Patent
US 9,105,853dimethyl sulfoxide
DMSO
dimethylformamide
DMF
N-methylpyrolidine
semiconductor nano-component materials
silicon dioxide/oxynitride/high-K dielectric
graphene
FIG. 1. The resist pattern formed on the carbon nanotube may have one or multiple separations from about 10 nm to about 500 nm when e-beam li thography is …
FIG. 2, a metal 160, having a thickness ranging from about 15 nm to about 50 nm, is deposited on the resist pattern and over portions of the carbon nanotube 5 …
FIG. 2, a metal 160, having a thickness ranging from about 15 nm to about 50 nm, is deposited on the resist pattern and over portions of the carbon nanotube 5 …
FIG. 3, the metal portions 162 and 164 remaining on the carbon nanotube 140 form the FET source and drain. In this embodiment, the source and drains are formed …
FIG. 4 illustrates the doping molecules bonding to the carbon nanotube 140. The doped portion of the carbon nanotube 140 (between the metal source and drain) …
FIG. 5 illustrates another embodiment of forming a carbon nanotube F ET, or 25 more generally, a F ET with a channel compris in g a nano-component such as …
FIG. 6. As an example, a dilute hydrofluoric (HF) acid such as 100:1 HF can be used as an etchant for LTO. Additionally, the device is immersed in a dopant …
FIGS. 7-9 illustrate steps in another embodiment of forming a carbon nanotube F ET, or more generally, a F ET with a channel comprising a nano- component such …
FIG. 11 is a flow diagram illustrating techniques for forming a field effect transistor with a stable n-doped nano-component, according to an embodiment of the …
| — |
Thickness | 15–300 nm | — |
Thickness | 1–100 nm | — |
dimethyl sulfoxide
DMSO
dimethylformamide
DMF
N-methylpyrolidine
semiconductor nano-component materials
silicon dioxide/oxynitride/high-K dielectric
graphene
FIG. 1. The resist pattern formed on the carbon nanotube may have one or multiple separations from about 10 nm to about 500 nm when e-beam li thography is …
FIG. 2, a metal 160, having a thickness ranging from about 15 nm to about 50 nm, is deposited on the resist pattern and over portions of the carbon nanotube 5 …
FIG. 2, a metal 160, having a thickness ranging from about 15 nm to about 50 nm, is deposited on the resist pattern and over portions of the carbon nanotube 5 …
FIG. 3, the metal portions 162 and 164 remaining on the carbon nanotube 140 form the FET source and drain. In this embodiment, the source and drains are formed …
FIG. 4 illustrates the doping molecules bonding to the carbon nanotube 140. The doped portion of the carbon nanotube 140 (between the metal source and drain) …
FIG. 5 illustrates another embodiment of forming a carbon nanotube F ET, or 25 more generally, a F ET with a channel compris in g a nano-component such as …
FIG. 6. As an example, a dilute hydrofluoric (HF) acid such as 100:1 HF can be used as an etchant for LTO. Additionally, the device is immersed in a dopant …
FIGS. 7-9 illustrate steps in another embodiment of forming a carbon nanotube F ET, or more generally, a F ET with a channel comprising a nano- component such …
FIG. 11 is a flow diagram illustrating techniques for forming a field effect transistor with a stable n-doped nano-component, according to an embodiment of the …
| — |
Thickness | 15–300 nm | — |
Thickness | 1–100 nm | — |
dimethyl sulfoxide
DMSO
dimethylformamide
DMF
N-methylpyrolidine
semiconductor nano-component materials
silicon dioxide/oxynitride/high-K dielectric
graphene
FIG. 1. The resist pattern formed on the carbon nanotube may have one or multiple separations from about 10 nm to about 500 nm when e-beam li thography is …
FIG. 2, a metal 160, having a thickness ranging from about 15 nm to about 50 nm, is deposited on the resist pattern and over portions of the carbon nanotube 5 …
FIG. 2, a metal 160, having a thickness ranging from about 15 nm to about 50 nm, is deposited on the resist pattern and over portions of the carbon nanotube 5 …
FIG. 3, the metal portions 162 and 164 remaining on the carbon nanotube 140 form the FET source and drain. In this embodiment, the source and drains are formed …
FIG. 4 illustrates the doping molecules bonding to the carbon nanotube 140. The doped portion of the carbon nanotube 140 (between the metal source and drain) …
FIG. 5 illustrates another embodiment of forming a carbon nanotube F ET, or 25 more generally, a F ET with a channel compris in g a nano-component such as …
FIG. 6. As an example, a dilute hydrofluoric (HF) acid such as 100:1 HF can be used as an etchant for LTO. Additionally, the device is immersed in a dopant …
FIGS. 7-9 illustrate steps in another embodiment of forming a carbon nanotube F ET, or more generally, a F ET with a channel comprising a nano- component such …
FIG. 11 is a flow diagram illustrating techniques for forming a field effect transistor with a stable n-doped nano-component, according to an embodiment of the …
| — |
Thickness | 15–300 nm | — |
Thickness | 1–100 nm | — |
dimethyl sulfoxide
DMSO
dimethylformamide
DMF
N-methylpyrolidine
semiconductor nano-component materials
silicon dioxide/oxynitride/high-K dielectric
graphene
FIG. 1. The resist pattern formed on the carbon nanotube may have one or multiple separations from about 10 nm to about 500 nm when e-beam li thography is …
FIG. 2, a metal 160, having a thickness ranging from about 15 nm to about 50 nm, is deposited on the resist pattern and over portions of the carbon nanotube 5 …
FIG. 2, a metal 160, having a thickness ranging from about 15 nm to about 50 nm, is deposited on the resist pattern and over portions of the carbon nanotube 5 …
FIG. 3, the metal portions 162 and 164 remaining on the carbon nanotube 140 form the FET source and drain. In this embodiment, the source and drains are formed …
FIG. 4 illustrates the doping molecules bonding to the carbon nanotube 140. The doped portion of the carbon nanotube 140 (between the metal source and drain) …
FIG. 5 illustrates another embodiment of forming a carbon nanotube F ET, or 25 more generally, a F ET with a channel compris in g a nano-component such as …
FIG. 6. As an example, a dilute hydrofluoric (HF) acid such as 100:1 HF can be used as an etchant for LTO. Additionally, the device is immersed in a dopant …
FIGS. 7-9 illustrate steps in another embodiment of forming a carbon nanotube F ET, or more generally, a F ET with a channel comprising a nano- component such …
FIG. 11 is a flow diagram illustrating techniques for forming a field effect transistor with a stable n-doped nano-component, according to an embodiment of the …
| — |
Thickness | 15–300 nm | — |
Thickness | 1–100 nm | — |