Patent
US 11,152,763InGaAs
doped particles
| 50–100 nm |
InGaAsP |
Detuning frequency between left and right DFB lasers | 10–15 GHz | — |
Output power deviation between left and right DFB lasers | ≤ 70 % | — |
Thickness | 200–2000 nm | — |
Thickness | 80–200 nm | — |
Thickness | 200–500 nm | — |
Thickness | 50–200 nm | — |
InGaAs
doped particles
| 50–100 nm |
InGaAsP |
Detuning frequency between left and right DFB lasers | 10–15 GHz | — |
Output power deviation between left and right DFB lasers | ≤ 70 % | — |
Thickness | 200–2000 nm | — |
Thickness | 80–200 nm | — |
Thickness | 200–500 nm | — |
Thickness | 50–200 nm | — |
InGaAs
doped particles
| 50–100 nm |
InGaAsP |
Detuning frequency between left and right DFB lasers | 10–15 GHz | — |
Output power deviation between left and right DFB lasers | ≤ 70 % | — |
Thickness | 200–2000 nm | — |
Thickness | 80–200 nm | — |
Thickness | 200–500 nm | — |
Thickness | 50–200 nm | — |
InGaAs
doped particles
| 50–100 nm |
InGaAsP |
Detuning frequency between left and right DFB lasers | 10–15 GHz | — |
Output power deviation between left and right DFB lasers | ≤ 70 % | — |
Thickness | 200–2000 nm | — |
Thickness | 80–200 nm | — |
Thickness | 200–500 nm | — |
Thickness | 50–200 nm | — |