SELF-STANDING GaN SUBSTRATE, GaN CRYSTAL, METHOD FOR PRODUCING GaN SINGLE CRYSTAL, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Matter42 Literature
Patent
Atlas literature
Patent
US 12,107,129 B2
SELF-STANDING GaN SUBSTRATE, GaN CRYSTAL, METHOD FOR PRODUCING GaN SINGLE CRYSTAL, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Satoru Nagao, Yusuke Tsukada, Kazunori Kamada, Shuichi Kubo et al.
Mitsubishi Chemical Corporation, Tokyo (JP)·Oct. 1, 2024·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1 shows a GaN crystal whose sizes in an a-axis direction, an c-axis direc- tion, and an m-axis direction are respectively 20 mm, 10 mm, and 3.4 mm. A …
FIG. 2
performance graph
FIG. 2 is a graph showing a result of measurements of an a-axis length on a principal surface of a self-standing M-plane GaN substrate according to an …
FIG. 3
FIG. 3 is a diagram for explaining a longest intersection line between the principal surface and an A-plane in a disk-shaped M-plane GaN substrate.
FIG. 4
FIG. 4 is a perspective view of a disk-shaped M-plane GaN substrate having an defect increasing zone on a prin- 65 cipal surface thereof. The defect increasing …
FIG. 5
FIG. 5. The vapor phase growth apparatus shown in
FIG. 6
FIG. 6 is a schematic diagram exemplifying the primary 45 substrate on which a growth mask is formed. The primary substrate 1001 has a rectangular nitrogen …
FIG. 7
FIG. 7. Crystal growth is carried out in a cylindrical growth vessel 20 that is loaded into a cylindrical autoclave 1. The growth vessel 20 is internally …
FIG. 8
FIG. 8, the secondary GaN crystal 1003 is growing in a wall shape one by one above each opening of the growth mask 1002. The height direction of the walls is a …
FIG. 9
FIG. 9 is formed as a whole. A GaN crystal that grows from an end portion 1001b in an a-axis direction of the primary substrate extends in the [000-1] …
FIG. 10
FIG. 10B. Since the stable faces 2002b and 2002c are both inclined with respect to the [000-1] direction that is a growth direction of the GaN crystal 2002, as …
FIG. 11
apparatus side view
FIG. 11A is a perspective view illustrating a self-standing M-plane GaN substrate whose principal surface is rectan- gular and two sides among four sides …
FIG. 12
FIG. 12A. As shown in
FIG. 13
FIG. 13 shows an example of a profile of a susceptor temperature adoptable in the two-step growth method 5 described above. In this example, a …
FIG. 14
FIG. 14 is a diagram schematically showing an arrange- ment of an X-ray source, a test piece, and a detector in transmission X-ray topography by Lang’s method. …
FIG. 15
performance graph
FIG. 15 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 16
performance graph
FIG. 16 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 17
performance graph
FIG. 17. As shown in
FIG. 18
FIG. 18. This striped pattern does not represent a distortion of the crystal. Instead, 25 since there is periodicity in the a-axis direction, it is under- …
FIG. 19
performance graph
FIG. 19 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 20
performance graph
FIG. 20 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 21
FIG. 21 shows a reflection X-ray topographic image obtained using (203) diffraction of a portion (a portion not including a crystal grown above a boundary …
FIG. 22
performance graph
FIG. 22 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 23
performance graph
FIG. 23 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 24
FIG. 24A. Although the substrate is shown to be cracked in the external view photograph, this was due to inappropriate handling. The substrate had a thickness …
FIG. 25
performance graph
FIG. 25 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 26
performance graph
FIG. 26 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 27
FIGS. 27B-27D. An X-ray topography apparatus (product name: XRT 60 micron) by Rigaku Corporation was used for X-ray topog- raphy. MoKα was used as an X-ray …
FIG. 28
FIG. 28A shows an external view photograph of the fabricated substrate. The size of the principal surface was 35 mm (total length) in an a-axis direction and …
FIG. 29
FIG. 29, measurements were respectively performed on five straight lines A to E arranged at 5 mm intervals in an a-axis direction. Measurement results on the …
FIG. 30
performance graph
FIG. 30 is a graph showing a result of measurements of 15 an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 31
performance graph
FIG. 31 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 20 substrate taken every 250 µm on a straight …
FIG. 32
performance graph
FIG. 32 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 33
performance graph
FIG. 33 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 34
FIG. 35
performance graph
FIG. 35 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 35 substrate taken every 250 µm on a straight …
FIG. 36
performance graph
FIG. 36 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 37
performance graph
FIG. 37 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 38
performance graph
FIG. 38 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 39
performance graph
FIG. 39 is a graph showing a result of measurements of 50 a c-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 40
performance graph
FIG. 40 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (20-21) 55 substrate taken every 250 µm on an …
FIG. 41
performance graph
FIG. 41 is a graph showing a result of measurements of a c-axis length on a principal surface of a GaN (20-21) substrate taken every 250 µm on an intersection …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
2 independent · 19 dependent
1
IndependentGaNself-standing GaN substrate (nonpolar/semipolar)
A self-standing GaN substrate with an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, having a defect increasing zone extending in a direction intersecting an A-plane on the principal surface, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; when a region excluding a portion at a distance of 2 mm or less from a substrate end surface, of the principal surface, is assumed to be an effective region, an X-ray rocking curve full-width at half-maximum of a (300) plane on a longest intersection line formable by the principal surface and the A-plane in the effective region is less than 100 arcsec in a portion excluding the defect increasing zone; and a variation width of the X-ray rocking curve full-width at half-maximum of a (300) plane on the longest intersection line is less than 20 arcsee in a portion excluding the defect increasing zone.
2
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein a spot where the X-ray rocking curve full-width at half-maximum of the (300) plane exhibits a prominently high value is comprised in a portion where the longest intersec-tion line traverses the defect increasing zone.
4
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the size of the projected image in an a-axis direction when the principal surface is vertically projected on an M-plane is 30 mm or more.
6
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate comprises a GaN crystal grown by an HVPE method.
7
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein an absorption coefficient at a wavelength of 450 nm is 2 cm 1 or less.
8
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate contains fluorine.
9
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein alkali metal concentration is lower than 1×1015 cm⁻³.
10
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate contains a stacking fault.
11
Dependent← claim 1GaN
A crystal comprising GaN, processing of which enables fabrication of the self-standing GaN substrate of claim 1.
12
Dependent← claim 1GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 1; and epitaxially growing GaN on the self-standing GaN substrate.
13
Dependent← claim 1GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: growing a first GaN crystal using the self-standing GaN substrate of claim 1 as a seed; and subsequently growing a second GaN crystal using a part of or all of the first GaN crystal as a seed.
15
Dependent← claim 1GaNnitride semiconductorsemiconductor device with nitride epitaxial layers on GaN substrate
A manufacturing method of a semiconductor device, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 1; and forming a device structure by epitaxially growing one or more types of nitride semiconductors on the self-standing GaN substrate.
16
Dependent← claim 1GaNGaN layer-bonded substrate
A manufacturing method of a GaN layer-bonded substrate, the manufacturing method comprising: implanting ions in a vicinity of the principal surface of the self-standing GaN substrate of claim 1; bonding the principal surface side of the self-standing GaN substrate to a hetero-composition substrate; and B₂ forming a GaN layer bonded to the hetero-composition substrate by separating the self-standing GaN substrate at the ion-implanted region as a boundary.
17
Dependent← claim 1GaNGaN layer-bonded substrate
A GaN layer-bonded substrate with a structure in which a GaN layer separated from the self-standing GaN substrate of claim 1 is bonded to a hetero-composition substrate.
3
IndependentGaNself-standing GaN substrate (nonpolar/semipolar)
A self-standing GaN substrate with an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; when a region excluding a portion at a distance of 2 mm or less from a substrate end surface, of the principal surface, is assumed to be an effective region, an X-ray rocking curve full-width at half-maximum of a (300) plane on a longest intersection line formable by the principal surface and an A-plane in the effective region is less than 100 aresec; and a variation width of the X-ray rocking curve full-width at half-maximum of a (300) plane on the longest intersection line is less than 20 arcsec.
18
Dependent← claim 3GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 3; and epitaxially growing GaN on the self-standing GaN substrate.
19
Dependent← claim 3GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: growing a first GaN crystal using the self-standing GaN substrate of claim 3 as a seed; and subsequently growing a second GaN crystal using a part of or all of the first GaN crystal as a seed.
21
Dependent← claim 3GaNnitride semiconductorsemiconductor device with nitride epitaxial layers on GaN substrate
A manufacturing method of a semiconductor device, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 3; and forming a device structure by epitaxially growing one or more types of nitride semiconductors on the self-standing GaN substrate. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
self-standing GaN substrate (nonpolar/semipolar)
GaNsubstrate
semiconductor device with nitride epitaxial layers on GaN substrate
nitride semiconductorepitaxial device layer
GaNsubstrate
GaN layer-bonded substrate
GaNbonded GaN layer
hetero
Materials
Materials described outside the worked examples.
GaN
Substrate Crystal
nitride semiconductor
Epitaxial Layer
Characterization
Measurements and analyses referenced in the patent, with their drawing references.
device performance measurement
Device Performance Measurement
FIG. 2 is a graph showing a result of measurements of an a-axis length on a principal surface of a self-standing M-plane GaN substrate according to an …
SELF-STANDING GaN SUBSTRATE, GaN CRYSTAL, METHOD FOR PRODUCING GaN SINGLE CRYSTAL, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Satoru Nagao, Yusuke Tsukada, Kazunori Kamada, Shuichi Kubo et al.
Mitsubishi Chemical Corporation, Tokyo (JP)·Oct. 1, 2024·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1 shows a GaN crystal whose sizes in an a-axis direction, an c-axis direc- tion, and an m-axis direction are respectively 20 mm, 10 mm, and 3.4 mm. A …
FIG. 2
performance graph
FIG. 2 is a graph showing a result of measurements of an a-axis length on a principal surface of a self-standing M-plane GaN substrate according to an …
FIG. 3
FIG. 3 is a diagram for explaining a longest intersection line between the principal surface and an A-plane in a disk-shaped M-plane GaN substrate.
FIG. 4
FIG. 4 is a perspective view of a disk-shaped M-plane GaN substrate having an defect increasing zone on a prin- 65 cipal surface thereof. The defect increasing …
FIG. 5
FIG. 5. The vapor phase growth apparatus shown in
FIG. 6
FIG. 6 is a schematic diagram exemplifying the primary 45 substrate on which a growth mask is formed. The primary substrate 1001 has a rectangular nitrogen …
FIG. 7
FIG. 7. Crystal growth is carried out in a cylindrical growth vessel 20 that is loaded into a cylindrical autoclave 1. The growth vessel 20 is internally …
FIG. 8
FIG. 8, the secondary GaN crystal 1003 is growing in a wall shape one by one above each opening of the growth mask 1002. The height direction of the walls is a …
FIG. 9
FIG. 9 is formed as a whole. A GaN crystal that grows from an end portion 1001b in an a-axis direction of the primary substrate extends in the [000-1] …
FIG. 10
FIG. 10B. Since the stable faces 2002b and 2002c are both inclined with respect to the [000-1] direction that is a growth direction of the GaN crystal 2002, as …
FIG. 11
apparatus side view
FIG. 11A is a perspective view illustrating a self-standing M-plane GaN substrate whose principal surface is rectan- gular and two sides among four sides …
FIG. 12
FIG. 12A. As shown in
FIG. 13
FIG. 13 shows an example of a profile of a susceptor temperature adoptable in the two-step growth method 5 described above. In this example, a …
FIG. 14
FIG. 14 is a diagram schematically showing an arrange- ment of an X-ray source, a test piece, and a detector in transmission X-ray topography by Lang’s method. …
FIG. 15
performance graph
FIG. 15 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 16
performance graph
FIG. 16 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 17
performance graph
FIG. 17. As shown in
FIG. 18
FIG. 18. This striped pattern does not represent a distortion of the crystal. Instead, 25 since there is periodicity in the a-axis direction, it is under- …
FIG. 19
performance graph
FIG. 19 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 20
performance graph
FIG. 20 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 21
FIG. 21 shows a reflection X-ray topographic image obtained using (203) diffraction of a portion (a portion not including a crystal grown above a boundary …
FIG. 22
performance graph
FIG. 22 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 23
performance graph
FIG. 23 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 24
FIG. 24A. Although the substrate is shown to be cracked in the external view photograph, this was due to inappropriate handling. The substrate had a thickness …
FIG. 25
performance graph
FIG. 25 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 26
performance graph
FIG. 26 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 27
FIGS. 27B-27D. An X-ray topography apparatus (product name: XRT 60 micron) by Rigaku Corporation was used for X-ray topog- raphy. MoKα was used as an X-ray …
FIG. 28
FIG. 28A shows an external view photograph of the fabricated substrate. The size of the principal surface was 35 mm (total length) in an a-axis direction and …
FIG. 29
FIG. 29, measurements were respectively performed on five straight lines A to E arranged at 5 mm intervals in an a-axis direction. Measurement results on the …
FIG. 30
performance graph
FIG. 30 is a graph showing a result of measurements of 15 an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 31
performance graph
FIG. 31 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 20 substrate taken every 250 µm on a straight …
FIG. 32
performance graph
FIG. 32 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 33
performance graph
FIG. 33 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 34
FIG. 35
performance graph
FIG. 35 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 35 substrate taken every 250 µm on a straight …
FIG. 36
performance graph
FIG. 36 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 37
performance graph
FIG. 37 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 38
performance graph
FIG. 38 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 39
performance graph
FIG. 39 is a graph showing a result of measurements of 50 a c-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 40
performance graph
FIG. 40 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (20-21) 55 substrate taken every 250 µm on an …
FIG. 41
performance graph
FIG. 41 is a graph showing a result of measurements of a c-axis length on a principal surface of a GaN (20-21) substrate taken every 250 µm on an intersection …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
2 independent · 19 dependent
1
IndependentGaNself-standing GaN substrate (nonpolar/semipolar)
A self-standing GaN substrate with an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, having a defect increasing zone extending in a direction intersecting an A-plane on the principal surface, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; when a region excluding a portion at a distance of 2 mm or less from a substrate end surface, of the principal surface, is assumed to be an effective region, an X-ray rocking curve full-width at half-maximum of a (300) plane on a longest intersection line formable by the principal surface and the A-plane in the effective region is less than 100 arcsec in a portion excluding the defect increasing zone; and a variation width of the X-ray rocking curve full-width at half-maximum of a (300) plane on the longest intersection line is less than 20 arcsee in a portion excluding the defect increasing zone.
2
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein a spot where the X-ray rocking curve full-width at half-maximum of the (300) plane exhibits a prominently high value is comprised in a portion where the longest intersec-tion line traverses the defect increasing zone.
4
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the size of the projected image in an a-axis direction when the principal surface is vertically projected on an M-plane is 30 mm or more.
6
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate comprises a GaN crystal grown by an HVPE method.
7
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein an absorption coefficient at a wavelength of 450 nm is 2 cm 1 or less.
8
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate contains fluorine.
9
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein alkali metal concentration is lower than 1×1015 cm⁻³.
10
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate contains a stacking fault.
11
Dependent← claim 1GaN
A crystal comprising GaN, processing of which enables fabrication of the self-standing GaN substrate of claim 1.
12
Dependent← claim 1GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 1; and epitaxially growing GaN on the self-standing GaN substrate.
13
Dependent← claim 1GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: growing a first GaN crystal using the self-standing GaN substrate of claim 1 as a seed; and subsequently growing a second GaN crystal using a part of or all of the first GaN crystal as a seed.
15
Dependent← claim 1GaNnitride semiconductorsemiconductor device with nitride epitaxial layers on GaN substrate
A manufacturing method of a semiconductor device, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 1; and forming a device structure by epitaxially growing one or more types of nitride semiconductors on the self-standing GaN substrate.
16
Dependent← claim 1GaNGaN layer-bonded substrate
A manufacturing method of a GaN layer-bonded substrate, the manufacturing method comprising: implanting ions in a vicinity of the principal surface of the self-standing GaN substrate of claim 1; bonding the principal surface side of the self-standing GaN substrate to a hetero-composition substrate; and B₂ forming a GaN layer bonded to the hetero-composition substrate by separating the self-standing GaN substrate at the ion-implanted region as a boundary.
17
Dependent← claim 1GaNGaN layer-bonded substrate
A GaN layer-bonded substrate with a structure in which a GaN layer separated from the self-standing GaN substrate of claim 1 is bonded to a hetero-composition substrate.
3
IndependentGaNself-standing GaN substrate (nonpolar/semipolar)
A self-standing GaN substrate with an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; when a region excluding a portion at a distance of 2 mm or less from a substrate end surface, of the principal surface, is assumed to be an effective region, an X-ray rocking curve full-width at half-maximum of a (300) plane on a longest intersection line formable by the principal surface and an A-plane in the effective region is less than 100 aresec; and a variation width of the X-ray rocking curve full-width at half-maximum of a (300) plane on the longest intersection line is less than 20 arcsec.
18
Dependent← claim 3GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 3; and epitaxially growing GaN on the self-standing GaN substrate.
19
Dependent← claim 3GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: growing a first GaN crystal using the self-standing GaN substrate of claim 3 as a seed; and subsequently growing a second GaN crystal using a part of or all of the first GaN crystal as a seed.
21
Dependent← claim 3GaNnitride semiconductorsemiconductor device with nitride epitaxial layers on GaN substrate
A manufacturing method of a semiconductor device, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 3; and forming a device structure by epitaxially growing one or more types of nitride semiconductors on the self-standing GaN substrate. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
self-standing GaN substrate (nonpolar/semipolar)
GaNsubstrate
semiconductor device with nitride epitaxial layers on GaN substrate
nitride semiconductorepitaxial device layer
GaNsubstrate
GaN layer-bonded substrate
GaNbonded GaN layer
hetero
Materials
Materials described outside the worked examples.
GaN
Substrate Crystal
nitride semiconductor
Epitaxial Layer
Characterization
Measurements and analyses referenced in the patent, with their drawing references.
device performance measurement
Device Performance Measurement
FIG. 2 is a graph showing a result of measurements of an a-axis length on a principal surface of a self-standing M-plane GaN substrate according to an …
SELF-STANDING GaN SUBSTRATE, GaN CRYSTAL, METHOD FOR PRODUCING GaN SINGLE CRYSTAL, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Satoru Nagao, Yusuke Tsukada, Kazunori Kamada, Shuichi Kubo et al.
Mitsubishi Chemical Corporation, Tokyo (JP)·Oct. 1, 2024·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1 shows a GaN crystal whose sizes in an a-axis direction, an c-axis direc- tion, and an m-axis direction are respectively 20 mm, 10 mm, and 3.4 mm. A …
FIG. 2
performance graph
FIG. 2 is a graph showing a result of measurements of an a-axis length on a principal surface of a self-standing M-plane GaN substrate according to an …
FIG. 3
FIG. 3 is a diagram for explaining a longest intersection line between the principal surface and an A-plane in a disk-shaped M-plane GaN substrate.
FIG. 4
FIG. 4 is a perspective view of a disk-shaped M-plane GaN substrate having an defect increasing zone on a prin- 65 cipal surface thereof. The defect increasing …
FIG. 5
FIG. 5. The vapor phase growth apparatus shown in
FIG. 6
FIG. 6 is a schematic diagram exemplifying the primary 45 substrate on which a growth mask is formed. The primary substrate 1001 has a rectangular nitrogen …
FIG. 7
FIG. 7. Crystal growth is carried out in a cylindrical growth vessel 20 that is loaded into a cylindrical autoclave 1. The growth vessel 20 is internally …
FIG. 8
FIG. 8, the secondary GaN crystal 1003 is growing in a wall shape one by one above each opening of the growth mask 1002. The height direction of the walls is a …
FIG. 9
FIG. 9 is formed as a whole. A GaN crystal that grows from an end portion 1001b in an a-axis direction of the primary substrate extends in the [000-1] …
FIG. 10
FIG. 10B. Since the stable faces 2002b and 2002c are both inclined with respect to the [000-1] direction that is a growth direction of the GaN crystal 2002, as …
FIG. 11
apparatus side view
FIG. 11A is a perspective view illustrating a self-standing M-plane GaN substrate whose principal surface is rectan- gular and two sides among four sides …
FIG. 12
FIG. 12A. As shown in
FIG. 13
FIG. 13 shows an example of a profile of a susceptor temperature adoptable in the two-step growth method 5 described above. In this example, a …
FIG. 14
FIG. 14 is a diagram schematically showing an arrange- ment of an X-ray source, a test piece, and a detector in transmission X-ray topography by Lang’s method. …
FIG. 15
performance graph
FIG. 15 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 16
performance graph
FIG. 16 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 17
performance graph
FIG. 17. As shown in
FIG. 18
FIG. 18. This striped pattern does not represent a distortion of the crystal. Instead, 25 since there is periodicity in the a-axis direction, it is under- …
FIG. 19
performance graph
FIG. 19 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 20
performance graph
FIG. 20 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 21
FIG. 21 shows a reflection X-ray topographic image obtained using (203) diffraction of a portion (a portion not including a crystal grown above a boundary …
FIG. 22
performance graph
FIG. 22 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 23
performance graph
FIG. 23 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 24
FIG. 24A. Although the substrate is shown to be cracked in the external view photograph, this was due to inappropriate handling. The substrate had a thickness …
FIG. 25
performance graph
FIG. 25 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 26
performance graph
FIG. 26 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 27
FIGS. 27B-27D. An X-ray topography apparatus (product name: XRT 60 micron) by Rigaku Corporation was used for X-ray topog- raphy. MoKα was used as an X-ray …
FIG. 28
FIG. 28A shows an external view photograph of the fabricated substrate. The size of the principal surface was 35 mm (total length) in an a-axis direction and …
FIG. 29
FIG. 29, measurements were respectively performed on five straight lines A to E arranged at 5 mm intervals in an a-axis direction. Measurement results on the …
FIG. 30
performance graph
FIG. 30 is a graph showing a result of measurements of 15 an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 31
performance graph
FIG. 31 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 20 substrate taken every 250 µm on a straight …
FIG. 32
performance graph
FIG. 32 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 33
performance graph
FIG. 33 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 34
FIG. 35
performance graph
FIG. 35 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 35 substrate taken every 250 µm on a straight …
FIG. 36
performance graph
FIG. 36 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 37
performance graph
FIG. 37 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 38
performance graph
FIG. 38 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 39
performance graph
FIG. 39 is a graph showing a result of measurements of 50 a c-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 40
performance graph
FIG. 40 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (20-21) 55 substrate taken every 250 µm on an …
FIG. 41
performance graph
FIG. 41 is a graph showing a result of measurements of a c-axis length on a principal surface of a GaN (20-21) substrate taken every 250 µm on an intersection …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
2 independent · 19 dependent
1
IndependentGaNself-standing GaN substrate (nonpolar/semipolar)
A self-standing GaN substrate with an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, having a defect increasing zone extending in a direction intersecting an A-plane on the principal surface, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; when a region excluding a portion at a distance of 2 mm or less from a substrate end surface, of the principal surface, is assumed to be an effective region, an X-ray rocking curve full-width at half-maximum of a (300) plane on a longest intersection line formable by the principal surface and the A-plane in the effective region is less than 100 arcsec in a portion excluding the defect increasing zone; and a variation width of the X-ray rocking curve full-width at half-maximum of a (300) plane on the longest intersection line is less than 20 arcsee in a portion excluding the defect increasing zone.
2
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein a spot where the X-ray rocking curve full-width at half-maximum of the (300) plane exhibits a prominently high value is comprised in a portion where the longest intersec-tion line traverses the defect increasing zone.
4
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the size of the projected image in an a-axis direction when the principal surface is vertically projected on an M-plane is 30 mm or more.
6
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate comprises a GaN crystal grown by an HVPE method.
7
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein an absorption coefficient at a wavelength of 450 nm is 2 cm 1 or less.
8
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate contains fluorine.
9
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein alkali metal concentration is lower than 1×1015 cm⁻³.
10
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate contains a stacking fault.
11
Dependent← claim 1GaN
A crystal comprising GaN, processing of which enables fabrication of the self-standing GaN substrate of claim 1.
12
Dependent← claim 1GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 1; and epitaxially growing GaN on the self-standing GaN substrate.
13
Dependent← claim 1GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: growing a first GaN crystal using the self-standing GaN substrate of claim 1 as a seed; and subsequently growing a second GaN crystal using a part of or all of the first GaN crystal as a seed.
15
Dependent← claim 1GaNnitride semiconductorsemiconductor device with nitride epitaxial layers on GaN substrate
A manufacturing method of a semiconductor device, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 1; and forming a device structure by epitaxially growing one or more types of nitride semiconductors on the self-standing GaN substrate.
16
Dependent← claim 1GaNGaN layer-bonded substrate
A manufacturing method of a GaN layer-bonded substrate, the manufacturing method comprising: implanting ions in a vicinity of the principal surface of the self-standing GaN substrate of claim 1; bonding the principal surface side of the self-standing GaN substrate to a hetero-composition substrate; and B₂ forming a GaN layer bonded to the hetero-composition substrate by separating the self-standing GaN substrate at the ion-implanted region as a boundary.
17
Dependent← claim 1GaNGaN layer-bonded substrate
A GaN layer-bonded substrate with a structure in which a GaN layer separated from the self-standing GaN substrate of claim 1 is bonded to a hetero-composition substrate.
3
IndependentGaNself-standing GaN substrate (nonpolar/semipolar)
A self-standing GaN substrate with an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; when a region excluding a portion at a distance of 2 mm or less from a substrate end surface, of the principal surface, is assumed to be an effective region, an X-ray rocking curve full-width at half-maximum of a (300) plane on a longest intersection line formable by the principal surface and an A-plane in the effective region is less than 100 aresec; and a variation width of the X-ray rocking curve full-width at half-maximum of a (300) plane on the longest intersection line is less than 20 arcsec.
18
Dependent← claim 3GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 3; and epitaxially growing GaN on the self-standing GaN substrate.
19
Dependent← claim 3GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: growing a first GaN crystal using the self-standing GaN substrate of claim 3 as a seed; and subsequently growing a second GaN crystal using a part of or all of the first GaN crystal as a seed.
21
Dependent← claim 3GaNnitride semiconductorsemiconductor device with nitride epitaxial layers on GaN substrate
A manufacturing method of a semiconductor device, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 3; and forming a device structure by epitaxially growing one or more types of nitride semiconductors on the self-standing GaN substrate. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
self-standing GaN substrate (nonpolar/semipolar)
GaNsubstrate
semiconductor device with nitride epitaxial layers on GaN substrate
nitride semiconductorepitaxial device layer
GaNsubstrate
GaN layer-bonded substrate
GaNbonded GaN layer
hetero
Materials
Materials described outside the worked examples.
GaN
Substrate Crystal
nitride semiconductor
Epitaxial Layer
Characterization
Measurements and analyses referenced in the patent, with their drawing references.
device performance measurement
Device Performance Measurement
FIG. 2 is a graph showing a result of measurements of an a-axis length on a principal surface of a self-standing M-plane GaN substrate according to an …
SELF-STANDING GaN SUBSTRATE, GaN CRYSTAL, METHOD FOR PRODUCING GaN SINGLE CRYSTAL, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Satoru Nagao, Yusuke Tsukada, Kazunori Kamada, Shuichi Kubo et al.
Mitsubishi Chemical Corporation, Tokyo (JP)·Oct. 1, 2024·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1 shows a GaN crystal whose sizes in an a-axis direction, an c-axis direc- tion, and an m-axis direction are respectively 20 mm, 10 mm, and 3.4 mm. A …
FIG. 2
performance graph
FIG. 2 is a graph showing a result of measurements of an a-axis length on a principal surface of a self-standing M-plane GaN substrate according to an …
FIG. 3
FIG. 3 is a diagram for explaining a longest intersection line between the principal surface and an A-plane in a disk-shaped M-plane GaN substrate.
FIG. 4
FIG. 4 is a perspective view of a disk-shaped M-plane GaN substrate having an defect increasing zone on a prin- 65 cipal surface thereof. The defect increasing …
FIG. 5
FIG. 5. The vapor phase growth apparatus shown in
FIG. 6
FIG. 6 is a schematic diagram exemplifying the primary 45 substrate on which a growth mask is formed. The primary substrate 1001 has a rectangular nitrogen …
FIG. 7
FIG. 7. Crystal growth is carried out in a cylindrical growth vessel 20 that is loaded into a cylindrical autoclave 1. The growth vessel 20 is internally …
FIG. 8
FIG. 8, the secondary GaN crystal 1003 is growing in a wall shape one by one above each opening of the growth mask 1002. The height direction of the walls is a …
FIG. 9
FIG. 9 is formed as a whole. A GaN crystal that grows from an end portion 1001b in an a-axis direction of the primary substrate extends in the [000-1] …
FIG. 10
FIG. 10B. Since the stable faces 2002b and 2002c are both inclined with respect to the [000-1] direction that is a growth direction of the GaN crystal 2002, as …
FIG. 11
apparatus side view
FIG. 11A is a perspective view illustrating a self-standing M-plane GaN substrate whose principal surface is rectan- gular and two sides among four sides …
FIG. 12
FIG. 12A. As shown in
FIG. 13
FIG. 13 shows an example of a profile of a susceptor temperature adoptable in the two-step growth method 5 described above. In this example, a …
FIG. 14
FIG. 14 is a diagram schematically showing an arrange- ment of an X-ray source, a test piece, and a detector in transmission X-ray topography by Lang’s method. …
FIG. 15
performance graph
FIG. 15 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 16
performance graph
FIG. 16 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 17
performance graph
FIG. 17. As shown in
FIG. 18
FIG. 18. This striped pattern does not represent a distortion of the crystal. Instead, 25 since there is periodicity in the a-axis direction, it is under- …
FIG. 19
performance graph
FIG. 19 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 20
performance graph
FIG. 20 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 21
FIG. 21 shows a reflection X-ray topographic image obtained using (203) diffraction of a portion (a portion not including a crystal grown above a boundary …
FIG. 22
performance graph
FIG. 22 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 23
performance graph
FIG. 23 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 24
FIG. 24A. Although the substrate is shown to be cracked in the external view photograph, this was due to inappropriate handling. The substrate had a thickness …
FIG. 25
performance graph
FIG. 25 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 26
performance graph
FIG. 26 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 27
FIGS. 27B-27D. An X-ray topography apparatus (product name: XRT 60 micron) by Rigaku Corporation was used for X-ray topog- raphy. MoKα was used as an X-ray …
FIG. 28
FIG. 28A shows an external view photograph of the fabricated substrate. The size of the principal surface was 35 mm (total length) in an a-axis direction and …
FIG. 29
FIG. 29, measurements were respectively performed on five straight lines A to E arranged at 5 mm intervals in an a-axis direction. Measurement results on the …
FIG. 30
performance graph
FIG. 30 is a graph showing a result of measurements of 15 an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 31
performance graph
FIG. 31 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 20 substrate taken every 250 µm on a straight …
FIG. 32
performance graph
FIG. 32 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 33
performance graph
FIG. 33 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 34
FIG. 35
performance graph
FIG. 35 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 35 substrate taken every 250 µm on a straight …
FIG. 36
performance graph
FIG. 36 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 37
performance graph
FIG. 37 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 38
performance graph
FIG. 38 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 39
performance graph
FIG. 39 is a graph showing a result of measurements of 50 a c-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 40
performance graph
FIG. 40 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (20-21) 55 substrate taken every 250 µm on an …
FIG. 41
performance graph
FIG. 41 is a graph showing a result of measurements of a c-axis length on a principal surface of a GaN (20-21) substrate taken every 250 µm on an intersection …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
2 independent · 19 dependent
1
IndependentGaNself-standing GaN substrate (nonpolar/semipolar)
A self-standing GaN substrate with an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, having a defect increasing zone extending in a direction intersecting an A-plane on the principal surface, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; when a region excluding a portion at a distance of 2 mm or less from a substrate end surface, of the principal surface, is assumed to be an effective region, an X-ray rocking curve full-width at half-maximum of a (300) plane on a longest intersection line formable by the principal surface and the A-plane in the effective region is less than 100 arcsec in a portion excluding the defect increasing zone; and a variation width of the X-ray rocking curve full-width at half-maximum of a (300) plane on the longest intersection line is less than 20 arcsee in a portion excluding the defect increasing zone.
2
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein a spot where the X-ray rocking curve full-width at half-maximum of the (300) plane exhibits a prominently high value is comprised in a portion where the longest intersec-tion line traverses the defect increasing zone.
4
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the size of the projected image in an a-axis direction when the principal surface is vertically projected on an M-plane is 30 mm or more.
6
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate comprises a GaN crystal grown by an HVPE method.
7
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein an absorption coefficient at a wavelength of 450 nm is 2 cm 1 or less.
8
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate contains fluorine.
9
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein alkali metal concentration is lower than 1×1015 cm⁻³.
10
Dependent← claim 1GaNself-standing GaN substrate (nonpolar/semipolar)
The self-standing GaN substrate of claim 1, wherein the self-standing GaN substrate contains a stacking fault.
11
Dependent← claim 1GaN
A crystal comprising GaN, processing of which enables fabrication of the self-standing GaN substrate of claim 1.
12
Dependent← claim 1GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 1; and epitaxially growing GaN on the self-standing GaN substrate.
13
Dependent← claim 1GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: growing a first GaN crystal using the self-standing GaN substrate of claim 1 as a seed; and subsequently growing a second GaN crystal using a part of or all of the first GaN crystal as a seed.
15
Dependent← claim 1GaNnitride semiconductorsemiconductor device with nitride epitaxial layers on GaN substrate
A manufacturing method of a semiconductor device, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 1; and forming a device structure by epitaxially growing one or more types of nitride semiconductors on the self-standing GaN substrate.
16
Dependent← claim 1GaNGaN layer-bonded substrate
A manufacturing method of a GaN layer-bonded substrate, the manufacturing method comprising: implanting ions in a vicinity of the principal surface of the self-standing GaN substrate of claim 1; bonding the principal surface side of the self-standing GaN substrate to a hetero-composition substrate; and B₂ forming a GaN layer bonded to the hetero-composition substrate by separating the self-standing GaN substrate at the ion-implanted region as a boundary.
17
Dependent← claim 1GaNGaN layer-bonded substrate
A GaN layer-bonded substrate with a structure in which a GaN layer separated from the self-standing GaN substrate of claim 1 is bonded to a hetero-composition substrate.
3
IndependentGaNself-standing GaN substrate (nonpolar/semipolar)
A self-standing GaN substrate with an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; when a region excluding a portion at a distance of 2 mm or less from a substrate end surface, of the principal surface, is assumed to be an effective region, an X-ray rocking curve full-width at half-maximum of a (300) plane on a longest intersection line formable by the principal surface and an A-plane in the effective region is less than 100 aresec; and a variation width of the X-ray rocking curve full-width at half-maximum of a (300) plane on the longest intersection line is less than 20 arcsec.
18
Dependent← claim 3GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 3; and epitaxially growing GaN on the self-standing GaN substrate.
19
Dependent← claim 3GaN
A manufacturing method of a GaN single crystal, the manufacturing method comprising: growing a first GaN crystal using the self-standing GaN substrate of claim 3 as a seed; and subsequently growing a second GaN crystal using a part of or all of the first GaN crystal as a seed.
21
Dependent← claim 3GaNnitride semiconductorsemiconductor device with nitride epitaxial layers on GaN substrate
A manufacturing method of a semiconductor device, the manufacturing method comprising: preparing the self-standing GaN substrate of claim 3; and forming a device structure by epitaxially growing one or more types of nitride semiconductors on the self-standing GaN substrate. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
self-standing GaN substrate (nonpolar/semipolar)
GaNsubstrate
semiconductor device with nitride epitaxial layers on GaN substrate
nitride semiconductorepitaxial device layer
GaNsubstrate
GaN layer-bonded substrate
GaNbonded GaN layer
hetero
Materials
Materials described outside the worked examples.
GaN
Substrate Crystal
nitride semiconductor
Epitaxial Layer
Characterization
Measurements and analyses referenced in the patent, with their drawing references.
device performance measurement
Device Performance Measurement
FIG. 2 is a graph showing a result of measurements of an a-axis length on a principal surface of a self-standing M-plane GaN substrate according to an …
FIG. 8, the secondary GaN crystal 1003 is growing in a wall shape one by one above each opening of the growth mask 1002. The height direction of the walls is a …
FIG. 15 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 16 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 19 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 20 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 22 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 23 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 24A. Although the substrate is shown to be cracked in the external view photograph, this was due to inappropriate handling. The substrate had a thickness …
FIG. 25 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 26 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 30 is a graph showing a result of measurements of 15 an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 31 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 20 substrate taken every 250 µm on a straight …
FIG. 32 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 33 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 35 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 35 substrate taken every 250 µm on a straight …
FIG. 36 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 37 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 39 is a graph showing a result of measurements of 50 a c-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 40 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (20-21) 55 substrate taken every 250 µm on an …
FIG. 41 is a graph showing a result of measurements of a c-axis length on a principal surface of a GaN (20-21) substrate taken every 250 µm on an intersection …
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US 2013/0284160 A12013/0284160 A1 10/2013 Uchida et al.
US 2013/0337632 A12013/0337632 A1 12/2013 Uematsu et al.
US 2014/0035103 A12014/0035103 A1 2/2014 Matsumoto et al.
US 2014/0175616 A12014/0175616 A1 6/2014 Mizuhara et al.
US 2014/0369920 A12014/0369920 A1 12/2014 Uematsu et al.
CN 102666945 ACN 102666945 A 9/2012
CN 103348044 ACN 103348044 A 10/2013
CN 103456593 ACN 103456593 A 12/2013
TW 200815630 ATW 200815630 A 4/2008
TW 201125163 ATW 201125163 A 7/2011
Cited non-patent literature · 3
English Translation of International Search Raport issued Oct. 28, 2014 in PCT/JP2014/070919, filed Aug. 7, 2014.
Self-Separated Freestanding GaN Using a N H 4 Cl Interlayer. English Translation of International Search Report issued Mar. 3, 2015 in PCT/JP2014/082859, filed Dec. 11, 2014. Hyun-Jae lee et al. “Self-Separated Freestanding GaN Using a N H 4 Cl Interlayer”, Applied Physics Letters, vol. 91, 192108, 2007, 4 pages. Po Shan Hsu et al. “Stress Relaxation and Critical Thickness for Misfit Dislocation Formation in (100) and (30) InGaN/GaN Heteroepitaxy”, Applied Physics Letters, vol. 100, 171917, 2012, 5 pages. English translation of International Preliminary Report on Patent- ability and Written Opinion issued Feb. 18, 2016 in PCT/JP2014/070919. Notification of Transmittal of Translation of the International Pre- liminary Report on Patentability filed in PCT/JP2014/082859, dated Jul. 28, 2016, and Written Opinion of the International Searching Authority. Ofice Action mailed Dec. 12, 2017 in related U.S. Appl. No. 15/210,150. Extended European Search Report issued Jun. 14, 2016 in Patent Application No. 14834101.9.
Review of Polarity Determination and Control of GaN. Chinese Office Action issued on Aug. 1, 2018 in Patent Application No. 201480073300.0 (with English translation), 25 pages. Office Action issued Jul. 4, 2017 in Japanese Patent Application No. 2014-168566 (with unedited computer generated English transla- tion). Combined Chinese Office Action and Search Report issued Dec. 4, 2017 in Chinese Patent Application No. 201480073300.0 (with unedited computer generated English translation), 29 pages. Combined Office Action and Search Report issued Dec. 14, 2017 in Taiwanese Patent Application No. 103127186 (with English lan- guage translation), 7 pages. Extended European Search Report issued Mar. 29, 2018 in Patent Application No. 17194202.2, 8 pages. Combined Office Action and Search Report issued Apr. 12, 2018 in Taiwanese Patent Application No. 103143621 (with English lan- guage translation of Office Action and English translation of cat- egories of cited documents), 10 pages. Sumiya, et al., “Review of Polarity Determination and Control of GaN”, MRS Internet J. Nitride Semicond. Res. 9, 1 (2004) The Material sResearch Society (Year, 2004). Office Action issued Oct. 16, 2018 in Japanese Patent Application No. 2015-557739, 6 pages (with unedited computer generated English translation). Japanese Office Action issued Dec. 18, 2018 in Japanese Patent Application No. 2018-056344 (with unedited computer generated English translation), 8 pages. Office Action Issued Mar. 5, 2019, in Taiwanese Patent Application No. 107130360 filed Aug. 7, 2014 (with English translation). Pimputkar, et al., Surface Morphology study of basic ammonothermal GaN grown on non-polar GaN seed crystals of varying surface orientations from m-plane to a-plane, Journal of Crystal Growth, 368, pp. 67-71 (2013); Jan. 23, 2013 (year:2013). Bliss, et al., Ammonothermal GaN: Morphology and properties, Journal of Crystal Growth 312, pp. 1069-1073 (2010); Dec. 11, 2009 (Year: 2009). Office Action mailed Oct. 2, 2019 in U.S. Appl. No. 16/034,953, 16 pages. European Office Action Issued on Jun. 26, 2020 in Patent Applica- tion No. 17 194 202.2, 8 pages. Combined Taiwanese Office Action and Search Report issued Sep. 1, 2020 in Patent Application No. 108140117 (with English lan- guage translation), 14 pages. Taiwanese Office Action issued Jun. 22, 2021 in Taiwanese Patent Application No. 108140117 (with unedited computer generated English translation), 6 pages. European Search Report issued Sep. 6, 2021 in European Patent Application No. 17 194 202.2, 5 pages.
substrate GaNcharacterization device performancematerial GaN
FIG. 8, the secondary GaN crystal 1003 is growing in a wall shape one by one above each opening of the growth mask 1002. The height direction of the walls is a …
FIG. 15 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 16 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 19 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 20 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 22 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 23 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 24A. Although the substrate is shown to be cracked in the external view photograph, this was due to inappropriate handling. The substrate had a thickness …
FIG. 25 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 26 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 30 is a graph showing a result of measurements of 15 an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 31 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 20 substrate taken every 250 µm on a straight …
FIG. 32 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 33 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 35 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 35 substrate taken every 250 µm on a straight …
FIG. 36 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 37 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 39 is a graph showing a result of measurements of 50 a c-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 40 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (20-21) 55 substrate taken every 250 µm on an …
FIG. 41 is a graph showing a result of measurements of a c-axis length on a principal surface of a GaN (20-21) substrate taken every 250 µm on an intersection …
US 11,031,475 B211,031,475 B2 * 6/2021 Nagao..................... C30B 25/20examiner
US 11,038,024 B211,038,024 B2 6/2021 Nagao
US 11,664,428 B211,664,428 B2 * 5/2023 Nagao................. H01L 29/2003examiner
US 2004/0187766 A12004/0187766 A1 9/2004 Letertre
US 2004/0244680 A12004/0244680 A1 12/2004 Dwilinski et al.
US 2004/0245535 A12004/0245535 A1 12/2004 D’Evelyn et al.
US 2005/0087124 A12005/0087124 A1 4/2005 Dwilinski et al.
US 2005/0214992 A12005/0214992 A1 9/2005 Chakraborty et al.
US 2007/0261633 A12007/0261633 A1 11/2007 Tanaka
US 2007/0290228 A12007/0290228 A1 12/2007 Yoshida
US 2008/0081015 A12008/0081015 A1 4/2008 Sarayama et al.
US 2009/0236694 A12009/0236694 A1 9/2009 Mizuhara et al.
US 2010/0104495 A12010/0104495 A1 4/2010 Kawabata et al.
US 2010/0233866 A12010/0233866 A1 9/2010 Akiyama et al.
US 2011/0057197 A12011/0057197 A1 3/2011 Fujiwara et al.
US 2011/0248281 A12011/0248281 A1 10/2011 Oshima et al.
US 2012/0034763 A12012/0034763 A1 2/2012 Osada et al.
US 2012/0074403 A12012/0074403 A1 3/2012 Fujiwara et al.
US 2012/0112320 A12012/0112320 A1 5/2012 Kubo et al.
US 2012/0237431 A12012/0237431 A1 9/2012 Mikawa et al.
US 2012/0282443 A12012/0282443 A1 11/2012 Fujito et al.
US 2012/0315445 A12012/0315445 A1 12/2012 Mizuhara et al.
US 2012/0329245 A12012/0329245 A1 12/2012 Uematsu et al.
US 2013/0313567 A12013/0313567 A1 1/2013 Furuya et al.
US 2013/0065036 A12013/0065036 A1 3/2013 Hayashi et al.
US 2013/0069078 A12013/0069078 A1 3/2013 Sarayama et al.
US 2013/0108537 A12013/0108537 A1 5/2013 Mikawa et al.
US 2013/0160699 A12013/0160699 A1 6/2013 Mizuhara et al.
US 2013/0284160 A12013/0284160 A1 10/2013 Uchida et al.
US 2013/0337632 A12013/0337632 A1 12/2013 Uematsu et al.
US 2014/0035103 A12014/0035103 A1 2/2014 Matsumoto et al.
US 2014/0175616 A12014/0175616 A1 6/2014 Mizuhara et al.
US 2014/0369920 A12014/0369920 A1 12/2014 Uematsu et al.
CN 102666945 ACN 102666945 A 9/2012
CN 103348044 ACN 103348044 A 10/2013
CN 103456593 ACN 103456593 A 12/2013
TW 200815630 ATW 200815630 A 4/2008
TW 201125163 ATW 201125163 A 7/2011
Cited non-patent literature · 3
English Translation of International Search Raport issued Oct. 28, 2014 in PCT/JP2014/070919, filed Aug. 7, 2014.
Self-Separated Freestanding GaN Using a N H 4 Cl Interlayer. English Translation of International Search Report issued Mar. 3, 2015 in PCT/JP2014/082859, filed Dec. 11, 2014. Hyun-Jae lee et al. “Self-Separated Freestanding GaN Using a N H 4 Cl Interlayer”, Applied Physics Letters, vol. 91, 192108, 2007, 4 pages. Po Shan Hsu et al. “Stress Relaxation and Critical Thickness for Misfit Dislocation Formation in (100) and (30) InGaN/GaN Heteroepitaxy”, Applied Physics Letters, vol. 100, 171917, 2012, 5 pages. English translation of International Preliminary Report on Patent- ability and Written Opinion issued Feb. 18, 2016 in PCT/JP2014/070919. Notification of Transmittal of Translation of the International Pre- liminary Report on Patentability filed in PCT/JP2014/082859, dated Jul. 28, 2016, and Written Opinion of the International Searching Authority. Ofice Action mailed Dec. 12, 2017 in related U.S. Appl. No. 15/210,150. Extended European Search Report issued Jun. 14, 2016 in Patent Application No. 14834101.9.
Review of Polarity Determination and Control of GaN. Chinese Office Action issued on Aug. 1, 2018 in Patent Application No. 201480073300.0 (with English translation), 25 pages. Office Action issued Jul. 4, 2017 in Japanese Patent Application No. 2014-168566 (with unedited computer generated English transla- tion). Combined Chinese Office Action and Search Report issued Dec. 4, 2017 in Chinese Patent Application No. 201480073300.0 (with unedited computer generated English translation), 29 pages. Combined Office Action and Search Report issued Dec. 14, 2017 in Taiwanese Patent Application No. 103127186 (with English lan- guage translation), 7 pages. Extended European Search Report issued Mar. 29, 2018 in Patent Application No. 17194202.2, 8 pages. Combined Office Action and Search Report issued Apr. 12, 2018 in Taiwanese Patent Application No. 103143621 (with English lan- guage translation of Office Action and English translation of cat- egories of cited documents), 10 pages. Sumiya, et al., “Review of Polarity Determination and Control of GaN”, MRS Internet J. Nitride Semicond. Res. 9, 1 (2004) The Material sResearch Society (Year, 2004). Office Action issued Oct. 16, 2018 in Japanese Patent Application No. 2015-557739, 6 pages (with unedited computer generated English translation). Japanese Office Action issued Dec. 18, 2018 in Japanese Patent Application No. 2018-056344 (with unedited computer generated English translation), 8 pages. Office Action Issued Mar. 5, 2019, in Taiwanese Patent Application No. 107130360 filed Aug. 7, 2014 (with English translation). Pimputkar, et al., Surface Morphology study of basic ammonothermal GaN grown on non-polar GaN seed crystals of varying surface orientations from m-plane to a-plane, Journal of Crystal Growth, 368, pp. 67-71 (2013); Jan. 23, 2013 (year:2013). Bliss, et al., Ammonothermal GaN: Morphology and properties, Journal of Crystal Growth 312, pp. 1069-1073 (2010); Dec. 11, 2009 (Year: 2009). Office Action mailed Oct. 2, 2019 in U.S. Appl. No. 16/034,953, 16 pages. European Office Action Issued on Jun. 26, 2020 in Patent Applica- tion No. 17 194 202.2, 8 pages. Combined Taiwanese Office Action and Search Report issued Sep. 1, 2020 in Patent Application No. 108140117 (with English lan- guage translation), 14 pages. Taiwanese Office Action issued Jun. 22, 2021 in Taiwanese Patent Application No. 108140117 (with unedited computer generated English translation), 6 pages. European Search Report issued Sep. 6, 2021 in European Patent Application No. 17 194 202.2, 5 pages.
substrate GaNcharacterization device performancematerial GaN
FIG. 8, the secondary GaN crystal 1003 is growing in a wall shape one by one above each opening of the growth mask 1002. The height direction of the walls is a …
FIG. 15 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 16 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 19 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 20 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 22 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 23 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 24A. Although the substrate is shown to be cracked in the external view photograph, this was due to inappropriate handling. The substrate had a thickness …
FIG. 25 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 26 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 30 is a graph showing a result of measurements of 15 an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 31 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 20 substrate taken every 250 µm on a straight …
FIG. 32 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 33 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 35 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 35 substrate taken every 250 µm on a straight …
FIG. 36 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 37 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 39 is a graph showing a result of measurements of 50 a c-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 40 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (20-21) 55 substrate taken every 250 µm on an …
FIG. 41 is a graph showing a result of measurements of a c-axis length on a principal surface of a GaN (20-21) substrate taken every 250 µm on an intersection …
US 11,031,475 B211,031,475 B2 * 6/2021 Nagao..................... C30B 25/20examiner
US 11,038,024 B211,038,024 B2 6/2021 Nagao
US 11,664,428 B211,664,428 B2 * 5/2023 Nagao................. H01L 29/2003examiner
US 2004/0187766 A12004/0187766 A1 9/2004 Letertre
US 2004/0244680 A12004/0244680 A1 12/2004 Dwilinski et al.
US 2004/0245535 A12004/0245535 A1 12/2004 D’Evelyn et al.
US 2005/0087124 A12005/0087124 A1 4/2005 Dwilinski et al.
US 2005/0214992 A12005/0214992 A1 9/2005 Chakraborty et al.
US 2007/0261633 A12007/0261633 A1 11/2007 Tanaka
US 2007/0290228 A12007/0290228 A1 12/2007 Yoshida
US 2008/0081015 A12008/0081015 A1 4/2008 Sarayama et al.
US 2009/0236694 A12009/0236694 A1 9/2009 Mizuhara et al.
US 2010/0104495 A12010/0104495 A1 4/2010 Kawabata et al.
US 2010/0233866 A12010/0233866 A1 9/2010 Akiyama et al.
US 2011/0057197 A12011/0057197 A1 3/2011 Fujiwara et al.
US 2011/0248281 A12011/0248281 A1 10/2011 Oshima et al.
US 2012/0034763 A12012/0034763 A1 2/2012 Osada et al.
US 2012/0074403 A12012/0074403 A1 3/2012 Fujiwara et al.
US 2012/0112320 A12012/0112320 A1 5/2012 Kubo et al.
US 2012/0237431 A12012/0237431 A1 9/2012 Mikawa et al.
US 2012/0282443 A12012/0282443 A1 11/2012 Fujito et al.
US 2012/0315445 A12012/0315445 A1 12/2012 Mizuhara et al.
US 2012/0329245 A12012/0329245 A1 12/2012 Uematsu et al.
US 2013/0313567 A12013/0313567 A1 1/2013 Furuya et al.
US 2013/0065036 A12013/0065036 A1 3/2013 Hayashi et al.
US 2013/0069078 A12013/0069078 A1 3/2013 Sarayama et al.
US 2013/0108537 A12013/0108537 A1 5/2013 Mikawa et al.
US 2013/0160699 A12013/0160699 A1 6/2013 Mizuhara et al.
US 2013/0284160 A12013/0284160 A1 10/2013 Uchida et al.
US 2013/0337632 A12013/0337632 A1 12/2013 Uematsu et al.
US 2014/0035103 A12014/0035103 A1 2/2014 Matsumoto et al.
US 2014/0175616 A12014/0175616 A1 6/2014 Mizuhara et al.
US 2014/0369920 A12014/0369920 A1 12/2014 Uematsu et al.
CN 102666945 ACN 102666945 A 9/2012
CN 103348044 ACN 103348044 A 10/2013
CN 103456593 ACN 103456593 A 12/2013
TW 200815630 ATW 200815630 A 4/2008
TW 201125163 ATW 201125163 A 7/2011
Cited non-patent literature · 3
English Translation of International Search Raport issued Oct. 28, 2014 in PCT/JP2014/070919, filed Aug. 7, 2014.
Self-Separated Freestanding GaN Using a N H 4 Cl Interlayer. English Translation of International Search Report issued Mar. 3, 2015 in PCT/JP2014/082859, filed Dec. 11, 2014. Hyun-Jae lee et al. “Self-Separated Freestanding GaN Using a N H 4 Cl Interlayer”, Applied Physics Letters, vol. 91, 192108, 2007, 4 pages. Po Shan Hsu et al. “Stress Relaxation and Critical Thickness for Misfit Dislocation Formation in (100) and (30) InGaN/GaN Heteroepitaxy”, Applied Physics Letters, vol. 100, 171917, 2012, 5 pages. English translation of International Preliminary Report on Patent- ability and Written Opinion issued Feb. 18, 2016 in PCT/JP2014/070919. Notification of Transmittal of Translation of the International Pre- liminary Report on Patentability filed in PCT/JP2014/082859, dated Jul. 28, 2016, and Written Opinion of the International Searching Authority. Ofice Action mailed Dec. 12, 2017 in related U.S. Appl. No. 15/210,150. Extended European Search Report issued Jun. 14, 2016 in Patent Application No. 14834101.9.
Review of Polarity Determination and Control of GaN. Chinese Office Action issued on Aug. 1, 2018 in Patent Application No. 201480073300.0 (with English translation), 25 pages. Office Action issued Jul. 4, 2017 in Japanese Patent Application No. 2014-168566 (with unedited computer generated English transla- tion). Combined Chinese Office Action and Search Report issued Dec. 4, 2017 in Chinese Patent Application No. 201480073300.0 (with unedited computer generated English translation), 29 pages. Combined Office Action and Search Report issued Dec. 14, 2017 in Taiwanese Patent Application No. 103127186 (with English lan- guage translation), 7 pages. Extended European Search Report issued Mar. 29, 2018 in Patent Application No. 17194202.2, 8 pages. Combined Office Action and Search Report issued Apr. 12, 2018 in Taiwanese Patent Application No. 103143621 (with English lan- guage translation of Office Action and English translation of cat- egories of cited documents), 10 pages. Sumiya, et al., “Review of Polarity Determination and Control of GaN”, MRS Internet J. Nitride Semicond. Res. 9, 1 (2004) The Material sResearch Society (Year, 2004). Office Action issued Oct. 16, 2018 in Japanese Patent Application No. 2015-557739, 6 pages (with unedited computer generated English translation). Japanese Office Action issued Dec. 18, 2018 in Japanese Patent Application No. 2018-056344 (with unedited computer generated English translation), 8 pages. Office Action Issued Mar. 5, 2019, in Taiwanese Patent Application No. 107130360 filed Aug. 7, 2014 (with English translation). Pimputkar, et al., Surface Morphology study of basic ammonothermal GaN grown on non-polar GaN seed crystals of varying surface orientations from m-plane to a-plane, Journal of Crystal Growth, 368, pp. 67-71 (2013); Jan. 23, 2013 (year:2013). Bliss, et al., Ammonothermal GaN: Morphology and properties, Journal of Crystal Growth 312, pp. 1069-1073 (2010); Dec. 11, 2009 (Year: 2009). Office Action mailed Oct. 2, 2019 in U.S. Appl. No. 16/034,953, 16 pages. European Office Action Issued on Jun. 26, 2020 in Patent Applica- tion No. 17 194 202.2, 8 pages. Combined Taiwanese Office Action and Search Report issued Sep. 1, 2020 in Patent Application No. 108140117 (with English lan- guage translation), 14 pages. Taiwanese Office Action issued Jun. 22, 2021 in Taiwanese Patent Application No. 108140117 (with unedited computer generated English translation), 6 pages. European Search Report issued Sep. 6, 2021 in European Patent Application No. 17 194 202.2, 5 pages.
substrate GaNcharacterization device performancematerial GaN
FIG. 8, the secondary GaN crystal 1003 is growing in a wall shape one by one above each opening of the growth mask 1002. The height direction of the walls is a …
FIG. 15 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 16 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 19 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 20 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 22 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 23 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 24A. Although the substrate is shown to be cracked in the external view photograph, this was due to inappropriate handling. The substrate had a thickness …
FIG. 25 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 26 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 30 is a graph showing a result of measurements of 15 an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 31 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 20 substrate taken every 250 µm on a straight …
FIG. 32 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 33 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 35 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN 35 substrate taken every 250 µm on a straight …
FIG. 36 is a graph showing a result of measurements of an a-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight …
FIG. 37 is a graph showing a result of measurements of a c-axis length on a principal surface of an M-plane GaN substrate taken every 250 µm on a straight line …
FIG. 39 is a graph showing a result of measurements of 50 a c-axis length on a principal surface of a GaN (30-3-1) substrate taken every 250 µm on an …
FIG. 40 is a graph showing a result of measurements of an a-axis length on a principal surface of a GaN (20-21) 55 substrate taken every 250 µm on an …
FIG. 41 is a graph showing a result of measurements of a c-axis length on a principal surface of a GaN (20-21) substrate taken every 250 µm on an intersection …
US 11,031,475 B211,031,475 B2 * 6/2021 Nagao..................... C30B 25/20examiner
US 11,038,024 B211,038,024 B2 6/2021 Nagao
US 11,664,428 B211,664,428 B2 * 5/2023 Nagao................. H01L 29/2003examiner
US 2004/0187766 A12004/0187766 A1 9/2004 Letertre
US 2004/0244680 A12004/0244680 A1 12/2004 Dwilinski et al.
US 2004/0245535 A12004/0245535 A1 12/2004 D’Evelyn et al.
US 2005/0087124 A12005/0087124 A1 4/2005 Dwilinski et al.
US 2005/0214992 A12005/0214992 A1 9/2005 Chakraborty et al.
US 2007/0261633 A12007/0261633 A1 11/2007 Tanaka
US 2007/0290228 A12007/0290228 A1 12/2007 Yoshida
US 2008/0081015 A12008/0081015 A1 4/2008 Sarayama et al.
US 2009/0236694 A12009/0236694 A1 9/2009 Mizuhara et al.
US 2010/0104495 A12010/0104495 A1 4/2010 Kawabata et al.
US 2010/0233866 A12010/0233866 A1 9/2010 Akiyama et al.
US 2011/0057197 A12011/0057197 A1 3/2011 Fujiwara et al.
US 2011/0248281 A12011/0248281 A1 10/2011 Oshima et al.
US 2012/0034763 A12012/0034763 A1 2/2012 Osada et al.
US 2012/0074403 A12012/0074403 A1 3/2012 Fujiwara et al.
US 2012/0112320 A12012/0112320 A1 5/2012 Kubo et al.
US 2012/0237431 A12012/0237431 A1 9/2012 Mikawa et al.
US 2012/0282443 A12012/0282443 A1 11/2012 Fujito et al.
US 2012/0315445 A12012/0315445 A1 12/2012 Mizuhara et al.
US 2012/0329245 A12012/0329245 A1 12/2012 Uematsu et al.
US 2013/0313567 A12013/0313567 A1 1/2013 Furuya et al.
US 2013/0065036 A12013/0065036 A1 3/2013 Hayashi et al.
US 2013/0069078 A12013/0069078 A1 3/2013 Sarayama et al.
US 2013/0108537 A12013/0108537 A1 5/2013 Mikawa et al.
US 2013/0160699 A12013/0160699 A1 6/2013 Mizuhara et al.
US 2013/0284160 A12013/0284160 A1 10/2013 Uchida et al.
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substrate GaNcharacterization device performancematerial GaN