Patent
US 10,894,397No layer stack recorded.
pristine graphene
graphene oxide
reduced graphene oxide
graphene fluoride
graphene chloride
graphene bromide
graphene iodide
hydrogenated graphene
nitrogenated graphene
FIG. 4(C) Electrical conductivity data for the GO suspension-derived foam produced by the presently invented process and hydrothermally reduced GO graphene …
durability, and good thermal conductivity (for fast heat dissipation). The 3D network of interconnected graphene sheets or planes provides the needed high elasticity, high strength, high thermal conductivity, high yield strength, and improved thermal stability
inter-plane spacing d002 | 0.3354–0.36 | graphene foam |
thermal conductivity per unit specific gravity (300-1500°C treatment) | ≥ 250 | graphene foam |
electrical conductivity per unit specific gravity (300-1500°C treatment) | ≥ 2500 | graphene foam |
thermal conductivity per unit specific gravity (1500-2100°C treatment) | ≥ 300 | graphene foam |
electrical conductivity per unit specific gravity (1500-2100°C treatment) | ≥ 3000 | graphene foam |
thermal conductivity per unit specific gravity (>2100°C treatment) | ≥ 350 | graphene foam |
electrical conductivity per unit specific gravity (>2100°C treatment) | ≥ 3500 | graphene foam |
Temperature | 1500–2500 °C | — |
Thickness | 100–100000000 nm | — |
Thickness | 10–10000000 nm | — |
Duration | 30–120 s | — |
Temperature | 80–300 °C | — |
Duration | 15–120 s | — |
Thickness | 1–10 mm | — |
Duration | 900–7200 s | — |
Thickness | 0.1–50 mm | — |
Temperature | 50–1500 °C | — |
Duration | 0.2–1 hour | — |
Temperature | 130–230 °C | — |
Duration | 0.5–5 hours | — |
Duration | 48–72 hours | — |
— | 250–500 W | — |
Thickness | 0.6–1.1 nm | — |
Temperature | 800–1000 °C | — |
Temperature | 200–400 °C | — |
Temperature | 150–250 °C | — |
Temperature | 80–1500 °C | — |
Thickness | 0.6–1.2 nm | — |
Duration | 1–4 hours | — |
Duration | 1–2 hours | — |
Duration | 0.5–2 hours | — |
Temperature | 800–1050 °C | — |
Temperature | 180–300 °C | — |
Duration | 12–36 hours | — |
Duration | 5–16 hours | — |
Temperature | 80–350 °C | — |
Duration | 1–8 hours | — |
Temperature | 1500–2850 °C | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–5 hours | — |
Duration | 1–10 hours | — |
Thickness | 2–50 nm | — |
Temperature | 200–350 °C | — |
Temperature | 3000–3250 °C | — |
Thickness | ≤ 10 nm | — |
Thickness | ≤ 2 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 0.344 nm | — |
Pressure | ≤ 1 torr | — |
Thickness | ≤ 0.4 nm | — |
Temperature | ≥ 2100 °C | — |
Temperature | ≥ 2500 °C | — |
Temperature | ≥ 80 °C | — |
Temperature | ≥ 300 °C | — |
— | ≥ 350 W | — |
— | ≥ 400 W | — |
Thickness | ≥ 20 nm | — |
Thickness | ≥ 1 nm | — |
Duration | ≥ 15 minutes | — |
Temperature | 50–3200 °C | — |
Thickness | 0.3354–0.36 nm | — |
Temperature | 300–1500 °C | — |
Temperature | 1500–2100 °C | — |
Temperature | 2100–3200 °C | — |
Thickness | ≤ 0.35 nm | — |
Thickness | ≤ 0.34 nm | — |
Thickness | ≤ 0.336 nm | — |
Thickness | ≤ 0.337 nm | — |
— | ≥ 250 W | — |
— | ≥ 300 W | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 0.337–0.4 nm | — |
Thickness | 1–200 nm | — |
Thickness | 1–100 nm | — |
Thickness | 1–40 nm | — |
Thickness | 1–30 nm | — |
Thickness | 2–25 nm | — |
Temperature | 1500–3200 °C | — |
Thickness | ≤ 20 nm | — |
Thickness | ≤ 40 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 500 nm | — |
Duration | ≥ 1 hour | — |
— | ≥ 150 W | — |
— | ≥ 200 W | — |
No layer stack recorded.
pristine graphene
graphene oxide
reduced graphene oxide
graphene fluoride
graphene chloride
graphene bromide
graphene iodide
hydrogenated graphene
nitrogenated graphene
FIG. 4(C) Electrical conductivity data for the GO suspension-derived foam produced by the presently invented process and hydrothermally reduced GO graphene …
durability, and good thermal conductivity (for fast heat dissipation). The 3D network of interconnected graphene sheets or planes provides the needed high elasticity, high strength, high thermal conductivity, high yield strength, and improved thermal stability
inter-plane spacing d002 | 0.3354–0.36 | graphene foam |
thermal conductivity per unit specific gravity (300-1500°C treatment) | ≥ 250 | graphene foam |
electrical conductivity per unit specific gravity (300-1500°C treatment) | ≥ 2500 | graphene foam |
thermal conductivity per unit specific gravity (1500-2100°C treatment) | ≥ 300 | graphene foam |
electrical conductivity per unit specific gravity (1500-2100°C treatment) | ≥ 3000 | graphene foam |
thermal conductivity per unit specific gravity (>2100°C treatment) | ≥ 350 | graphene foam |
electrical conductivity per unit specific gravity (>2100°C treatment) | ≥ 3500 | graphene foam |
Temperature | 1500–2500 °C | — |
Thickness | 100–100000000 nm | — |
Thickness | 10–10000000 nm | — |
Duration | 30–120 s | — |
Temperature | 80–300 °C | — |
Duration | 15–120 s | — |
Thickness | 1–10 mm | — |
Duration | 900–7200 s | — |
Thickness | 0.1–50 mm | — |
Temperature | 50–1500 °C | — |
Duration | 0.2–1 hour | — |
Temperature | 130–230 °C | — |
Duration | 0.5–5 hours | — |
Duration | 48–72 hours | — |
— | 250–500 W | — |
Thickness | 0.6–1.1 nm | — |
Temperature | 800–1000 °C | — |
Temperature | 200–400 °C | — |
Temperature | 150–250 °C | — |
Temperature | 80–1500 °C | — |
Thickness | 0.6–1.2 nm | — |
Duration | 1–4 hours | — |
Duration | 1–2 hours | — |
Duration | 0.5–2 hours | — |
Temperature | 800–1050 °C | — |
Temperature | 180–300 °C | — |
Duration | 12–36 hours | — |
Duration | 5–16 hours | — |
Temperature | 80–350 °C | — |
Duration | 1–8 hours | — |
Temperature | 1500–2850 °C | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–5 hours | — |
Duration | 1–10 hours | — |
Thickness | 2–50 nm | — |
Temperature | 200–350 °C | — |
Temperature | 3000–3250 °C | — |
Thickness | ≤ 10 nm | — |
Thickness | ≤ 2 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 0.344 nm | — |
Pressure | ≤ 1 torr | — |
Thickness | ≤ 0.4 nm | — |
Temperature | ≥ 2100 °C | — |
Temperature | ≥ 2500 °C | — |
Temperature | ≥ 80 °C | — |
Temperature | ≥ 300 °C | — |
— | ≥ 350 W | — |
— | ≥ 400 W | — |
Thickness | ≥ 20 nm | — |
Thickness | ≥ 1 nm | — |
Duration | ≥ 15 minutes | — |
Temperature | 50–3200 °C | — |
Thickness | 0.3354–0.36 nm | — |
Temperature | 300–1500 °C | — |
Temperature | 1500–2100 °C | — |
Temperature | 2100–3200 °C | — |
Thickness | ≤ 0.35 nm | — |
Thickness | ≤ 0.34 nm | — |
Thickness | ≤ 0.336 nm | — |
Thickness | ≤ 0.337 nm | — |
— | ≥ 250 W | — |
— | ≥ 300 W | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 0.337–0.4 nm | — |
Thickness | 1–200 nm | — |
Thickness | 1–100 nm | — |
Thickness | 1–40 nm | — |
Thickness | 1–30 nm | — |
Thickness | 2–25 nm | — |
Temperature | 1500–3200 °C | — |
Thickness | ≤ 20 nm | — |
Thickness | ≤ 40 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 500 nm | — |
Duration | ≥ 1 hour | — |
— | ≥ 150 W | — |
— | ≥ 200 W | — |
No layer stack recorded.
pristine graphene
graphene oxide
reduced graphene oxide
graphene fluoride
graphene chloride
graphene bromide
graphene iodide
hydrogenated graphene
nitrogenated graphene
FIG. 4(C) Electrical conductivity data for the GO suspension-derived foam produced by the presently invented process and hydrothermally reduced GO graphene …
durability, and good thermal conductivity (for fast heat dissipation). The 3D network of interconnected graphene sheets or planes provides the needed high elasticity, high strength, high thermal conductivity, high yield strength, and improved thermal stability
inter-plane spacing d002 | 0.3354–0.36 | graphene foam |
thermal conductivity per unit specific gravity (300-1500°C treatment) | ≥ 250 | graphene foam |
electrical conductivity per unit specific gravity (300-1500°C treatment) | ≥ 2500 | graphene foam |
thermal conductivity per unit specific gravity (1500-2100°C treatment) | ≥ 300 | graphene foam |
electrical conductivity per unit specific gravity (1500-2100°C treatment) | ≥ 3000 | graphene foam |
thermal conductivity per unit specific gravity (>2100°C treatment) | ≥ 350 | graphene foam |
electrical conductivity per unit specific gravity (>2100°C treatment) | ≥ 3500 | graphene foam |
Temperature | 1500–2500 °C | — |
Thickness | 100–100000000 nm | — |
Thickness | 10–10000000 nm | — |
Duration | 30–120 s | — |
Temperature | 80–300 °C | — |
Duration | 15–120 s | — |
Thickness | 1–10 mm | — |
Duration | 900–7200 s | — |
Thickness | 0.1–50 mm | — |
Temperature | 50–1500 °C | — |
Duration | 0.2–1 hour | — |
Temperature | 130–230 °C | — |
Duration | 0.5–5 hours | — |
Duration | 48–72 hours | — |
— | 250–500 W | — |
Thickness | 0.6–1.1 nm | — |
Temperature | 800–1000 °C | — |
Temperature | 200–400 °C | — |
Temperature | 150–250 °C | — |
Temperature | 80–1500 °C | — |
Thickness | 0.6–1.2 nm | — |
Duration | 1–4 hours | — |
Duration | 1–2 hours | — |
Duration | 0.5–2 hours | — |
Temperature | 800–1050 °C | — |
Temperature | 180–300 °C | — |
Duration | 12–36 hours | — |
Duration | 5–16 hours | — |
Temperature | 80–350 °C | — |
Duration | 1–8 hours | — |
Temperature | 1500–2850 °C | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–5 hours | — |
Duration | 1–10 hours | — |
Thickness | 2–50 nm | — |
Temperature | 200–350 °C | — |
Temperature | 3000–3250 °C | — |
Thickness | ≤ 10 nm | — |
Thickness | ≤ 2 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 0.344 nm | — |
Pressure | ≤ 1 torr | — |
Thickness | ≤ 0.4 nm | — |
Temperature | ≥ 2100 °C | — |
Temperature | ≥ 2500 °C | — |
Temperature | ≥ 80 °C | — |
Temperature | ≥ 300 °C | — |
— | ≥ 350 W | — |
— | ≥ 400 W | — |
Thickness | ≥ 20 nm | — |
Thickness | ≥ 1 nm | — |
Duration | ≥ 15 minutes | — |
Temperature | 50–3200 °C | — |
Thickness | 0.3354–0.36 nm | — |
Temperature | 300–1500 °C | — |
Temperature | 1500–2100 °C | — |
Temperature | 2100–3200 °C | — |
Thickness | ≤ 0.35 nm | — |
Thickness | ≤ 0.34 nm | — |
Thickness | ≤ 0.336 nm | — |
Thickness | ≤ 0.337 nm | — |
— | ≥ 250 W | — |
— | ≥ 300 W | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 0.337–0.4 nm | — |
Thickness | 1–200 nm | — |
Thickness | 1–100 nm | — |
Thickness | 1–40 nm | — |
Thickness | 1–30 nm | — |
Thickness | 2–25 nm | — |
Temperature | 1500–3200 °C | — |
Thickness | ≤ 20 nm | — |
Thickness | ≤ 40 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 500 nm | — |
Duration | ≥ 1 hour | — |
— | ≥ 150 W | — |
— | ≥ 200 W | — |
No layer stack recorded.
pristine graphene
graphene oxide
reduced graphene oxide
graphene fluoride
graphene chloride
graphene bromide
graphene iodide
hydrogenated graphene
nitrogenated graphene
FIG. 4(C) Electrical conductivity data for the GO suspension-derived foam produced by the presently invented process and hydrothermally reduced GO graphene …
durability, and good thermal conductivity (for fast heat dissipation). The 3D network of interconnected graphene sheets or planes provides the needed high elasticity, high strength, high thermal conductivity, high yield strength, and improved thermal stability
inter-plane spacing d002 | 0.3354–0.36 | graphene foam |
thermal conductivity per unit specific gravity (300-1500°C treatment) | ≥ 250 | graphene foam |
electrical conductivity per unit specific gravity (300-1500°C treatment) | ≥ 2500 | graphene foam |
thermal conductivity per unit specific gravity (1500-2100°C treatment) | ≥ 300 | graphene foam |
electrical conductivity per unit specific gravity (1500-2100°C treatment) | ≥ 3000 | graphene foam |
thermal conductivity per unit specific gravity (>2100°C treatment) | ≥ 350 | graphene foam |
electrical conductivity per unit specific gravity (>2100°C treatment) | ≥ 3500 | graphene foam |
Temperature | 1500–2500 °C | — |
Thickness | 100–100000000 nm | — |
Thickness | 10–10000000 nm | — |
Duration | 30–120 s | — |
Temperature | 80–300 °C | — |
Duration | 15–120 s | — |
Thickness | 1–10 mm | — |
Duration | 900–7200 s | — |
Thickness | 0.1–50 mm | — |
Temperature | 50–1500 °C | — |
Duration | 0.2–1 hour | — |
Temperature | 130–230 °C | — |
Duration | 0.5–5 hours | — |
Duration | 48–72 hours | — |
— | 250–500 W | — |
Thickness | 0.6–1.1 nm | — |
Temperature | 800–1000 °C | — |
Temperature | 200–400 °C | — |
Temperature | 150–250 °C | — |
Temperature | 80–1500 °C | — |
Thickness | 0.6–1.2 nm | — |
Duration | 1–4 hours | — |
Duration | 1–2 hours | — |
Duration | 0.5–2 hours | — |
Temperature | 800–1050 °C | — |
Temperature | 180–300 °C | — |
Duration | 12–36 hours | — |
Duration | 5–16 hours | — |
Temperature | 80–350 °C | — |
Duration | 1–8 hours | — |
Temperature | 1500–2850 °C | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–5 hours | — |
Duration | 1–10 hours | — |
Thickness | 2–50 nm | — |
Temperature | 200–350 °C | — |
Temperature | 3000–3250 °C | — |
Thickness | ≤ 10 nm | — |
Thickness | ≤ 2 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 0.344 nm | — |
Pressure | ≤ 1 torr | — |
Thickness | ≤ 0.4 nm | — |
Temperature | ≥ 2100 °C | — |
Temperature | ≥ 2500 °C | — |
Temperature | ≥ 80 °C | — |
Temperature | ≥ 300 °C | — |
— | ≥ 350 W | — |
— | ≥ 400 W | — |
Thickness | ≥ 20 nm | — |
Thickness | ≥ 1 nm | — |
Duration | ≥ 15 minutes | — |
Temperature | 50–3200 °C | — |
Thickness | 0.3354–0.36 nm | — |
Temperature | 300–1500 °C | — |
Temperature | 1500–2100 °C | — |
Temperature | 2100–3200 °C | — |
Thickness | ≤ 0.35 nm | — |
Thickness | ≤ 0.34 nm | — |
Thickness | ≤ 0.336 nm | — |
Thickness | ≤ 0.337 nm | — |
— | ≥ 250 W | — |
— | ≥ 300 W | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 0.337–0.4 nm | — |
Thickness | 1–200 nm | — |
Thickness | 1–100 nm | — |
Thickness | 1–40 nm | — |
Thickness | 1–30 nm | — |
Thickness | 2–25 nm | — |
Temperature | 1500–3200 °C | — |
Thickness | ≤ 20 nm | — |
Thickness | ≤ 40 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 500 nm | — |
Duration | ≥ 1 hour | — |
— | ≥ 150 W | — |
— | ≥ 200 W | — |