Patent
US 9,722,122heterojunction bipolar transistor (HBT)
substrate with bandgap ~1.1 eV
GaAs:Bi:B
Ge first cell
Ge
GaAs isoelectronically co-doped with B and Bi
GaAs:B:Bi
InGaP fourth cell
InGaP
GaAs third cell
GaAs
FIG. 3 is a graphical illustration of a prior art direct bandgap with a donor dopant 10 energy level; [0017]
FIG. 4 is a graphical representation of a bandgap 40 of a semiconductor material that is co-doped with Boron and deep donor 48 (Bismuth) impurities; [0018]
FIG. 5 is a diagrammatic sectional view of a heterojunction bipolar transistor; and [0019]
FIG. 6 is a diagrammatic sectional view of a heterojunction bipolar transistor 15 according to this disclosure.
| 1.05 eV |
GaAs:B:Bi |
bandgap of GaAs third cell | 1.42 eV | GaAs |
bandgap of InGaP fourth cell | 1.9 eV | InGaP |
bandgap of first cell substrate | 1.1 eV | substrate with bandgap ~1.1 eV |
effective bandgap of isoelectronically co-doped GaP second cell | 1.75 eV | GaP:B:Bi |
Thickness | 652–873 nm | — |
Thickness | 873–1180 nm | — |
Thickness | 1180–1850 nm | — |
heterojunction bipolar transistor (HBT)
substrate with bandgap ~1.1 eV
GaAs:Bi:B
Ge first cell
Ge
GaAs isoelectronically co-doped with B and Bi
GaAs:B:Bi
InGaP fourth cell
InGaP
GaAs third cell
GaAs
FIG. 3 is a graphical illustration of a prior art direct bandgap with a donor dopant 10 energy level; [0017]
FIG. 4 is a graphical representation of a bandgap 40 of a semiconductor material that is co-doped with Boron and deep donor 48 (Bismuth) impurities; [0018]
FIG. 5 is a diagrammatic sectional view of a heterojunction bipolar transistor; and [0019]
FIG. 6 is a diagrammatic sectional view of a heterojunction bipolar transistor 15 according to this disclosure.
| 1.05 eV |
GaAs:B:Bi |
bandgap of GaAs third cell | 1.42 eV | GaAs |
bandgap of InGaP fourth cell | 1.9 eV | InGaP |
bandgap of first cell substrate | 1.1 eV | substrate with bandgap ~1.1 eV |
effective bandgap of isoelectronically co-doped GaP second cell | 1.75 eV | GaP:B:Bi |
Thickness | 652–873 nm | — |
Thickness | 873–1180 nm | — |
Thickness | 1180–1850 nm | — |
heterojunction bipolar transistor (HBT)
substrate with bandgap ~1.1 eV
GaAs:Bi:B
Ge first cell
Ge
GaAs isoelectronically co-doped with B and Bi
GaAs:B:Bi
InGaP fourth cell
InGaP
GaAs third cell
GaAs
FIG. 3 is a graphical illustration of a prior art direct bandgap with a donor dopant 10 energy level; [0017]
FIG. 4 is a graphical representation of a bandgap 40 of a semiconductor material that is co-doped with Boron and deep donor 48 (Bismuth) impurities; [0018]
FIG. 5 is a diagrammatic sectional view of a heterojunction bipolar transistor; and [0019]
FIG. 6 is a diagrammatic sectional view of a heterojunction bipolar transistor 15 according to this disclosure.
| 1.05 eV |
GaAs:B:Bi |
bandgap of GaAs third cell | 1.42 eV | GaAs |
bandgap of InGaP fourth cell | 1.9 eV | InGaP |
bandgap of first cell substrate | 1.1 eV | substrate with bandgap ~1.1 eV |
effective bandgap of isoelectronically co-doped GaP second cell | 1.75 eV | GaP:B:Bi |
Thickness | 652–873 nm | — |
Thickness | 873–1180 nm | — |
Thickness | 1180–1850 nm | — |
heterojunction bipolar transistor (HBT)
substrate with bandgap ~1.1 eV
GaAs:Bi:B
Ge first cell
Ge
GaAs isoelectronically co-doped with B and Bi
GaAs:B:Bi
InGaP fourth cell
InGaP
GaAs third cell
GaAs
FIG. 3 is a graphical illustration of a prior art direct bandgap with a donor dopant 10 energy level; [0017]
FIG. 4 is a graphical representation of a bandgap 40 of a semiconductor material that is co-doped with Boron and deep donor 48 (Bismuth) impurities; [0018]
FIG. 5 is a diagrammatic sectional view of a heterojunction bipolar transistor; and [0019]
FIG. 6 is a diagrammatic sectional view of a heterojunction bipolar transistor 15 according to this disclosure.
| 1.05 eV |
GaAs:B:Bi |
bandgap of GaAs third cell | 1.42 eV | GaAs |
bandgap of InGaP fourth cell | 1.9 eV | InGaP |
bandgap of first cell substrate | 1.1 eV | substrate with bandgap ~1.1 eV |
effective bandgap of isoelectronically co-doped GaP second cell | 1.75 eV | GaP:B:Bi |
Thickness | 652–873 nm | — |
Thickness | 873–1180 nm | — |
Thickness | 1180–1850 nm | — |