Patent
US 11,056,343PROVIDING A TEMPORARY PROTECTIVE LAYER ON A GRAPHENE SHEET
DENG PAN
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 11,056,343Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 illustrates the different progressions of depositing a temporary protective layer onto a surface of a graphene sheet according to one embodiment.
Figure 1 A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 1 B illustrates a graphene sheet with a temporary metal layer according to one embodiment.
Figure 1 C illustrates a graphene sheet with a temporary metal layer removed from a surface of the graphene sheet according to one embodiment.
Figure 2 illustrates the different progressions of patterning a graphene sheet with a hard mask layer according to one embodiment.
Figure 2A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 2B illustrates a graphene sheet with a metal layer according to one embodiment.
Figure 2C illustrates a graphene sheet with a metal layer and a photoresist layer for lithographic patterning according to one embodiment. SMRH:483127531.3 -- 5 -- 39PS-228120 P A T E N T Docket 39PS-228120
Figure 2D illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a radiation source to create a pattern template according to one embodiment.
Figure 2E illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a metal etchant solution to pattern the metal layer according to one embodiment.
Figure 2F illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a plasma etchant solution to pattern the graphene sheet according to one embodiment.
Figure 2G illustrates a patterned graphene sheet with a metal layer according to one embodiment.
Figure 2H illustrates a patterned graphene sheet according to one embodiment [0022] The figures are not intended to be exhaustive or to limit the invention to the precise form disclosed. It should be understood that the invention can be practiced with modification and alteration, and that the …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for providing a temporary layer on a graphene sheet comprising: transferring a graphene sheet to a selected wafer; depositing a gold layer to a first surface of the graphene sheet by dipping the graphene sheet in a gold plating solution; patterning the graphene sheet by etching away areas of the gold layer and the graphene sheet corresponding to areas patterned in a photoresist layer using a lithography process; packaging the patterned graphene sheet and temporary protective portions of the gold layer not etched away during the patterning of the graphene sheet into a graphene-based device, wherein the packaging comprises epoxy curing,,,; and removing, after packaging the graphene-based device, the temporary protective portions of gold layer by exposing the gold layer deposited to the surface of the graphene sheet to a nonacidic solution comprising potassium iodide. Currently amended
The method of claim 1, wherein the temporary protective portions of the gold layer are washed in the non-acidic solution comprising potassium iodide for a duration ranging from about 30 seconds to about 5 minutes. Currently amended
The method of claim 1, further comprising washing the graphene sheet with deionized water to remove any remaining particles or contaminants left on the patterned graphene sheet from the step of removing the gold layer. Currently amended
The method of claim 1, further comprising depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
2-6. Canceled
Canceled
A method for providing a temporary layer on a graphene sheet comprising: transferring a graphene sheet to a selected wafer; depositing a metal layer forming the temporary layer on the graphene sheet; patterning the graphene; packaging the patterned graphene sheet and the metal layer into a graphene-based device, wherein the packaging comprises epoxy curing,,,; [[and]] removing, after packaging the graphene-based device, the metal layer from the graphene sheet, wherein the metal layer comprises gold, ruthenium,,, silver,, iridium,; and wherein removing the metal layer comprises exposing the graphene sheet to a non-acidic solution. Currently amended
The method of claim 11, wherein the depositing the metal layer comprises applying an electron beam evaporation process. Original
The method of claim 11, wherein the depositing the metal layer comprises applying a focused ion beam process, a filament evaporation process, a sputter deposition process, or an electrolysis process. Original
The method of claim 11, wherein the removing the metal layer comprises washing the metal layer with a potassium iodide solution. Original
The method of claim 11, further comprising depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
Canceled
Canceled
A bio-sensor chip comprising: a graphene-based device with a patterned graphene portion protected from contamination or damage during packaging and assembly of the graphene-based device by a temporary protective metal layer that is removed from the patterned graphene portion after the packaging and the assembly of the graphene-based device; and one or more bottom electrodes spaced apart and disposed directly under the patterned graphene portion; wherein the graphene-based device is manufactured according to the following process steps: transferring a graphene sheet to a selected wafer; depositing a gold layer to a first surface of the graphene sheet by dipping the graphene sheet in a gold plating solution; patterning the graphene sheet by etching away areas of the gold layer and the graphene sheet corresponding to areas patterned in a photoresist layer using a lithography process; packaging the patterned graphene sheet and portions of the gold layer not etched away during the pattering of the graphene sheet into a graphene-based device, wherein the packaging comprises epoxy curing,,,; and removing, after packaging the graphene-based device, the gold layer by exposing the graphene sheet to a nonacidic solution. Currently amended
The bio-sensor of claim 20, wherein the depositing the gold layer comprises applying an electron beam evaporation process. Previously presented
The bio-sensor of claim 20, wherein the depositing the gold layer comprises applying a focused ion beam process, a filament evaporation process, a sputter deposition process, or an electrolysis process. Previously presented
The bio-sensor of claim 20, wherein the removing the gold layer comprises washing the gold layer with a potassium iodide solution. Previously presented
The bio-sensor of claim 20, wherein the graphene-based device is further manufactured by depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
The bio-sensor of claim 20, wherein the portions of the temporary protective layer that were not etched away prior to patterning the graphene sheet remain deposited on the patterned graphene sheet while the graphene-based device is subjected to one or more assembly processes comprising wafer slicing. New
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based device
bio-sensor chip
Materials described outside the worked examples.
graphene sheet
potassium iodide solution
KI
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
gold temporary protective layer thickness range | 10–1000 | Au |
Thickness | 10–1000 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 11,056,343Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 illustrates the different progressions of depositing a temporary protective layer onto a surface of a graphene sheet according to one embodiment.
Figure 1 A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 1 B illustrates a graphene sheet with a temporary metal layer according to one embodiment.
Figure 1 C illustrates a graphene sheet with a temporary metal layer removed from a surface of the graphene sheet according to one embodiment.
Figure 2 illustrates the different progressions of patterning a graphene sheet with a hard mask layer according to one embodiment.
Figure 2A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 2B illustrates a graphene sheet with a metal layer according to one embodiment.
Figure 2C illustrates a graphene sheet with a metal layer and a photoresist layer for lithographic patterning according to one embodiment. SMRH:483127531.3 -- 5 -- 39PS-228120 P A T E N T Docket 39PS-228120
Figure 2D illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a radiation source to create a pattern template according to one embodiment.
Figure 2E illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a metal etchant solution to pattern the metal layer according to one embodiment.
Figure 2F illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a plasma etchant solution to pattern the graphene sheet according to one embodiment.
Figure 2G illustrates a patterned graphene sheet with a metal layer according to one embodiment.
Figure 2H illustrates a patterned graphene sheet according to one embodiment [0022] The figures are not intended to be exhaustive or to limit the invention to the precise form disclosed. It should be understood that the invention can be practiced with modification and alteration, and that the …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for providing a temporary layer on a graphene sheet comprising: transferring a graphene sheet to a selected wafer; depositing a gold layer to a first surface of the graphene sheet by dipping the graphene sheet in a gold plating solution; patterning the graphene sheet by etching away areas of the gold layer and the graphene sheet corresponding to areas patterned in a photoresist layer using a lithography process; packaging the patterned graphene sheet and temporary protective portions of the gold layer not etched away during the patterning of the graphene sheet into a graphene-based device, wherein the packaging comprises epoxy curing,,,; and removing, after packaging the graphene-based device, the temporary protective portions of gold layer by exposing the gold layer deposited to the surface of the graphene sheet to a nonacidic solution comprising potassium iodide. Currently amended
The method of claim 1, wherein the temporary protective portions of the gold layer are washed in the non-acidic solution comprising potassium iodide for a duration ranging from about 30 seconds to about 5 minutes. Currently amended
The method of claim 1, further comprising washing the graphene sheet with deionized water to remove any remaining particles or contaminants left on the patterned graphene sheet from the step of removing the gold layer. Currently amended
The method of claim 1, further comprising depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
2-6. Canceled
Canceled
A method for providing a temporary layer on a graphene sheet comprising: transferring a graphene sheet to a selected wafer; depositing a metal layer forming the temporary layer on the graphene sheet; patterning the graphene; packaging the patterned graphene sheet and the metal layer into a graphene-based device, wherein the packaging comprises epoxy curing,,,; [[and]] removing, after packaging the graphene-based device, the metal layer from the graphene sheet, wherein the metal layer comprises gold, ruthenium,,, silver,, iridium,; and wherein removing the metal layer comprises exposing the graphene sheet to a non-acidic solution. Currently amended
The method of claim 11, wherein the depositing the metal layer comprises applying an electron beam evaporation process. Original
The method of claim 11, wherein the depositing the metal layer comprises applying a focused ion beam process, a filament evaporation process, a sputter deposition process, or an electrolysis process. Original
The method of claim 11, wherein the removing the metal layer comprises washing the metal layer with a potassium iodide solution. Original
The method of claim 11, further comprising depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
Canceled
Canceled
A bio-sensor chip comprising: a graphene-based device with a patterned graphene portion protected from contamination or damage during packaging and assembly of the graphene-based device by a temporary protective metal layer that is removed from the patterned graphene portion after the packaging and the assembly of the graphene-based device; and one or more bottom electrodes spaced apart and disposed directly under the patterned graphene portion; wherein the graphene-based device is manufactured according to the following process steps: transferring a graphene sheet to a selected wafer; depositing a gold layer to a first surface of the graphene sheet by dipping the graphene sheet in a gold plating solution; patterning the graphene sheet by etching away areas of the gold layer and the graphene sheet corresponding to areas patterned in a photoresist layer using a lithography process; packaging the patterned graphene sheet and portions of the gold layer not etched away during the pattering of the graphene sheet into a graphene-based device, wherein the packaging comprises epoxy curing,,,; and removing, after packaging the graphene-based device, the gold layer by exposing the graphene sheet to a nonacidic solution. Currently amended
The bio-sensor of claim 20, wherein the depositing the gold layer comprises applying an electron beam evaporation process. Previously presented
The bio-sensor of claim 20, wherein the depositing the gold layer comprises applying a focused ion beam process, a filament evaporation process, a sputter deposition process, or an electrolysis process. Previously presented
The bio-sensor of claim 20, wherein the removing the gold layer comprises washing the gold layer with a potassium iodide solution. Previously presented
The bio-sensor of claim 20, wherein the graphene-based device is further manufactured by depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
The bio-sensor of claim 20, wherein the portions of the temporary protective layer that were not etched away prior to patterning the graphene sheet remain deposited on the patterned graphene sheet while the graphene-based device is subjected to one or more assembly processes comprising wafer slicing. New
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based device
bio-sensor chip
Materials described outside the worked examples.
graphene sheet
potassium iodide solution
KI
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
gold temporary protective layer thickness range | 10–1000 | Au |
Thickness | 10–1000 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 11,056,343Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 illustrates the different progressions of depositing a temporary protective layer onto a surface of a graphene sheet according to one embodiment.
Figure 1 A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 1 B illustrates a graphene sheet with a temporary metal layer according to one embodiment.
Figure 1 C illustrates a graphene sheet with a temporary metal layer removed from a surface of the graphene sheet according to one embodiment.
Figure 2 illustrates the different progressions of patterning a graphene sheet with a hard mask layer according to one embodiment.
Figure 2A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 2B illustrates a graphene sheet with a metal layer according to one embodiment.
Figure 2C illustrates a graphene sheet with a metal layer and a photoresist layer for lithographic patterning according to one embodiment. SMRH:483127531.3 -- 5 -- 39PS-228120 P A T E N T Docket 39PS-228120
Figure 2D illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a radiation source to create a pattern template according to one embodiment.
Figure 2E illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a metal etchant solution to pattern the metal layer according to one embodiment.
Figure 2F illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a plasma etchant solution to pattern the graphene sheet according to one embodiment.
Figure 2G illustrates a patterned graphene sheet with a metal layer according to one embodiment.
Figure 2H illustrates a patterned graphene sheet according to one embodiment [0022] The figures are not intended to be exhaustive or to limit the invention to the precise form disclosed. It should be understood that the invention can be practiced with modification and alteration, and that the …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for providing a temporary layer on a graphene sheet comprising: transferring a graphene sheet to a selected wafer; depositing a gold layer to a first surface of the graphene sheet by dipping the graphene sheet in a gold plating solution; patterning the graphene sheet by etching away areas of the gold layer and the graphene sheet corresponding to areas patterned in a photoresist layer using a lithography process; packaging the patterned graphene sheet and temporary protective portions of the gold layer not etched away during the patterning of the graphene sheet into a graphene-based device, wherein the packaging comprises epoxy curing,,,; and removing, after packaging the graphene-based device, the temporary protective portions of gold layer by exposing the gold layer deposited to the surface of the graphene sheet to a nonacidic solution comprising potassium iodide. Currently amended
The method of claim 1, wherein the temporary protective portions of the gold layer are washed in the non-acidic solution comprising potassium iodide for a duration ranging from about 30 seconds to about 5 minutes. Currently amended
The method of claim 1, further comprising washing the graphene sheet with deionized water to remove any remaining particles or contaminants left on the patterned graphene sheet from the step of removing the gold layer. Currently amended
The method of claim 1, further comprising depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
2-6. Canceled
Canceled
A method for providing a temporary layer on a graphene sheet comprising: transferring a graphene sheet to a selected wafer; depositing a metal layer forming the temporary layer on the graphene sheet; patterning the graphene; packaging the patterned graphene sheet and the metal layer into a graphene-based device, wherein the packaging comprises epoxy curing,,,; [[and]] removing, after packaging the graphene-based device, the metal layer from the graphene sheet, wherein the metal layer comprises gold, ruthenium,,, silver,, iridium,; and wherein removing the metal layer comprises exposing the graphene sheet to a non-acidic solution. Currently amended
The method of claim 11, wherein the depositing the metal layer comprises applying an electron beam evaporation process. Original
The method of claim 11, wherein the depositing the metal layer comprises applying a focused ion beam process, a filament evaporation process, a sputter deposition process, or an electrolysis process. Original
The method of claim 11, wherein the removing the metal layer comprises washing the metal layer with a potassium iodide solution. Original
The method of claim 11, further comprising depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
Canceled
Canceled
A bio-sensor chip comprising: a graphene-based device with a patterned graphene portion protected from contamination or damage during packaging and assembly of the graphene-based device by a temporary protective metal layer that is removed from the patterned graphene portion after the packaging and the assembly of the graphene-based device; and one or more bottom electrodes spaced apart and disposed directly under the patterned graphene portion; wherein the graphene-based device is manufactured according to the following process steps: transferring a graphene sheet to a selected wafer; depositing a gold layer to a first surface of the graphene sheet by dipping the graphene sheet in a gold plating solution; patterning the graphene sheet by etching away areas of the gold layer and the graphene sheet corresponding to areas patterned in a photoresist layer using a lithography process; packaging the patterned graphene sheet and portions of the gold layer not etched away during the pattering of the graphene sheet into a graphene-based device, wherein the packaging comprises epoxy curing,,,; and removing, after packaging the graphene-based device, the gold layer by exposing the graphene sheet to a nonacidic solution. Currently amended
The bio-sensor of claim 20, wherein the depositing the gold layer comprises applying an electron beam evaporation process. Previously presented
The bio-sensor of claim 20, wherein the depositing the gold layer comprises applying a focused ion beam process, a filament evaporation process, a sputter deposition process, or an electrolysis process. Previously presented
The bio-sensor of claim 20, wherein the removing the gold layer comprises washing the gold layer with a potassium iodide solution. Previously presented
The bio-sensor of claim 20, wherein the graphene-based device is further manufactured by depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
The bio-sensor of claim 20, wherein the portions of the temporary protective layer that were not etched away prior to patterning the graphene sheet remain deposited on the patterned graphene sheet while the graphene-based device is subjected to one or more assembly processes comprising wafer slicing. New
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based device
bio-sensor chip
Materials described outside the worked examples.
graphene sheet
potassium iodide solution
KI
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
gold temporary protective layer thickness range | 10–1000 | Au |
Thickness | 10–1000 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 11,056,343Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 illustrates the different progressions of depositing a temporary protective layer onto a surface of a graphene sheet according to one embodiment.
Figure 1 A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 1 B illustrates a graphene sheet with a temporary metal layer according to one embodiment.
Figure 1 C illustrates a graphene sheet with a temporary metal layer removed from a surface of the graphene sheet according to one embodiment.
Figure 2 illustrates the different progressions of patterning a graphene sheet with a hard mask layer according to one embodiment.
Figure 2A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 2B illustrates a graphene sheet with a metal layer according to one embodiment.
Figure 2C illustrates a graphene sheet with a metal layer and a photoresist layer for lithographic patterning according to one embodiment. SMRH:483127531.3 -- 5 -- 39PS-228120 P A T E N T Docket 39PS-228120
Figure 2D illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a radiation source to create a pattern template according to one embodiment.
Figure 2E illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a metal etchant solution to pattern the metal layer according to one embodiment.
Figure 2F illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a plasma etchant solution to pattern the graphene sheet according to one embodiment.
Figure 2G illustrates a patterned graphene sheet with a metal layer according to one embodiment.
Figure 2H illustrates a patterned graphene sheet according to one embodiment [0022] The figures are not intended to be exhaustive or to limit the invention to the precise form disclosed. It should be understood that the invention can be practiced with modification and alteration, and that the …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for providing a temporary layer on a graphene sheet comprising: transferring a graphene sheet to a selected wafer; depositing a gold layer to a first surface of the graphene sheet by dipping the graphene sheet in a gold plating solution; patterning the graphene sheet by etching away areas of the gold layer and the graphene sheet corresponding to areas patterned in a photoresist layer using a lithography process; packaging the patterned graphene sheet and temporary protective portions of the gold layer not etched away during the patterning of the graphene sheet into a graphene-based device, wherein the packaging comprises epoxy curing,,,; and removing, after packaging the graphene-based device, the temporary protective portions of gold layer by exposing the gold layer deposited to the surface of the graphene sheet to a nonacidic solution comprising potassium iodide. Currently amended
The method of claim 1, wherein the temporary protective portions of the gold layer are washed in the non-acidic solution comprising potassium iodide for a duration ranging from about 30 seconds to about 5 minutes. Currently amended
The method of claim 1, further comprising washing the graphene sheet with deionized water to remove any remaining particles or contaminants left on the patterned graphene sheet from the step of removing the gold layer. Currently amended
The method of claim 1, further comprising depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
2-6. Canceled
Canceled
A method for providing a temporary layer on a graphene sheet comprising: transferring a graphene sheet to a selected wafer; depositing a metal layer forming the temporary layer on the graphene sheet; patterning the graphene; packaging the patterned graphene sheet and the metal layer into a graphene-based device, wherein the packaging comprises epoxy curing,,,; [[and]] removing, after packaging the graphene-based device, the metal layer from the graphene sheet, wherein the metal layer comprises gold, ruthenium,,, silver,, iridium,; and wherein removing the metal layer comprises exposing the graphene sheet to a non-acidic solution. Currently amended
The method of claim 11, wherein the depositing the metal layer comprises applying an electron beam evaporation process. Original
The method of claim 11, wherein the depositing the metal layer comprises applying a focused ion beam process, a filament evaporation process, a sputter deposition process, or an electrolysis process. Original
The method of claim 11, wherein the removing the metal layer comprises washing the metal layer with a potassium iodide solution. Original
The method of claim 11, further comprising depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
Canceled
Canceled
A bio-sensor chip comprising: a graphene-based device with a patterned graphene portion protected from contamination or damage during packaging and assembly of the graphene-based device by a temporary protective metal layer that is removed from the patterned graphene portion after the packaging and the assembly of the graphene-based device; and one or more bottom electrodes spaced apart and disposed directly under the patterned graphene portion; wherein the graphene-based device is manufactured according to the following process steps: transferring a graphene sheet to a selected wafer; depositing a gold layer to a first surface of the graphene sheet by dipping the graphene sheet in a gold plating solution; patterning the graphene sheet by etching away areas of the gold layer and the graphene sheet corresponding to areas patterned in a photoresist layer using a lithography process; packaging the patterned graphene sheet and portions of the gold layer not etched away during the pattering of the graphene sheet into a graphene-based device, wherein the packaging comprises epoxy curing,,,; and removing, after packaging the graphene-based device, the gold layer by exposing the graphene sheet to a nonacidic solution. Currently amended
The bio-sensor of claim 20, wherein the depositing the gold layer comprises applying an electron beam evaporation process. Previously presented
The bio-sensor of claim 20, wherein the depositing the gold layer comprises applying a focused ion beam process, a filament evaporation process, a sputter deposition process, or an electrolysis process. Previously presented
The bio-sensor of claim 20, wherein the removing the gold layer comprises washing the gold layer with a potassium iodide solution. Previously presented
The bio-sensor of claim 20, wherein the graphene-based device is further manufactured by depositing a platinum layer on the selected wafer prior to packaging the graphene sheet. Currently amended
The bio-sensor of claim 20, wherein the portions of the temporary protective layer that were not etched away prior to patterning the graphene sheet remain deposited on the patterned graphene sheet while the graphene-based device is subjected to one or more assembly processes comprising wafer slicing. New
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based device
bio-sensor chip
Materials described outside the worked examples.
graphene sheet
potassium iodide solution
KI
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
gold temporary protective layer thickness range | 10–1000 | Au |
Thickness | 10–1000 nm |
Related documents with shared materials, methods, properties, or citations.
gold layer
Au
deionized water
platinum layer
Pt
inert metal layer (gold, ruthenium, silver, iridium)
ruthenium
Ru
rhodium
Rh
palladium
Pd
silver
Ag
osmium
Os
iridium
Ir
silicon substrate
Si
silicon dioxide substrate
SiO₂
| — |
Duration | 30–300 s | — |
Duration | 1–5 minutes | — |
Graphene Based Reversible Nano-Switch/Sensor Schottky Diode (nanoSSSD) Device
Methods of manufacturing and transferring larger-sized graphene
gold layer
Au
deionized water
platinum layer
Pt
inert metal layer (gold, ruthenium, silver, iridium)
ruthenium
Ru
rhodium
Rh
palladium
Pd
silver
Ag
osmium
Os
iridium
Ir
silicon substrate
Si
silicon dioxide substrate
SiO₂
| — |
Duration | 30–300 s | — |
Duration | 1–5 minutes | — |
Graphene Based Reversible Nano-Switch/Sensor Schottky Diode (nanoSSSD) Device
Methods of manufacturing and transferring larger-sized graphene
gold layer
Au
deionized water
platinum layer
Pt
inert metal layer (gold, ruthenium, silver, iridium)
ruthenium
Ru
rhodium
Rh
palladium
Pd
silver
Ag
osmium
Os
iridium
Ir
silicon substrate
Si
silicon dioxide substrate
SiO₂
| — |
Duration | 30–300 s | — |
Duration | 1–5 minutes | — |
Graphene Based Reversible Nano-Switch/Sensor Schottky Diode (nanoSSSD) Device
Methods of manufacturing and transferring larger-sized graphene
gold layer
Au
deionized water
platinum layer
Pt
inert metal layer (gold, ruthenium, silver, iridium)
ruthenium
Ru
rhodium
Rh
palladium
Pd
silver
Ag
osmium
Os
iridium
Ir
silicon substrate
Si
silicon dioxide substrate
SiO₂
| — |
Duration | 30–300 s | — |
Duration | 1–5 minutes | — |
Graphene Based Reversible Nano-Switch/Sensor Schottky Diode (nanoSSSD) Device