Patent
US 9,385,199normally-off gallium nitride-based semiconductor device (Claim 13)
first example normally-off GaN-based semiconductor device 100 (Figure 1)
second example normally-off GaN-based semiconductor device 500 (Figure 5, compressive layer below tensile layer)
aluminum indium gallium nitride
AlInGaN
buffer layer
aluminum indium gallium nitride (20% Al, 20% In)
Al0.20In0.20GaN
silicon substrate
sapphire substrate
silicon carbide substrate
SiC
AlInGaN compressive layer composition (description embodiment) | Al ~20%, In ~20% | Al0.20In0.20GaN |
normally-off gallium nitride-based semiconductor device (Claim 13)
first example normally-off GaN-based semiconductor device 100 (Figure 1)
second example normally-off GaN-based semiconductor device 500 (Figure 5, compressive layer below tensile layer)
aluminum indium gallium nitride
AlInGaN
buffer layer
aluminum indium gallium nitride (20% Al, 20% In)
Al0.20In0.20GaN
silicon substrate
sapphire substrate
silicon carbide substrate
SiC
AlInGaN compressive layer composition (description embodiment) | Al ~20%, In ~20% | Al0.20In0.20GaN |
normally-off gallium nitride-based semiconductor device (Claim 13)
first example normally-off GaN-based semiconductor device 100 (Figure 1)
second example normally-off GaN-based semiconductor device 500 (Figure 5, compressive layer below tensile layer)
aluminum indium gallium nitride
AlInGaN
buffer layer
aluminum indium gallium nitride (20% Al, 20% In)
Al0.20In0.20GaN
silicon substrate
sapphire substrate
silicon carbide substrate
SiC
AlInGaN compressive layer composition (description embodiment) | Al ~20%, In ~20% | Al0.20In0.20GaN |
normally-off gallium nitride-based semiconductor device (Claim 13)
first example normally-off GaN-based semiconductor device 100 (Figure 1)
second example normally-off GaN-based semiconductor device 500 (Figure 5, compressive layer below tensile layer)
aluminum indium gallium nitride
AlInGaN
buffer layer
aluminum indium gallium nitride (20% Al, 20% In)
Al0.20In0.20GaN
silicon substrate
sapphire substrate
silicon carbide substrate
SiC
AlInGaN compressive layer composition (description embodiment) | Al ~20%, In ~20% | Al0.20In0.20GaN |