Patent
US 9,679,851second interlayer compound (oxide, nitride, or carbide)
metal chloride
metal fluoride
alkali metal
alkaline-earth metal
interhalogen compound
metal oxide
metal nitride
metal carbide
halogen
polycrystalline graphene
FeCl₃
CuCl₂
AlCl₃
MoCl₅
BF₃
AsF₅
IBr
ICl
Fe₂O₃
CuO
Al₂O₃
MoO₂
Fe₃N
Cu₃N₂
AlN
MoN
Fe₃C
Cu₂C
Al₄C₃
Mo₂C
FIG. 3 is a graph showing Raman shift of the graphene wiring structure of the embodiment; [0007]
FIG. 4 is a graph showing Raman shift of the graphene wiring structure of the embodiment; 10 [0008]
FIG. 4 is a graph showing Raman shift of the graphene wiring structure of the embodiment; 10 [0008]
FIG. 5 is a graph showing Raman shift of the graphene wiring structure of the embodiment; and
FIG. 5 is a graph showing Raman shift of the graphene wiring structure of the embodiment; and
ELECTRONIC DEVICE HAVING GRAPHENE-SEMICONDUCTOR MULTI-JUNCTION AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
second interlayer compound (oxide, nitride, or carbide)
metal chloride
metal fluoride
alkali metal
alkaline-earth metal
interhalogen compound
metal oxide
metal nitride
metal carbide
halogen
polycrystalline graphene
FeCl₃
CuCl₂
AlCl₃
MoCl₅
BF₃
AsF₅
IBr
ICl
Fe₂O₃
CuO
Al₂O₃
MoO₂
Fe₃N
Cu₃N₂
AlN
MoN
Fe₃C
Cu₂C
Al₄C₃
Mo₂C
FIG. 3 is a graph showing Raman shift of the graphene wiring structure of the embodiment; [0007]
FIG. 4 is a graph showing Raman shift of the graphene wiring structure of the embodiment; 10 [0008]
FIG. 4 is a graph showing Raman shift of the graphene wiring structure of the embodiment; 10 [0008]
FIG. 5 is a graph showing Raman shift of the graphene wiring structure of the embodiment; and
FIG. 5 is a graph showing Raman shift of the graphene wiring structure of the embodiment; and
ELECTRONIC DEVICE HAVING GRAPHENE-SEMICONDUCTOR MULTI-JUNCTION AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
second interlayer compound (oxide, nitride, or carbide)
metal chloride
metal fluoride
alkali metal
alkaline-earth metal
interhalogen compound
metal oxide
metal nitride
metal carbide
halogen
polycrystalline graphene
FeCl₃
CuCl₂
AlCl₃
MoCl₅
BF₃
AsF₅
IBr
ICl
Fe₂O₃
CuO
Al₂O₃
MoO₂
Fe₃N
Cu₃N₂
AlN
MoN
Fe₃C
Cu₂C
Al₄C₃
Mo₂C
FIG. 3 is a graph showing Raman shift of the graphene wiring structure of the embodiment; [0007]
FIG. 4 is a graph showing Raman shift of the graphene wiring structure of the embodiment; 10 [0008]
FIG. 4 is a graph showing Raman shift of the graphene wiring structure of the embodiment; 10 [0008]
FIG. 5 is a graph showing Raman shift of the graphene wiring structure of the embodiment; and
FIG. 5 is a graph showing Raman shift of the graphene wiring structure of the embodiment; and
ELECTRONIC DEVICE HAVING GRAPHENE-SEMICONDUCTOR MULTI-JUNCTION AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
second interlayer compound (oxide, nitride, or carbide)
metal chloride
metal fluoride
alkali metal
alkaline-earth metal
interhalogen compound
metal oxide
metal nitride
metal carbide
halogen
polycrystalline graphene
FeCl₃
CuCl₂
AlCl₃
MoCl₅
BF₃
AsF₅
IBr
ICl
Fe₂O₃
CuO
Al₂O₃
MoO₂
Fe₃N
Cu₃N₂
AlN
MoN
Fe₃C
Cu₂C
Al₄C₃
Mo₂C
FIG. 3 is a graph showing Raman shift of the graphene wiring structure of the embodiment; [0007]
FIG. 4 is a graph showing Raman shift of the graphene wiring structure of the embodiment; 10 [0008]
FIG. 4 is a graph showing Raman shift of the graphene wiring structure of the embodiment; 10 [0008]
FIG. 5 is a graph showing Raman shift of the graphene wiring structure of the embodiment; and
FIG. 5 is a graph showing Raman shift of the graphene wiring structure of the embodiment; and
ELECTRONIC DEVICE HAVING GRAPHENE-SEMICONDUCTOR MULTI-JUNCTION AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE