Patent
US 11,342,482unipolar-doped tunneling diode LED/LD (general embodiment)
AlGaN (aluminum gallium nitride)
AlxGa(1-x)N
AlN substrate
AlN
sapphire substrate
Al₂O₃
silicon substrate
Si
InGaN
InxGa(1-x)N
| — |
Thickness | 21–22 nm | — |
Thickness | 240–280 nm | — |
Temperature | 700–900 °C | — |
Voltage | 2–6 V | — |
Thickness | 10–500 nm | — |
Thickness | 2–15 nm | — |
Thickness | 1–50 nm | — |
Thickness | 10–1000 nm | — |
Thickness | 0.5–5 nm | — |
Thickness | 1–8 nm | — |
Thickness | 1–10 nm | — |
Thickness | 1–5 nm | — |
Thickness | 200–300 nm | — |
Thickness | 100–280 nm | — |
Thickness | 10–200 nm | — |
Thickness | 2–8 nm | — |
Thickness | 390–700 nm | — |
Thickness | 350–450 nm | — |
Thickness | 240–360 nm | — |
Thickness | ≥ 370 nm | — |
unipolar-doped tunneling diode LED/LD (general embodiment)
AlGaN (aluminum gallium nitride)
AlxGa(1-x)N
AlN substrate
AlN
sapphire substrate
Al₂O₃
silicon substrate
Si
InGaN
InxGa(1-x)N
| — |
Thickness | 21–22 nm | — |
Thickness | 240–280 nm | — |
Temperature | 700–900 °C | — |
Voltage | 2–6 V | — |
Thickness | 10–500 nm | — |
Thickness | 2–15 nm | — |
Thickness | 1–50 nm | — |
Thickness | 10–1000 nm | — |
Thickness | 0.5–5 nm | — |
Thickness | 1–8 nm | — |
Thickness | 1–10 nm | — |
Thickness | 1–5 nm | — |
Thickness | 200–300 nm | — |
Thickness | 100–280 nm | — |
Thickness | 10–200 nm | — |
Thickness | 2–8 nm | — |
Thickness | 390–700 nm | — |
Thickness | 350–450 nm | — |
Thickness | 240–360 nm | — |
Thickness | ≥ 370 nm | — |
unipolar-doped tunneling diode LED/LD (general embodiment)
AlGaN (aluminum gallium nitride)
AlxGa(1-x)N
AlN substrate
AlN
sapphire substrate
Al₂O₃
silicon substrate
Si
InGaN
InxGa(1-x)N
| — |
Thickness | 21–22 nm | — |
Thickness | 240–280 nm | — |
Temperature | 700–900 °C | — |
Voltage | 2–6 V | — |
Thickness | 10–500 nm | — |
Thickness | 2–15 nm | — |
Thickness | 1–50 nm | — |
Thickness | 10–1000 nm | — |
Thickness | 0.5–5 nm | — |
Thickness | 1–8 nm | — |
Thickness | 1–10 nm | — |
Thickness | 1–5 nm | — |
Thickness | 200–300 nm | — |
Thickness | 100–280 nm | — |
Thickness | 10–200 nm | — |
Thickness | 2–8 nm | — |
Thickness | 390–700 nm | — |
Thickness | 350–450 nm | — |
Thickness | 240–360 nm | — |
Thickness | ≥ 370 nm | — |
unipolar-doped tunneling diode LED/LD (general embodiment)
AlGaN (aluminum gallium nitride)
AlxGa(1-x)N
AlN substrate
AlN
sapphire substrate
Al₂O₃
silicon substrate
Si
InGaN
InxGa(1-x)N
| — |
Thickness | 21–22 nm | — |
Thickness | 240–280 nm | — |
Temperature | 700–900 °C | — |
Voltage | 2–6 V | — |
Thickness | 10–500 nm | — |
Thickness | 2–15 nm | — |
Thickness | 1–50 nm | — |
Thickness | 10–1000 nm | — |
Thickness | 0.5–5 nm | — |
Thickness | 1–8 nm | — |
Thickness | 1–10 nm | — |
Thickness | 1–5 nm | — |
Thickness | 200–300 nm | — |
Thickness | 100–280 nm | — |
Thickness | 10–200 nm | — |
Thickness | 2–8 nm | — |
Thickness | 390–700 nm | — |
Thickness | 350–450 nm | — |
Thickness | 240–360 nm | — |
Thickness | ≥ 370 nm | — |