Patent
US 8,679,976carbon-containing gas
substrate material
GeH₄
GeCl₄
CH₄
C₂H₂
C₂H₄
CO
| 10–60 minutes |
| — |
Thickness | 100–10000 nm | — |
carbon-containing gas
substrate material
GeH₄
GeCl₄
CH₄
C₂H₂
C₂H₄
CO
| 10–60 minutes |
| — |
Thickness | 100–10000 nm | — |
carbon-containing gas
substrate material
GeH₄
GeCl₄
CH₄
C₂H₂
C₂H₄
CO
| 10–60 minutes |
| — |
Thickness | 100–10000 nm | — |
carbon-containing gas
substrate material
GeH₄
GeCl₄
CH₄
C₂H₂
C₂H₄
CO
| 10–60 minutes |
| — |
Thickness | 100–10000 nm | — |