Patent
US 9,565,642silicon carbide substrate
SiC
| >27 % |
| — |
gain (claim 3) | >34 dB | — |
peak output power (claim 4) | ~37 dBm | — |
die size (claim 8) | <1.5 x 0.9 mm x mm | — |
gain (claim 15) | >32 dB | — |
Thickness | ≤ 1.5 mm | — |
silicon carbide substrate
SiC
| >27 % |
| — |
gain (claim 3) | >34 dB | — |
peak output power (claim 4) | ~37 dBm | — |
die size (claim 8) | <1.5 x 0.9 mm x mm | — |
gain (claim 15) | >32 dB | — |
Thickness | ≤ 1.5 mm | — |
silicon carbide substrate
SiC
| >27 % |
| — |
gain (claim 3) | >34 dB | — |
peak output power (claim 4) | ~37 dBm | — |
die size (claim 8) | <1.5 x 0.9 mm x mm | — |
gain (claim 15) | >32 dB | — |
Thickness | ≤ 1.5 mm | — |
silicon carbide substrate
SiC
| >27 % |
| — |
gain (claim 3) | >34 dB | — |
peak output power (claim 4) | ~37 dBm | — |
die size (claim 8) | <1.5 x 0.9 mm x mm | — |
gain (claim 15) | >32 dB | — |
Thickness | ≤ 1.5 mm | — |