Research paper
Experimental GrowthExperimental CharacterizationEach sample groups how it was prepared, characterized, and measured. Click a card to expand.
3 preparations1 characterization5 properties1 figure
3 preparations1 characterization1 property1 figure
2 preparations1 characterization5 properties1 figure
7 preparations1 characterization8 properties
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Fet Carrier Concentration | sheet electron concentration | 4900000000000cm⁻² | — | |||
| Fet Mobility | electron mobility | 501cm²/Vs | — | |||
| Fet Carrier Concentration | bulk net apparent charge density | 250000000000000000cm⁻³ | — | |||
| Fet Carrier Concentration | integrated sheet ionized impurity density | 4200000000000cm⁻² | — | |||
| Fet Carrier Concentration | net acceptor concentration (NA-ND) | 1420000000000000000cm⁻³ | — | |||
| Fet Carrier Concentration | acceptor concentration in p-NiOx | 819000000000000000cm⁻³ | — | |||
| Dielectric Constant | relative permittivity epsilonr (NiOx) | 11.924 | — | |||
| Dielectric Constant | relative permittivity epsilonr (GaN) | 8.9 | — | |||
| Fet Carrier Concentration | electron density in GaN epitaxial layer | ~1017cm⁻³ | — | |||
| Fet On Off Ratio | rectifying ratio Jon/Joff | 109 | — | |||
| Fet Threshold Voltage | breakdown voltage | 2.8kV | — | |||
| Fet Threshold Voltage | breakdown voltage | 0.94kV | — | |||
| Fet Sheet Resistance | forward on-state current density | 10-30mA/mm | — | |||
| Fet Sheet Resistance | reverse leakage density | 10^-6-10^-4mA/mm | — | |||
| Substrate Thickness | estimated p-NiOx thickness for <15% charge imbalance margin | 21.9-29.6nm | — | |||
| Substrate Thickness | theoretically perfect charge-balance p-NiOx thickness | 25.2nm | — | |||
| Fet Threshold Voltage | fraction of catastrophic breakdown voltage at leakage specification | ~80% | — |
Related documents with shared materials, methods, properties, or citations.
ZrN nucleation layer provides backside ohmic contact to MBE-grown GaN nanowires
Active nitrogen flux measurement during GaN growth based on the transmitted signal detected with a pyrometer
Comparison of reverse current mechanisms in GaN Schottky diodes grown on sapphire versus ammonothermal GaN substrates
Host-atom-driven transformation of a honeycomb oxide into a dodecagonal quasicrystal
Subthermal Mean Transverse Energies Induced by Electron Refraction on the Jump in Mass at the Surface of Multialkali Photocathodes
Spin Hall magnetoresistance in Pt/(Ga,Mn)N devices
Initial demonstration of AlGaAs-GaAsP-β-Ga2O3 n-p-n double heterojunctions
Demonstration of a Field-Effect Three-Terminal Electronic Device with an Electron Mobility Exceeding 40 Million cm2/(Vs)
Synthesis of a semimetallic Weyl ferromagnet with point Fermi surface
Structural and Magnetic Properties of Co-rich bct Co1−xMnx Films
Low-defect quantum dot lasers directly grown on silicon exhibiting low threshold current and high output power at elevated temperatures
3 kV Monolithic Bidirectional GaN HEMT on Sapphire
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
3 preparations1 characterization5 properties1 figure
3 preparations1 characterization1 property1 figure
2 preparations1 characterization5 properties1 figure
7 preparations1 characterization8 properties
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Fet Carrier Concentration | sheet electron concentration | 4900000000000cm⁻² | — | |||
| Fet Mobility | electron mobility | 501cm²/Vs | — | |||
| Fet Carrier Concentration | bulk net apparent charge density | 250000000000000000cm⁻³ | — | |||
| Fet Carrier Concentration | integrated sheet ionized impurity density | 4200000000000cm⁻² | — | |||
| Fet Carrier Concentration | net acceptor concentration (NA-ND) | 1420000000000000000cm⁻³ | — | |||
| Fet Carrier Concentration | acceptor concentration in p-NiOx | 819000000000000000cm⁻³ | — | |||
| Dielectric Constant | relative permittivity epsilonr (NiOx) | 11.924 | — | |||
| Dielectric Constant | relative permittivity epsilonr (GaN) | 8.9 | — | |||
| Fet Carrier Concentration | electron density in GaN epitaxial layer | ~1017cm⁻³ | — | |||
| Fet On Off Ratio | rectifying ratio Jon/Joff | 109 | — | |||
| Fet Threshold Voltage | breakdown voltage | 2.8kV | — | |||
| Fet Threshold Voltage | breakdown voltage | 0.94kV | — | |||
| Fet Sheet Resistance | forward on-state current density | 10-30mA/mm | — | |||
| Fet Sheet Resistance | reverse leakage density | 10^-6-10^-4mA/mm | — | |||
| Substrate Thickness | estimated p-NiOx thickness for <15% charge imbalance margin | 21.9-29.6nm | — | |||
| Substrate Thickness | theoretically perfect charge-balance p-NiOx thickness | 25.2nm | — | |||
| Fet Threshold Voltage | fraction of catastrophic breakdown voltage at leakage specification | ~80% | — |
Related documents with shared materials, methods, properties, or citations.
ZrN nucleation layer provides backside ohmic contact to MBE-grown GaN nanowires
Active nitrogen flux measurement during GaN growth based on the transmitted signal detected with a pyrometer
Comparison of reverse current mechanisms in GaN Schottky diodes grown on sapphire versus ammonothermal GaN substrates
Host-atom-driven transformation of a honeycomb oxide into a dodecagonal quasicrystal
Subthermal Mean Transverse Energies Induced by Electron Refraction on the Jump in Mass at the Surface of Multialkali Photocathodes
Spin Hall magnetoresistance in Pt/(Ga,Mn)N devices
Initial demonstration of AlGaAs-GaAsP-β-Ga2O3 n-p-n double heterojunctions
Demonstration of a Field-Effect Three-Terminal Electronic Device with an Electron Mobility Exceeding 40 Million cm2/(Vs)
Synthesis of a semimetallic Weyl ferromagnet with point Fermi surface
Structural and Magnetic Properties of Co-rich bct Co1−xMnx Films
Low-defect quantum dot lasers directly grown on silicon exhibiting low threshold current and high output power at elevated temperatures
3 kV Monolithic Bidirectional GaN HEMT on Sapphire
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
3 preparations1 characterization5 properties1 figure
3 preparations1 characterization1 property1 figure
2 preparations1 characterization5 properties1 figure
7 preparations1 characterization8 properties
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Fet Carrier Concentration | sheet electron concentration | 4900000000000cm⁻² | — | |||
| Fet Mobility | electron mobility | 501cm²/Vs | — | |||
| Fet Carrier Concentration | bulk net apparent charge density | 250000000000000000cm⁻³ | — | |||
| Fet Carrier Concentration | integrated sheet ionized impurity density | 4200000000000cm⁻² | — | |||
| Fet Carrier Concentration | net acceptor concentration (NA-ND) | 1420000000000000000cm⁻³ | — | |||
| Fet Carrier Concentration | acceptor concentration in p-NiOx | 819000000000000000cm⁻³ | — | |||
| Dielectric Constant | relative permittivity epsilonr (NiOx) | 11.924 | — | |||
| Dielectric Constant | relative permittivity epsilonr (GaN) | 8.9 | — | |||
| Fet Carrier Concentration | electron density in GaN epitaxial layer | ~1017cm⁻³ | — | |||
| Fet On Off Ratio | rectifying ratio Jon/Joff | 109 | — | |||
| Fet Threshold Voltage | breakdown voltage | 2.8kV | — | |||
| Fet Threshold Voltage | breakdown voltage | 0.94kV | — | |||
| Fet Sheet Resistance | forward on-state current density | 10-30mA/mm | — | |||
| Fet Sheet Resistance | reverse leakage density | 10^-6-10^-4mA/mm | — | |||
| Substrate Thickness | estimated p-NiOx thickness for <15% charge imbalance margin | 21.9-29.6nm | — | |||
| Substrate Thickness | theoretically perfect charge-balance p-NiOx thickness | 25.2nm | — | |||
| Fet Threshold Voltage | fraction of catastrophic breakdown voltage at leakage specification | ~80% | — |
Related documents with shared materials, methods, properties, or citations.
ZrN nucleation layer provides backside ohmic contact to MBE-grown GaN nanowires
Active nitrogen flux measurement during GaN growth based on the transmitted signal detected with a pyrometer
Comparison of reverse current mechanisms in GaN Schottky diodes grown on sapphire versus ammonothermal GaN substrates
Host-atom-driven transformation of a honeycomb oxide into a dodecagonal quasicrystal
Subthermal Mean Transverse Energies Induced by Electron Refraction on the Jump in Mass at the Surface of Multialkali Photocathodes
Spin Hall magnetoresistance in Pt/(Ga,Mn)N devices
Initial demonstration of AlGaAs-GaAsP-β-Ga2O3 n-p-n double heterojunctions
Demonstration of a Field-Effect Three-Terminal Electronic Device with an Electron Mobility Exceeding 40 Million cm2/(Vs)
Synthesis of a semimetallic Weyl ferromagnet with point Fermi surface
Structural and Magnetic Properties of Co-rich bct Co1−xMnx Films
Low-defect quantum dot lasers directly grown on silicon exhibiting low threshold current and high output power at elevated temperatures
3 kV Monolithic Bidirectional GaN HEMT on Sapphire
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
3 preparations1 characterization5 properties1 figure
3 preparations1 characterization1 property1 figure
2 preparations1 characterization5 properties1 figure
7 preparations1 characterization8 properties
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Fet Carrier Concentration | sheet electron concentration | 4900000000000cm⁻² | — | |||
| Fet Mobility | electron mobility | 501cm²/Vs | — | |||
| Fet Carrier Concentration | bulk net apparent charge density | 250000000000000000cm⁻³ | — | |||
| Fet Carrier Concentration | integrated sheet ionized impurity density | 4200000000000cm⁻² | — | |||
| Fet Carrier Concentration | net acceptor concentration (NA-ND) | 1420000000000000000cm⁻³ | — | |||
| Fet Carrier Concentration | acceptor concentration in p-NiOx | 819000000000000000cm⁻³ | — | |||
| Dielectric Constant | relative permittivity epsilonr (NiOx) | 11.924 | — | |||
| Dielectric Constant | relative permittivity epsilonr (GaN) | 8.9 | — | |||
| Fet Carrier Concentration | electron density in GaN epitaxial layer | ~1017cm⁻³ | — | |||
| Fet On Off Ratio | rectifying ratio Jon/Joff | 109 | — | |||
| Fet Threshold Voltage | breakdown voltage | 2.8kV | — | |||
| Fet Threshold Voltage | breakdown voltage | 0.94kV | — | |||
| Fet Sheet Resistance | forward on-state current density | 10-30mA/mm | — | |||
| Fet Sheet Resistance | reverse leakage density | 10^-6-10^-4mA/mm | — | |||
| Substrate Thickness | estimated p-NiOx thickness for <15% charge imbalance margin | 21.9-29.6nm | — | |||
| Substrate Thickness | theoretically perfect charge-balance p-NiOx thickness | 25.2nm | — | |||
| Fet Threshold Voltage | fraction of catastrophic breakdown voltage at leakage specification | ~80% | — |
Related documents with shared materials, methods, properties, or citations.
ZrN nucleation layer provides backside ohmic contact to MBE-grown GaN nanowires
Active nitrogen flux measurement during GaN growth based on the transmitted signal detected with a pyrometer
Comparison of reverse current mechanisms in GaN Schottky diodes grown on sapphire versus ammonothermal GaN substrates
Host-atom-driven transformation of a honeycomb oxide into a dodecagonal quasicrystal
Subthermal Mean Transverse Energies Induced by Electron Refraction on the Jump in Mass at the Surface of Multialkali Photocathodes
Spin Hall magnetoresistance in Pt/(Ga,Mn)N devices
Initial demonstration of AlGaAs-GaAsP-β-Ga2O3 n-p-n double heterojunctions
Demonstration of a Field-Effect Three-Terminal Electronic Device with an Electron Mobility Exceeding 40 Million cm2/(Vs)
Synthesis of a semimetallic Weyl ferromagnet with point Fermi surface
Structural and Magnetic Properties of Co-rich bct Co1−xMnx Films
Low-defect quantum dot lasers directly grown on silicon exhibiting low threshold current and high output power at elevated temperatures
3 kV Monolithic Bidirectional GaN HEMT on Sapphire