Patent
US 8,911,931ceramic wafer
silicon wafer
first etchant
second etchant
electrically conductive metallic area
spacing between concentric arcuate portions of graphene nanoribbon |
| 2 microns |
C |
graphene nanoribbon spiral line length | 5280 feet or longer feet | C |
ceramic wafer substrate diameter for >=5280 ft nanoribbon | about four inches or larger inches | ceramic wafer |
METHODS FOR N-TYPE DOPING OF GRAPHENE, AND N-TYPE-DOPED GRAPHENE COMPOSITIONS
ceramic wafer
silicon wafer
first etchant
second etchant
electrically conductive metallic area
spacing between concentric arcuate portions of graphene nanoribbon |
| 2 microns |
C |
graphene nanoribbon spiral line length | 5280 feet or longer feet | C |
ceramic wafer substrate diameter for >=5280 ft nanoribbon | about four inches or larger inches | ceramic wafer |
METHODS FOR N-TYPE DOPING OF GRAPHENE, AND N-TYPE-DOPED GRAPHENE COMPOSITIONS
ceramic wafer
silicon wafer
first etchant
second etchant
electrically conductive metallic area
spacing between concentric arcuate portions of graphene nanoribbon |
| 2 microns |
C |
graphene nanoribbon spiral line length | 5280 feet or longer feet | C |
ceramic wafer substrate diameter for >=5280 ft nanoribbon | about four inches or larger inches | ceramic wafer |
METHODS FOR N-TYPE DOPING OF GRAPHENE, AND N-TYPE-DOPED GRAPHENE COMPOSITIONS
ceramic wafer
silicon wafer
first etchant
second etchant
electrically conductive metallic area
spacing between concentric arcuate portions of graphene nanoribbon |
| 2 microns |
C |
graphene nanoribbon spiral line length | 5280 feet or longer feet | C |
ceramic wafer substrate diameter for >=5280 ft nanoribbon | about four inches or larger inches | ceramic wafer |
METHODS FOR N-TYPE DOPING OF GRAPHENE, AND N-TYPE-DOPED GRAPHENE COMPOSITIONS