Patent
US 10,189,006graphene bromide
graphene iodide
hydrogenated graphene
nitrogenated graphene
carbon material (binder)
pristine graphene
doped graphene
chemically functionalized graphene
graphene oxide
reduced graphene oxide
FIG. 6 Electrical conductivity values of 3D graphene-carbon foam and the hydrothermally reduced GO graphene foam.
inter-graphene spacing of pore walls (high-quality) | ≤ 0.35 | — |
inter-graphene spacing (highly ordered pore walls) | ≤ 0.337 | — |
Temperature | 1500–2500 °C | — |
Temperature | 300–1500 °C | — |
Thickness | 0.3354–0.36 nm | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 2–50 nm | — |
Temperature | 100–650 °C | — |
Duration | 900–7200 s | — |
Thickness | 0.3345–0.4 nm | — |
Duration | 0.5–5 minutes | — |
Duration | 48–72 hours | — |
— | 250–500 W | — |
Temperature | 300–2500 °C | — |
Duration | 10–120 minutes | — |
Duration | 2–48 hours | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–5 hours | — |
Temperature | 80–1500 °C | — |
Temperature | 3000–3250 °C | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 2 nm | — |
Pressure | ≤ 1 torr | — |
Thickness | ≥ 5 nm | — |
Thickness | ≥ 10 nm | — |
Thickness | ≥ 1 nm | — |
— | ≥ 200 W | — |
Duration | ≥ 15 minutes | — |
Thickness | 100–100000000 nm | — |
— | 250–400 W | — |
Thickness | ≤ 0.35 nm | — |
Thickness | ≤ 0.337 nm | — |
Thickness | 10–10000000 nm | — |
Thickness | 100–1000000 nm | — |
Temperature | 200–2500 °C | — |
Temperature | 2500–3200 °C | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 0.34 nm | — |
Thickness | ≤ 0.336 nm | — |
Temperature | ≥ 1 °C | — |
Thickness | ≥ 10 cm | — |
— | ≥ 250 W | — |
— | ≥ 300 W | — |
— | ≥ 350 W | — |
— | ≥ 400 W | — |
graphene bromide
graphene iodide
hydrogenated graphene
nitrogenated graphene
carbon material (binder)
pristine graphene
doped graphene
chemically functionalized graphene
graphene oxide
reduced graphene oxide
FIG. 6 Electrical conductivity values of 3D graphene-carbon foam and the hydrothermally reduced GO graphene foam.
inter-graphene spacing of pore walls (high-quality) | ≤ 0.35 | — |
inter-graphene spacing (highly ordered pore walls) | ≤ 0.337 | — |
Temperature | 1500–2500 °C | — |
Temperature | 300–1500 °C | — |
Thickness | 0.3354–0.36 nm | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 2–50 nm | — |
Temperature | 100–650 °C | — |
Duration | 900–7200 s | — |
Thickness | 0.3345–0.4 nm | — |
Duration | 0.5–5 minutes | — |
Duration | 48–72 hours | — |
— | 250–500 W | — |
Temperature | 300–2500 °C | — |
Duration | 10–120 minutes | — |
Duration | 2–48 hours | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–5 hours | — |
Temperature | 80–1500 °C | — |
Temperature | 3000–3250 °C | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 2 nm | — |
Pressure | ≤ 1 torr | — |
Thickness | ≥ 5 nm | — |
Thickness | ≥ 10 nm | — |
Thickness | ≥ 1 nm | — |
— | ≥ 200 W | — |
Duration | ≥ 15 minutes | — |
Thickness | 100–100000000 nm | — |
— | 250–400 W | — |
Thickness | ≤ 0.35 nm | — |
Thickness | ≤ 0.337 nm | — |
Thickness | 10–10000000 nm | — |
Thickness | 100–1000000 nm | — |
Temperature | 200–2500 °C | — |
Temperature | 2500–3200 °C | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 0.34 nm | — |
Thickness | ≤ 0.336 nm | — |
Temperature | ≥ 1 °C | — |
Thickness | ≥ 10 cm | — |
— | ≥ 250 W | — |
— | ≥ 300 W | — |
— | ≥ 350 W | — |
— | ≥ 400 W | — |
graphene bromide
graphene iodide
hydrogenated graphene
nitrogenated graphene
carbon material (binder)
pristine graphene
doped graphene
chemically functionalized graphene
graphene oxide
reduced graphene oxide
FIG. 6 Electrical conductivity values of 3D graphene-carbon foam and the hydrothermally reduced GO graphene foam.
inter-graphene spacing of pore walls (high-quality) | ≤ 0.35 | — |
inter-graphene spacing (highly ordered pore walls) | ≤ 0.337 | — |
Temperature | 1500–2500 °C | — |
Temperature | 300–1500 °C | — |
Thickness | 0.3354–0.36 nm | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 2–50 nm | — |
Temperature | 100–650 °C | — |
Duration | 900–7200 s | — |
Thickness | 0.3345–0.4 nm | — |
Duration | 0.5–5 minutes | — |
Duration | 48–72 hours | — |
— | 250–500 W | — |
Temperature | 300–2500 °C | — |
Duration | 10–120 minutes | — |
Duration | 2–48 hours | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–5 hours | — |
Temperature | 80–1500 °C | — |
Temperature | 3000–3250 °C | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 2 nm | — |
Pressure | ≤ 1 torr | — |
Thickness | ≥ 5 nm | — |
Thickness | ≥ 10 nm | — |
Thickness | ≥ 1 nm | — |
— | ≥ 200 W | — |
Duration | ≥ 15 minutes | — |
Thickness | 100–100000000 nm | — |
— | 250–400 W | — |
Thickness | ≤ 0.35 nm | — |
Thickness | ≤ 0.337 nm | — |
Thickness | 10–10000000 nm | — |
Thickness | 100–1000000 nm | — |
Temperature | 200–2500 °C | — |
Temperature | 2500–3200 °C | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 0.34 nm | — |
Thickness | ≤ 0.336 nm | — |
Temperature | ≥ 1 °C | — |
Thickness | ≥ 10 cm | — |
— | ≥ 250 W | — |
— | ≥ 300 W | — |
— | ≥ 350 W | — |
— | ≥ 400 W | — |
graphene bromide
graphene iodide
hydrogenated graphene
nitrogenated graphene
carbon material (binder)
pristine graphene
doped graphene
chemically functionalized graphene
graphene oxide
reduced graphene oxide
FIG. 6 Electrical conductivity values of 3D graphene-carbon foam and the hydrothermally reduced GO graphene foam.
inter-graphene spacing of pore walls (high-quality) | ≤ 0.35 | — |
inter-graphene spacing (highly ordered pore walls) | ≤ 0.337 | — |
Temperature | 1500–2500 °C | — |
Temperature | 300–1500 °C | — |
Thickness | 0.3354–0.36 nm | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 2–50 nm | — |
Temperature | 100–650 °C | — |
Duration | 900–7200 s | — |
Thickness | 0.3345–0.4 nm | — |
Duration | 0.5–5 minutes | — |
Duration | 48–72 hours | — |
— | 250–500 W | — |
Temperature | 300–2500 °C | — |
Duration | 10–120 minutes | — |
Duration | 2–48 hours | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–5 hours | — |
Temperature | 80–1500 °C | — |
Temperature | 3000–3250 °C | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 2 nm | — |
Pressure | ≤ 1 torr | — |
Thickness | ≥ 5 nm | — |
Thickness | ≥ 10 nm | — |
Thickness | ≥ 1 nm | — |
— | ≥ 200 W | — |
Duration | ≥ 15 minutes | — |
Thickness | 100–100000000 nm | — |
— | 250–400 W | — |
Thickness | ≤ 0.35 nm | — |
Thickness | ≤ 0.337 nm | — |
Thickness | 10–10000000 nm | — |
Thickness | 100–1000000 nm | — |
Temperature | 200–2500 °C | — |
Temperature | 2500–3200 °C | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 0.34 nm | — |
Thickness | ≤ 0.336 nm | — |
Temperature | ≥ 1 °C | — |
Thickness | ≥ 10 cm | — |
— | ≥ 250 W | — |
— | ≥ 300 W | — |
— | ≥ 350 W | — |
— | ≥ 400 W | — |