Patent
US 9,390,828insulating substrate materials
metallic substrate materials
highly-ordered pyrolytic graphite
SiC substrate
SiC
SiO₂
Al₂O₃
Si₃N₄
boron nitride
BN
HfSiO₄
ZrSiO₄
HfO₂
ZrO₂
| — |
Temperature | 850–950 °C | — |
Temperature | 900–1100 °C | — |
Thickness | 4–10 nm | — |
Thickness | ≤ 1.5 nm | — |
Thickness | ≤ 10 nm | — |
Duration | 30–60 minutes | — |
Thickness | ≤ 1 nm | — |
insulating substrate materials
metallic substrate materials
highly-ordered pyrolytic graphite
SiC substrate
SiC
SiO₂
Al₂O₃
Si₃N₄
boron nitride
BN
HfSiO₄
ZrSiO₄
HfO₂
ZrO₂
| — |
Temperature | 850–950 °C | — |
Temperature | 900–1100 °C | — |
Thickness | 4–10 nm | — |
Thickness | ≤ 1.5 nm | — |
Thickness | ≤ 10 nm | — |
Duration | 30–60 minutes | — |
Thickness | ≤ 1 nm | — |
insulating substrate materials
metallic substrate materials
highly-ordered pyrolytic graphite
SiC substrate
SiC
SiO₂
Al₂O₃
Si₃N₄
boron nitride
BN
HfSiO₄
ZrSiO₄
HfO₂
ZrO₂
| — |
Temperature | 850–950 °C | — |
Temperature | 900–1100 °C | — |
Thickness | 4–10 nm | — |
Thickness | ≤ 1.5 nm | — |
Thickness | ≤ 10 nm | — |
Duration | 30–60 minutes | — |
Thickness | ≤ 1 nm | — |
insulating substrate materials
metallic substrate materials
highly-ordered pyrolytic graphite
SiC substrate
SiC
SiO₂
Al₂O₃
Si₃N₄
boron nitride
BN
HfSiO₄
ZrSiO₄
HfO₂
ZrO₂
| — |
Temperature | 850–950 °C | — |
Temperature | 900–1100 °C | — |
Thickness | 4–10 nm | — |
Thickness | ≤ 1.5 nm | — |
Thickness | ≤ 10 nm | — |
Duration | 30–60 minutes | — |
Thickness | ≤ 1 nm | — |