium arsenide crystal of Example 2 of the present application. 45
CO atmosphere (generated in situ from C + SiO2 reaction)
Process details
step 1:Add GaAs polycrystals, crystal seed, and boron oxide to PBN crucible; transfer PBN crucible to quartz crucible; add graphite to quartz cap; connect quartz cap to quartz crucible hermetically
step 2:Load hermetically connected quartz cap and quartz crucible into VGF single crystal furnace with quartz cap and quartz crucible in different temperature zones
step 3:Control temperature zone of quartz crucible at temperature of material melting; control temperature zone of quartz cap at 1000±50°C
step 4:After quartz crucible zone reaches melting temperature, preserve temperature for melting; control quartz cap zone at 1200±50°C and preserve for 4 to 50 h
step 5:After melting completed, lower temperature of quartz cap zone to 1000±50°C and preserve for atmosphere doping and crystal growth; cooling rate 0.1 to 10°C/h; temperature gradient 0.1 to 10°C/cm
step 6:Cooling and discharging
key reaction:SiO₂ + C → CO + SiO (at ≥1200°C); reaction produces CO for carbon atmosphere doping
temperature c max:10
temperature c min:0.1
graphite pretreatment:Removal of moisture by placing graphite in quartz container, sealing, evacuating, and baking at 200±30°C for 2 to 4 h at absolute vacuum degree of (1 to 9×10⁻⁴) to (1 to 9×10⁻²) Pa
equipment pretreatment:PBN crucible, quartz crucible, quartz cap and VGF single crystal furnace pre-treated before use
temperature c lower bound:1200
Materials:GaAsCSiO₂B₂O₃GaAsGaAsPBN crucible
Device Performance Measurement
FIG. 4 is an element content test results graph of semi- insulating gallium arsenide crystal of Example 2 of the present application. 45