Patent
US 10,998,405C₇₆H₂₀
C₉₆H₂₄
alumina (Al₂O₃)
Al₂O₃
zinc oxide (ZnO)
ZnO
graphene foam (composite of polymeric material and molecular graphene)
first metal interconnect (TiN, W, Pd, Cu, or Ru)
dielectric comprising metal oxide in polymer matrix
cyclohexane (PAH precursor solution)
C₆H₁₂
polystyrene-block-poly(methyl methacrylate) (PS-PMMA)
aluminum substrate
Al
zinc substrate
Zn
FIG. 7 is a flow diagram illustrating a method for fabricating a transistor employing a molecular graphene disposed on a substrate, in accordance with some …
FIG. 8A, 8 B, 8C, 8 D, 8E, 8F, and 8G illustrate isometric views of substrate processing for selected operations in the method illustrated in
FIG. 11 is an isometric view of a low-defect graphene-based transistor coupled to a low-defect graphene-based interconnect, in accordance with an embodiment;
| — |
Thickness | ≤ 2 nm | — |
Thickness | ≤ 254 nm | — |
Thickness | ≤ 193 nm | — |
Thickness | ≥ 193 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 1.5 nm | — |
Thickness | ≥ 3 nm | — |
C₇₆H₂₀
C₉₆H₂₄
alumina (Al₂O₃)
Al₂O₃
zinc oxide (ZnO)
ZnO
graphene foam (composite of polymeric material and molecular graphene)
first metal interconnect (TiN, W, Pd, Cu, or Ru)
dielectric comprising metal oxide in polymer matrix
cyclohexane (PAH precursor solution)
C₆H₁₂
polystyrene-block-poly(methyl methacrylate) (PS-PMMA)
aluminum substrate
Al
zinc substrate
Zn
FIG. 7 is a flow diagram illustrating a method for fabricating a transistor employing a molecular graphene disposed on a substrate, in accordance with some …
FIG. 8A, 8 B, 8C, 8 D, 8E, 8F, and 8G illustrate isometric views of substrate processing for selected operations in the method illustrated in
FIG. 11 is an isometric view of a low-defect graphene-based transistor coupled to a low-defect graphene-based interconnect, in accordance with an embodiment;
| — |
Thickness | ≤ 2 nm | — |
Thickness | ≤ 254 nm | — |
Thickness | ≤ 193 nm | — |
Thickness | ≥ 193 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 1.5 nm | — |
Thickness | ≥ 3 nm | — |
C₇₆H₂₀
C₉₆H₂₄
alumina (Al₂O₃)
Al₂O₃
zinc oxide (ZnO)
ZnO
graphene foam (composite of polymeric material and molecular graphene)
first metal interconnect (TiN, W, Pd, Cu, or Ru)
dielectric comprising metal oxide in polymer matrix
cyclohexane (PAH precursor solution)
C₆H₁₂
polystyrene-block-poly(methyl methacrylate) (PS-PMMA)
aluminum substrate
Al
zinc substrate
Zn
FIG. 7 is a flow diagram illustrating a method for fabricating a transistor employing a molecular graphene disposed on a substrate, in accordance with some …
FIG. 8A, 8 B, 8C, 8 D, 8E, 8F, and 8G illustrate isometric views of substrate processing for selected operations in the method illustrated in
FIG. 11 is an isometric view of a low-defect graphene-based transistor coupled to a low-defect graphene-based interconnect, in accordance with an embodiment;
| — |
Thickness | ≤ 2 nm | — |
Thickness | ≤ 254 nm | — |
Thickness | ≤ 193 nm | — |
Thickness | ≥ 193 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 1.5 nm | — |
Thickness | ≥ 3 nm | — |
C₇₆H₂₀
C₉₆H₂₄
alumina (Al₂O₃)
Al₂O₃
zinc oxide (ZnO)
ZnO
graphene foam (composite of polymeric material and molecular graphene)
first metal interconnect (TiN, W, Pd, Cu, or Ru)
dielectric comprising metal oxide in polymer matrix
cyclohexane (PAH precursor solution)
C₆H₁₂
polystyrene-block-poly(methyl methacrylate) (PS-PMMA)
aluminum substrate
Al
zinc substrate
Zn
FIG. 7 is a flow diagram illustrating a method for fabricating a transistor employing a molecular graphene disposed on a substrate, in accordance with some …
FIG. 8A, 8 B, 8C, 8 D, 8E, 8F, and 8G illustrate isometric views of substrate processing for selected operations in the method illustrated in
FIG. 11 is an isometric view of a low-defect graphene-based transistor coupled to a low-defect graphene-based interconnect, in accordance with an embodiment;
| — |
Thickness | ≤ 2 nm | — |
Thickness | ≤ 254 nm | — |
Thickness | ≤ 193 nm | — |
Thickness | ≥ 193 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 1.5 nm | — |
Thickness | ≥ 3 nm | — |